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Co-evolution of vacancies and solute clusters during artificial ageing of Al-Mg-Si alloys

Mazen Madanat, Meng Liu, Xingpu Zhang, Qianning Guo, Jakub Čížek, and John Banhart
Phys. Rev. Materials 4, 063608 – Published 26 June 2020
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Abstract

Al-Mg-Si alloys with total solute contents ranging from 0.8 to 1.4 wt % were solutionized, quenched, and then artificially aged (AA) at 180C, after which positron annihilation lifetime spectroscopy was applied to obtain information about precipitation and vacancy evolution during the preceding ageing step. Hardness and electrical resistivity measurements were carried out to complement these measurements. AA was carried out in four different heating media, which allowed for varying the average heating rate from 2.4 to 170Ks1. The main result of the study is that there is a competition between vacancy losses and precipitation. Any precipitation taking place during quenching or during heating to the AA temperature helps to prevent vacancies from going to sinks and allows them to assist in solute clustering. Higher solute content, slower heating to 180C, and natural preageing before AA were found to have a comparable effect.

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  • Received 17 January 2020
  • Accepted 15 May 2020

DOI:https://doi.org/10.1103/PhysRevMaterials.4.063608

Published by the American Physical Society under the terms of the Creative Commons Attribution 4.0 International license. Further distribution of this work must maintain attribution to the author(s) and the published article's title, journal citation, and DOI.

Published by the American Physical Society

Physics Subject Headings (PhySH)

Condensed Matter, Materials & Applied Physics

Authors & Affiliations

Mazen Madanat1, Meng Liu1,2,*, Xingpu Zhang1, Qianning Guo1, Jakub Čížek3, and John Banhart1,2

  • 1Technische Universität Berlin, Hardenbergstraße 36, D-10623 Berlin, Germany
  • 2Helmholtz Zentrum Berlin, Hahn-Meitner-Platz 1, D-14109 Berlin, Germany
  • 3Charles University, V Holešovičkách 2, 18000 Praha 8, Czech Republic

  • *Present address: Chinalco Materials Application Research Institute Co., Ltd., Beijing, China; Corresponding author: liumeng@ cmari.com

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Issue

Vol. 4, Iss. 6 — June 2020

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