Skip to main content
SpringerLink
Log in

Thermal Expandometer: A Device for Monitoring In-situ Foam Filling of Hollow Profiles Processed Through Powder Metallurgy

  • Original Article
  • Published:
Transactions of the Indian Institute of Metals Aims and scope Submit manuscript

Abstract

Monitoring foam expansion and the study of foaming kinetics during in-situ foam filling are essential to ensure a desirable quality of foam-filled profiles. In this current research, a novel technique is proposed for monitoring in-situ aluminum foam filling of hollow profiles. In this technique, instantaneous temperatures measured at various locations of the hollow profile being filled have been used to determine the foam expansion rate. Hence, the apparatus developed in this study is named as thermal expandometer. To demonstrate the usefulness of this thermal expandometer, aluminum foaming is performed inside a steel tube by heating the foaming precursor at different rates, and an analysis of the effect of heating rate on the foam expansion rate is presented.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4

Similar content being viewed by others

References

  1. García-Moreno F, Materials9 (2016) 20.

    Article  Google Scholar 

  2. Teng T L, Chang K C, and Nguyen T H, Tech Mech28 (2008) 268.

    Google Scholar 

  3. Strano M, Villa A, and Mussi V, J Mater Forum6 (2013) 153.

    Article  Google Scholar 

  4. Hanseen A G, Stobener K, Rausch G, Langseth M, and Keller H, Int J Crashworth11 (2006) 231.

    Article  Google Scholar 

  5. Hanssen A G, Langseth M, and Hopperstad O S, Int J Mech Sci43 (2001) 153.

    Article  Google Scholar 

  6. Bonaccorsi L, Proverbio E, and Raffaele N, J Mater Sci45 (2010) 1514.

    Article  CAS  Google Scholar 

  7. Li Z, Yu Q, Zhao X, Yu M, Shi P, and Yan C, Adv Mech Eng9 (2017) 1.

    Google Scholar 

  8. Monno M, Mussi V, Negri D, Zampori L, and Dotelli G, J Mater Sci Eng A3 (2013) 531.

    CAS  Google Scholar 

  9. García Moreno F, Fromme M, and Banhart J, Adv Eng Mater6 (2004) 416.

    Article  Google Scholar 

  10. Duarte I, and Ferreira J M F, Adv Eng Mater16 (2014) 33.

    Article  CAS  Google Scholar 

  11. Solórzano E, Antunes M, Saiz-Arroyo C, Rodríguez-Pérez M A, Velasco J I, and de Saja J A, J Appl Polym Sci125 (2012) 1059.

    Article  Google Scholar 

  12. Helwig H -M, Garcia-Moreno F, and Banhart J, J Mater Sci46 (2011) 5227.

    Article  CAS  Google Scholar 

  13. Kennedy A R, and Asavavisitchai S, Scr Mater50 (2004) 115.

    Article  CAS  Google Scholar 

  14. Duarte I, and Banhart J, Acta Mater48 (2000) 2349.

    Article  CAS  Google Scholar 

  15. Garcia-Moreno F, Raffaele N, Banhart J, in Cellular Metals for Structural and Functional Applications: CELLMET 2008, (ed) Stephani G, Fraunhofer-Institute IFAM, Bremen (2008), p 133.

    Google Scholar 

  16. Kaygısız Y, and Maras N, J Alloys Compd721 (2017) 764.

    Article  Google Scholar 

  17. Helwig H -M, and Banhart J, in Int Conf Cellular Metals: Manufacture, Properties and Applications, (2003)165

Download references

Acknowledgement

The authors would like to thank Biswaranjan Muduli for his help with X-ray tomography.

Funding

This research did not receive any specific grant from funding agencies in the public, commercial, or not-for-profit sectors.

Author information

Authors and Affiliations

  1. Department of Metallurgical and Materials Engineering, Indian Institute of Technology Madras, Chennai, 600036, India

    Venkat Chilla, G. D. Janaki Ram & M. Mukherjee

  2. Light Weight Metallic Materials Division, CSIR-Advanced Materials and Processes Research Institute, Bhopal, 462026, India

    Venkat Chilla & D. P. Mondal

Authors
  1. Venkat Chilla
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. D. P. Mondal
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. G. D. Janaki Ram
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. M. Mukherjee
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Venkat Chilla.

Additional information

Publisher's Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Electronic supplementary material

Below is the link to the electronic supplementary material.

Supplementary material 1 (DOCX 414 kb)

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Chilla, V., Mondal, D.P., Ram, G.D.J. et al. Thermal Expandometer: A Device for Monitoring In-situ Foam Filling of Hollow Profiles Processed Through Powder Metallurgy. Trans Indian Inst Met 73, 1837–1841 (2020). https://doi.org/10.1007/s12666-020-02000-z

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s12666-020-02000-z

Keywords

Search

Navigation