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Multiphysics simulation of paper curl due to moisture transport

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Abstract

The moisture transport at the fuser nip of printers is postulated to be the main reason for paper curls. However, the fundamental mechanisms of paper curling remain unclear. Observing the moisture transport inside a sheet of paper through experiments is difficult because moisture transport rapidly occurs in a micro-scale thickness. Therefore, developing a theoretical model is crucial to understand the mechanisms of paper curling and to control the curls. In this study, we proposed a multiphysics model that includes the moisture and heat transport and mechanical deformation. The elasticity, plasticity, viscosity, and expansion caused by moisture were considered in the mechanical model to describe the complex material characteristics of paper. The curvature of curls was calculated using an effective two-spring model. The mechanisms of curling in printers and the direction of curls were understood through finite element simulations. The proposed model can qualitatively predict the paper curls observed in experiments. The temperature- and moisture-dependent material properties of paper will be studied in the future to improve the proposed model.

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Acknowledgments

This work was supported by the research grant of HP, the National Research Foundation of Korea grant of the Korean government Ministry of Science and ICT (no. 2018R1A5A 7025522), and the research program of Dongguk University, 2020.

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Authors and Affiliations

  1. School of Mechanical Engineering, Hanyang University, Seoul, 04763, Korea

    Gil Ho Yoon

  2. HP Printing Korea Co., Ltd, Seongnam, 13529, Korea

    Byoungho Yoo, Woon Kyung Kim, Junseong Woo & Taehan Kim

  3. Department of Mechanical, Robotics, and Energy Engineering, Dongguk University, Seoul, 04620, Korea

    Seungjun Lee

Authors
  1. Gil Ho Yoon
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  2. Byoungho Yoo
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  3. Woon Kyung Kim
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  4. Junseong Woo
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  5. Taehan Kim
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  6. Seungjun Lee
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Corresponding author

Correspondence to Seungjun Lee.

Additional information

Recommended by Editor Seungjae Min

Gil Ho Yoon received his B.S., M.S., and Ph.D. degrees in Mechanical and Aerospace Engineering from Seoul National University in 1998, 2000, and 2004, respectively. He currently serves as a Professor at the School of Mechanical Engineering in Hanyang University, Seoul, Republic of Korea.

Taehan Kim leads the mechanical simulation team of HP Printing Korea (formerly Printing Solution Business at Samsung Electronics). He has worked at the automotive and printing industry for more than 20 years. His current research interests include modeling and analyzing the multidisciplinary area of printing system, including multiphysics simulation. He received his Ph.D. in aeronautics and astronautics with specialization in composite structures from Stanford University.

Byoungho Yoo received his B.S. and M.S. degrees in naval ocean engineering from Seoul National University in 1996. He has worked on mechanical computer-aided engineering, including vibration and paper path dynamics, at Samsung Electronics Printing Division and at HP since 2017.

Woon Kyung Kim is a Senior Research Engineer of the mechanical simulation team at HP Printing Korea, Pangyo, Korea. He received his Ph.D. degree in mechanical engineering from Virginia Tech, Virginia, USA, with specialization on smart material systems and structures. His research interests include multifunctional composite structure analysis, dynamic simulation, and optimization design of laser printing systems.

Junseong Woo is a Senior Research Engineer of the CAE team at HP Printing Korea, Pangyo, Korea. He received his M.S. degree in mechanical engineering from Ajou University, Korea, with specialization on structural fatigue of multi-body systems. His research interests include paper behavior and dynamic simulation of printer units for improving image defects.

Seungjun Lee is an Assistant Professor of Mechanical, Robotics, and Energy Engineering at Dongguk University, Seoul, Korea. He received his B.S. degree in naval architecture and ocean engineering from Seoul National University and his M.S. and Ph.D. degrees in mechanical engineering from the University of Michigan, Ann Arbor, Michigan, USA. His research interest includes multi-scale simulations and mechanical behavior at nano/microscales.

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Yoon, G.H., Yoo, B., Kim, W.K. et al. Multiphysics simulation of paper curl due to moisture transport. J Mech Sci Technol 34, 2075–2083 (2020). https://doi.org/10.1007/s12206-020-0429-4

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  • DOI: https://doi.org/10.1007/s12206-020-0429-4

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