Surface formation mechanism in ultraprecision diamond turning of coarse-grained polycrystalline ZnSe

https://doi.org/10.1016/j.ijmachtools.2020.103554Get rights and content

Highlights

  • Two kinds of surface defects occur due to the plowing and tearing effects of a tool.

  • A large nose radius tool with a zero rake angle is effective for complete ductile machining.

  • Grain boundary step forms when a tool passes cross a twin boundary at a large angle.

  • Cutting chips undergo a zinc-blende to cinnabar phase transformation and metallization.

  • A smooth surface of 1.5 nm Sa without detectable defect is achieved.

Abstract

Zinc selenide is an excellent infrared optical material. In this study, ultraprecision diamond turning experiments were carried out on coarse-grained polycrystalline ZnSe (p-ZnSe) under various conditions and the corresponding surface formation mechanisms were investigated by examining the surface topography, chip morphology, material microstructural change, and cutting forces. Two kinds of surface defects were observed (i.e. plowing-induced micron-scale cleavage craters and tearing-induced submicron-scale tearing pits). It was determined that plowing induced micron-scale cleavage craters could be suppressed by reducing undeformed chip thickness. Furthermore, it was ascertained that tearing-induced submicron-scale tearing pits could be restrained by using a cutting tool with a zero rake angle. The minimal surface roughness was dominated by grain boundary steps formed when the cutting tool crossed twin boundaries at a large angle. A model was proposed for correlating surface defects and boundary steps with crystal orientations and cutting directions. By using a large-nose diamond tool for cutting, a smooth surface of 1.5 nm Sa was obtained. In addition, a zinc blende to cinnabar phase transformation was observed in the cutting chips, and metallization of cutting chips occurred at an extremely small undeformed chip thickness (~20 nm). Moreover, it was discovered that phase transformation inside the workpiece depends on the radius of the tool nose. The findings of this study provide an important reference for ultraprecision machining of brittle polycrystalline materials.

Introduction

Zinc selenide (ZnSe) is a striking infrared optical material because of its high transmissibility at infrared wavelengths [1,2], hence, it is often used in windows of high power CO2 lasers [3,4] and lenses for night vision systems of cars with autopilot, among others. ZnSe has a relatively low hardness quality [5], but it has a high brittleness quality [6], making it very difficult to be machined. The conventional method for creating optical surfaces with ZnSe is chemo-mechanical polishing [7,8]. However, the polishing efficiency thereof is low. Besides, it is also difficult to polish complex surfaces with high accuracy. As an alternative, ultraprecision diamond turning has been proposed as a promising solution for crafting complex shapes with high surface integrity [9].

While the existing research on single-crystalline materials has been extensive, those on polycrystalline materials are relatively few. In diamond turning of reaction-bonded silicon carbide [10], a super hard polycrystalline composite material, grain dislodgement became a major reason for surface roughness. In diamond turning of polycrystalline titanium [11], a low elastic modulus metal material with low thermal conductivity, it was found that the cracks could spread along the boundaries of large grains. In diamond turning of polycrystalline copper [12], a soft and ductile metal material, it was determined that surface crack patterns were less likely to occur. However, polycrystalline ZnSe, a soft and brittle material with different mechanical properties from the aforementioned polycrystalline materials, may result in a distinct difference in terms of the cutting mechanism. Zong et al. [9] studied oblique diamond turning of polycrystalline zinc sulfide (ZnS), whose mechanical property is, to some extent, similar to polycrystalline ZnSe, albeit less brittle than the latter, potentially causing different machinability, whether it be microscale or nanoscale.

For ultraprecision diamond turning of ZnSe, several studies have been conducted. Fang et al. [13] conducted diamond turning experiments on ZnSe (crystal structure unknown) and achieved nanometric surface finishes by using a zero rake angle tool. They mentioned that fractures would occur when a highly negative rake tool is used, however, they failed to clarify their reason for such. Shojaee et al. [14] investigated the effects of cutting parameters on residual stress as well as the crystal quality of a machined surface in diamond turning of polycrystalline ZnSe (p-ZnSe). They found that certain grains or twins exhibit signs of fracture, but the relationship between the fracture and the crystallographic orientation was not characterised. Li et al. [15] investigated the ultraprecision diamond turning capability of physical vapour deposited p-ZnSe on a smooth surface which met the requirement for the infrared optical image systems. They found that the intended result was achieved by setting low feed rates and depths of cuts. However, even the fine finished surface still had some defects, with the formation mechanism of which kept unrevealed. Xiao et al. [16] conducted plunge-cutting experiments of p-ZnSe whose grain size was at the submicron level. They reported that grain dislodgement dominated the surface formation and that a larger brittle-ductile transition depth could be realised by using a tool with a highly negative rake angle or a large nose radius. It should be noted that the effect of the rake angle reported by Xiao et al. [16] is exactly contrary to that reported by Fang et al. [13]. The reason might be that the workpieces used in those studies had different crystal structures, leading to different material removal mechanisms. However, the relationship between ultraprecision machinability and workpiece crystal structure has not been well-understood. Moreover, it is inferred that the machining-induced changes of the crystal structure (i.e. phase transformation) might have significant effects on the material machinability. However, up to date, there has not been any systematic study on the phase transformation of ZnSe in diamond turning.

Currently, ZnSe windows used for infrared systems are mostly p-ZnSe due to its low production cost, the grain size of which being a few tens or hundreds of microns [15,17], far larger than that used in the study of Xiao et al. [16]. For coarse-grained polycrystalline materials, grain dislodgment may be suppressed, but grain boundary step (i.e. a height difference between two adjoining crystal grains appearing at their common border due to the crystallographic effect in the material property) is a critical factor of surface roughness [18,19]. Nevertheless, the relationship between the formation of grain boundary step with cutting conditions is still unclear. The grain boundary step may result from the different elastic recovery of grains following tool pass [20,21] or anisotropic plasticity dominated by dislocation slip and grain boundary accommodation, as shown by finite element simulations [22,23]. Liu et al. [24], through a molecular dynamics simulation, concluded that sub-grains with transitional crystal orientations could be formed at the grain boundary through the plowing of the cutting edge and crystal rotation. The misalignment in the slip directions between sub-grains and original grains resulted in the grain boundary step. However, these arguments have not yet been verified by experimental studies.

In this study, ultraprecision diamond turning tests were performed on coarse-grained p-ZnSe. The mechanisms of surface defects generation, phase transformation, and grain boundary step formation, for the tool nose radius, cutting conditions, and crystallographic orientation, were systematically investigated. The phase transformation behaviours in both the machined surface and the cutting chips were identified and compared. Finally, a smooth surface without detectable defects was realised by optimising the cutting conditions. The findings of this study provide insights into the fundamental physics of machining brittle polycrystalline material.

Section snippets

Material

Chemical vapour deposited (CVD) ZnSe cylinders, 25 mm in diameter and 3 mm in thickness, were used as workpieces. According to the material manufacturer, the grain size ranged from 20 to 100 μm. The microstructure distributions of the workpieces were detected using an electron backscatter diffraction (EBSD) detector, from EDAX Inc., equipped on a field emission scanning electron microscope (FE-SEM, GeminiSEM 500, ZEISS). Fig. 1(a) shows the inverse pole figure (IPF) map of the workpieces. Many

Surface topography

Four regions were machined under four different conditions: (i) f = 1 μm/rev, α = 0°; (ii) f = 2 μm/rev, α = 0°; (iii) f = 1 μm/rev, α = −20°; (iv) f = 2 μm/rev, α = −20°. A typical cross-section profile of a groove machined under condition (i) is shown in Fig. 4(a). Fig. 4(b) shows the depth of each groove. It can be noted in Fig. 4(b) that the depths of all grooves are deeper than the set depth of cut, possibly because of the tool-workpiece alignment error. Since it is an insignificant

Surface roughness

Fig. 17(a) and (b) are SEM images randomly captured on a machined surface using the R10 tool, which presented no surface defects. Thereafter, a 3D topography of the machined surface was measured in a field of 160 × 160 μm2 using a white light interferometer, as shown in Fig. 18(a) and (b). The standard roughness parameters of the measured surface were defined by mean roughness (Sa), root mean square of roughness (Sq), and the maximum height of the profile (Sz). The Sa, Sq, and Sz of the surface

Conclusions

Ultraprecision diamond turning of polycrystalline ZnSe was conducted and the mechanisms for surface defect formation, phase transformation, chip formation, and grain boundary step formation were investigated. The major conclusions are summarised as follows:

  • (1)

    Unlike the machining of polycrystalline hard brittle ceramics and polycrystalline metals, no trans grain cracks nor grain dislodgements manifested in ultraprecision diamond turning of coarse-grained p-ZnSe. The surface defects arose within

CRediT authorship contribution statement

Weihai Huang: Data curation, Investigation, Writing - original draft. Jiwang Yan: Conceptualization, Methodology, Supervision, Writing - review & editing.

Declaration of competing interest

The authors declare that they have no known competing financial interests or personal relationships that could have appeared to influence the work reported in this paper.

Acknowledgements

This work has been partially supported by Keio University Doctorate Student Grant-in-Aid Program. Thanks are extended to Mrs. Sachiko Kamiyama of Central Testing Center, Keio University for her assistance of SEM and EBSD observations.

References (61)

  • N.A. Sakharova et al.

    Comparison between Berkovich, Vickers and conical indentation tests: a three-dimensional numerical simulation study

    Int. J. Solid Struct.

    (2009)
  • T. Zhang et al.

    A method to determine fracture toughness using cube-corner indentation

    Scripta Mater.

    (2010)
  • S. Son et al.

    The effect of vibration cutting on minimum cutting thickness

    Int. J. Mach. Tool Manufact.

    (2006)
  • M.Q. Jiang et al.

    Formation mechanism of lamellar chips during machining of bulk metallic glass

    Acta Mater.

    (2009)
  • S. Ning et al.

    Fabrication, structure and optical application of Fe2+:ZnSe nanocrystalline film

    Opt. Mater.

    (2019)
  • L.D. Yao et al.

    Structural stability and Raman scattering of ZnSe nanoribbons under high pressure

    J. Alloys Compd.

    (2009)
  • M. Mukaida et al.

    Ductile machining of single-crystal silicon for microlens arrays by ultraprecision diamond turning using a slow tool servo

    Int. J. Mach. Tool Manufact.

    (2017)
  • J. Yan et al.

    Nondestructive measurement of machining-induced amorphous layers in single-crystal silicon by laser micro-Raman spectroscopy

    Precis. Eng.

    (2008)
  • Z. Zhao et al.

    A theoretical and experimental investigation of cutting forces and spring back behaviour of Ti6Al4V alloy in ultraprecision machining of microgrooves

    Int. J. Mech. Sci.

    (2020)
  • M. Günay et al.

    Investigation of the effect of rake angle on main cutting force

    Int. J. Mach. Tool Manufact.

    (2004)
  • J. Yan et al.

    Fundamental investigation of subsurface damage in single crystalline silicon caused by diamond machining

    Precis. Eng.

    (2009)
  • M. Wan et al.

    On material separation and cutting force prediction in micro milling through involving the effect of dead metal zone

    Int. J. Mach. Tool Manufact.

    (2019)
  • F.Z. Fang et al.

    A study on mechanism of nano-cutting single crystal silicon

    J. Mater. Process. Technol.

    (2007)
  • S.M. Son et al.

    Effects of the friction coefficient on the minimum cutting thickness in micro cutting

    Int. J. Mach. Tool Manufact.

    (2005)
  • F.Z. Fang et al.

    Modelling and experimental investigation on nanometric cutting of monocrystalline silicon

    Int. J. Mach. Tool Manufact.

    (2005)
  • J. Yan et al.

    Ductile regime turning at large tool feed

    J. Mater. Process. Technol.

    (2002)
  • A. Mir et al.

    The investigation of influence of tool wear on ductile to brittle transition in single point diamond turning of silicon

    Wear

    (2016)
  • M. Dao et al.

    Strength, strain-rate sensitivity and ductility of copper with nanoscale twins

    Acta Mater.

    (2006)
  • C.J. Shute et al.

    Microstructural stability during cyclic loading of multilayer copper/copper samples with nanoscale twinning

    Scripta Mater.

    (2009)
  • J. Li et al.

    A molecular dynamics investigation into plastic deformation mechanism of nanocrystalline copper for different nanoscratching rates

    Comput. Mater. Sci.

    (2016)
  • Cited by (40)

    • Material removal behavior analysis of ZnSe crystal during side-forward nanoscratching

      2023, International Journal of Mechanical Sciences
      Citation Excerpt :

      However, this is still very challenging due to the high brittleness, low hardness, low fracture toughness, and grain anisotropy of ZnSe crystal [7,8]. For example, surface defects such as micron-scale cleavage craters, submicrometer-scale tearing pits easily occur in ultra-precision diamond turning of ZnSe crystal, which seriously reduce the service performance of ZnSe crystal [9,10]. To achieve a high-quality machined surface, it is essential to investigate the material removal behavior and mechanism in ultra-precision machining of ZnSe crystal.

    • What micro-mechanical testing can reveal about machining processes

      2022, International Journal of Machine Tools and Manufacture
    View all citing articles on Scopus
    View full text