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Pressure-Assisted Sinter-Bonding Characteristics at 250 °C in Air Using Bimodal Ag-Coated Cu Particles

  • Original Article - Theory, Characterization and Modeling
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Abstract

To achieve bondlines with improved heat resistance and thermal conductance during operation, pressure-assisted sinter-bonding was performed in air with bimodal Ag-coated Cu particles for die attachment of the next-generation power devices composed of SiC. The bonding temperature and pressure were 250 °C and 10  MPa, respectively, and the sizes of the bimodal particles were 2 µm and 350 nm. After a short bonding time of 10 min, a paste with a 6:4 mixing ratio showed an average shear strength of > 20 MPa. The dewetting of Ag shells on the particles and void filling by the 350 nm particles induced rapid sintering.

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Acknowledgements

This research was supported by the Commercialization Promotion Agency for R&D Outcomes (COMPA) funded by the Ministry of Science and ICT (MSIT) [Optimization of fabrication processes for the mass production of Ag-coated Cu powder of average size 1.4 m and 400 nm and evaluation of the application properties].

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  1. Department of Materials Science and Engineering, Seoul National University of Science and Technology, 232 Gongneung-ro, Nowon-gu, Seoul, 01811, Republic of Korea

    Sung Yoon Kim, Myeong In Kim & Jong-Hyun Lee

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  1. Sung Yoon Kim
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  2. Myeong In Kim
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  3. Jong-Hyun Lee
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Kim, S.Y., Kim, M.I. & Lee, JH. Pressure-Assisted Sinter-Bonding Characteristics at 250 °C in Air Using Bimodal Ag-Coated Cu Particles. Electron. Mater. Lett. 16, 293–298 (2020). https://doi.org/10.1007/s13391-020-00208-1

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