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Effect of Aging Temperature on the Microstructure and Shear Strength of SAC0307-0.1Ni Lead-Free Solders in Copper Joints

  • PHYSICAL METALLURGY AND HEAT TREATMENT
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Abstract

This paper presents an investigation of the effects of aging temperature on the microstructure and shear strength of SAC0307-0.1Ni/Cu solder joints. Single-overlap shear solder joints were aged for 1 h at 80, 130, and 180°C. The microstructure of the interface between the solder and the Cu substrate contained phase of the intermetallic compounds (IMCs) (Cu,Ni)6Sn5 formed along the interface. The shape of scallop-like (Cu,Ni)6Sn5 IMCs changed to the long dendrite and grew larger at the interface of solder joints after increased aging temperature. In addition, a phase of particle-like Ag3Sn IMCs was formed in the solder matrix. The growth of the interfacial IMC layer in the solder joints increased with increasing the aging temperature. The thickness of this layer was controlled by diffusion mechanism. The shear strength of the as-reflowed solder joints was greater than that of the aged solder joints, and the shear strength of all the aged solder joints decreased with increasing the aging temperatures. Therefore, the aging temperature mainly affected the thickness of the interfacial layer of IMCs and the shear strength of the solder joints.

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ACKNOWLEDGMENTS

This work has been supported by Prince of Songkla University Research Fund (Fiscal Year 2016) under the contract number SCI590647S. We would like to thank academician Thomas Duncan Coyne for commenting and improving the English in the manuscript.

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Authors and Affiliations

  1. Department of Materials Science and Technology, Faculty of Science, Prince of Songkla University, 90112, Hat Yai, Thailand

    Phairote Sungkhaphaitoon

  2. Center of Excellence in Materials Engineering, Faculty of Engineering, Prince of Songkla University, 90112, Hat Yai, Thailand

    Phairote Sungkhaphaitoon

  3. Department of Industrial Engineering, Faculty of Engineering, Rajamangala Unversity of Technology, 90000, Srivijaya, Songkhla, Thailand

    Suchart Chantaramanee

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  1. Phairote Sungkhaphaitoon
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Correspondence to Phairote Sungkhaphaitoon.

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Phairote Sungkhaphaitoon, Suchart Chantaramanee Effect of Aging Temperature on the Microstructure and Shear Strength of SAC0307-0.1Ni Lead-Free Solders in Copper Joints. Russ. J. Non-ferrous Metals 61, 89–98 (2020). https://doi.org/10.3103/S1067821220010162

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