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Investigation of the Electroless Nickel Plated Sic Particles in Sac305 Solder Matrix

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Powder Metallurgy and Metal Ceramics Aims and scope

In the present study, an electroless nickel (EN) plating method is applied for the coating of silicon carbide (SiC) particles. The particles of SiC(Ni) were added to the Sn–3.0Ag–0.5Cu matrix for the production of SAC305/SiC(Ni) composite by the powder metallurgy route. SAC305/xSi(Ni) composite was prepared by a planetary ball milling of the starting powder, followed by compacting and sintering. Nickel-coated silicon carbide particles and the lead-free solder matrix react together, forming different phases during sintering at temperature 200°C for 3 h. The microstructure, mechanical (compressive strength, microhardness, wettability, and porosity) and physical properties (density) of lead-free solder composite SAC305/SiC(Ni) were studied. The current research shows the successful application of electroless nickel (EN) plating method, and how nickel-coated SiC particles subsequently improve the mechanical properties and microstructure of lead-free solder.

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Acknowledgments

The described article was carried out as part of the GINOP-2.3.2-15-2016-00027 project “Sustainable operation of the workshop of excellence for the research and development of crystalline and amorphous nanostructured materials” project implemented in the framework of the Szechenyi 2020 program. The realization of this project is supported by the European Union.

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Authors and Affiliations

  1. Faculty of Materials Science and Engineering, Institute of Physical Metallurgy, Metal Forming and Nanotechnology, University of Miskolc, Miskolc-Egyetemváros, 3515, Hungary

    Manoj Kumar Pal, Gréta Gergely, Dániel Koncz-Horváth & Zoltán Gácsi

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  1. Manoj Kumar Pal
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  2. Gréta Gergely
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  3. Dániel Koncz-Horváth
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  4. Zoltán Gácsi
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Correspondence to Manoj Kumar Pal.

Additional information

Published in Poroshkova Metallurgiya, Vol. 58, Nos. 9–10 (529), pp. 44–54, 2019.

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Pal, M.K., Gergely, G., Koncz-Horváth, D. et al. Investigation of the Electroless Nickel Plated Sic Particles in Sac305 Solder Matrix. Powder Metall Met Ceram 58, 529–537 (2020). https://doi.org/10.1007/s11106-020-00107-y

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  • DOI: https://doi.org/10.1007/s11106-020-00107-y

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