Abstract
Two major research areas including assistive devices and Interconnect modelling for VLSI design are focused by Dr. Madhav Rao in IIIT-Bangalore. 3D interconnect is considered a solution to stack different functionalities on a system on chip (SoC), in a view to achieve faster computations and accommodate higher load on the chip. The 3D interconnects offers the luxury for the designers to not worry on the wiring and instead optimize the design independently. The research attempts to model 3D wirings using novel composite materials including Carbon nanotubes with Copper, instead of traditional wiring material to facilitate SoC performance with better interconnect design. Assistive robotic devices development to a growing uncared population is considered highly beneficial. In IIIT-Bangalore, Dr. Madhav Rao along with his students are working on developing assistive devices for clinical trials, and building devices for surgical purposes. The assistive robotics research covers range of device development aiding in upper limb movement, regular lower limb ankle actuation to overcome deep vein thrombosis, and ventricular assistance to promote blood flow for weak heart.
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Acknowledgements
The support from Visvesvaraya Ph.D. scheme enabled to initiate work independently in the area of Assistive devices and later extend by submitting a comprehensive proposal to different funding agencies. The work on 3D interconnects was made visible due to the conference travel support which was possible only due to Visvesvaraya Ph.D. Scheme. The scheme has also given more opportunities to collaborate with colleagues and peers across different domain in different institutes in India, and possibly abroad in the future.
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Rao, M. Research highlights. CSIT 7, 205–208 (2019). https://doi.org/10.1007/s40012-019-00237-8
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DOI: https://doi.org/10.1007/s40012-019-00237-8