Abstract
A new type of metal film on a polyethylene terephthalate (PET) substrate was fabricated with a pattern of holes using a photolithography-based wet process, and its application to the interconnection designof flexible electronic devices was demonstrated. The intended diameters for the holes in the patterns of the metal films were 10 μm, 30μm and 50μm. The hole-patterned samples showed much better electrical properties in the high-strain region. Furthermore, the absolute value of the electrical resistance for the hole-patterned sample was low, even by comparison with a no-pattern sample, for some of the critical values of tensile strain. The results of this study show potential application to the interconnection designof flexible electronic devices.
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Choi, YJ., Kwon, NH., Ha, SH. et al. Electrical properties of metal film with micro-holes on a polymer substrate: Applications for flexible electronic devices. Electron. Mater. Lett. 5, 191–194 (2009). https://doi.org/10.3365/eml.2009.12.191
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DOI: https://doi.org/10.3365/eml.2009.12.191