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Transient liquid-phase bonding of superalloy K465 using a Ni–Cr–Fe–B–Si amorphous interlayer alloy

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Abstract

A kind of Ni–Cr–Fe–B–Si system amorphous alloy was used as interlayer in transient liquid-phase bonding (TLP bonding) of polycrystalline superalloy K465. The bonding behavior, microstructure feature and the tensile properties of the joints were investigated. There are B-rich phase and Si-rich phase formed in the center of the seam after bonding at 1210 °C for 30 min. The isothermal solidification is complete after bonding at 1210 °C for 4 h. The relationship of the average width of the remnant eutectic zone and bonding time at 1210 °C is nonlinear. The tensile strength of the bonded joint at room temperature and 900 °C is comparable to that of K465 alloy.

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References

  1. Zheng L, Xu TD, Deng Q, Dong JX. Experimental study on the characteristic of grain-boundary segregation of phosphorus in Ni-base superalloy. Mater Lett. 2008;62(1):54.

    Article  CAS  Google Scholar 

  2. Chen JY, Cao LM, Xue M, Liu LJ. Microstructure and stress-rupture property of an experimental single crystal Ni-base superalloy with different heat treatments. Rare Met. 2014;33(2):144.

    Article  CAS  Google Scholar 

  3. Hoopin GS, Berry TF. Activated diffusion bonding. Weld J. 1970;49(11):505s.

    Google Scholar 

  4. Duvall DS, Owczarshi WA, Paulonis DF. TLP bonding: a new method for joining heat resistant alloys. Weld J. 1974;53(4):203.

    CAS  Google Scholar 

  5. Liu JD, Jin T, Li W, Sun XF, Guan HR, Hu ZQ. Creep fracture mechanism of TLP joint of a Ni-base single crystal superalloy. J Alloys Compd. 2008;475:185.

    Article  Google Scholar 

  6. Sheng NC, Liu JD, Jin T, Sun XF, Hu ZQ. Wide Gap TLP bonding a single-crystal superalloy: evolution of the L/S interface morphology and formation of the isolated grain boundaries. Metall Mater Trans A. 2013;44(4):1793.

    Article  CAS  Google Scholar 

  7. Jalilvand V, Omidvar H, Shakeri HR, Rahimipour MR. A study on the effect of process parameters on the properties of joint in TLP-bonded Inconel 738LC superalloy. Metall Mater Trans B. 2013;44(6):1222.

    Article  CAS  Google Scholar 

  8. Nishimoto K, Saida K, Kim D, Asai S, Furukawa Y, Nakao Y. Bonding phenomena and joint properties of transient liquid phase bonding of Ni-base single crystal superalloys. Weld World. 1998;41(2):121.

    CAS  Google Scholar 

  9. Kim DU, Nishimoto K. Creep rupture and fatigue properties of transient liquid phase bonded joints of Ni base single crystal superalloy. Mater Sci Technol. 2003;19(4):456.

    Article  CAS  Google Scholar 

  10. Idowu OA, Richards NL, Chaturvedi MC. Effect of bonding temperature on isothermal solidification rate during transient liquid phase bonding of Inconel 738LC superalloy. Mater Sci Eng A. 2005;397(4):98.

    Article  Google Scholar 

  11. Idowu OA, Ojo OA, Chaturvedi MC. Microstructural study of transient liquid phase bonded cast Inconel 738LC superalloy. Metall Mater Trans A. 2006;37(9):2787.

    Article  Google Scholar 

  12. MacDonald WD, Eagar TW. Transient liquid phase bonding. Annu Rev Mater Sci. 1992;22(8):23.

    Article  CAS  Google Scholar 

  13. Poku IT, Dollar M, Massalski TB. A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint. Metall Trans A. 1998;19(3):675.

    Article  Google Scholar 

  14. Zhou Y, Gale WF, North TH. Modeling of transient liquid phase bonding. Int Mater Rev. 1995;40(5):181.

    Article  CAS  Google Scholar 

  15. Schnell A, Stankowski A, de Marcos E. A study of the diffusion brazing process applied to the single crystal superalloy CMSX-4. In: Proceedings of GT2006 ASME Turbo Expo 2006: Power for Land, Sea and Air, Barcelona. 2006.1.

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Acknowledgments

This work was financially supported by the National Basic Research Program China (Nos. 2010CB631200 and 2010CB631206) and the National Natural Science Foundation of China (Nos. 50971124, 50904059, 51071165, U1037601 and 51204156).

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Authors and Affiliations

  1. Department of Superalloys, Institute of Metal Research, Chinese Academy of Science, Shenyang, 110016, China

    Ji-De Liu, Bo Li, Yuan Sun, Tao Jin, Xiao-Feng Sun & Zhuang-Qi Hu

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  1. Ji-De Liu
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  2. Bo Li
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  3. Yuan Sun
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  4. Tao Jin
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  5. Xiao-Feng Sun
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  6. Zhuang-Qi Hu
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Correspondence to Ji-De Liu.

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Liu, JD., Li, B., Sun, Y. et al. Transient liquid-phase bonding of superalloy K465 using a Ni–Cr–Fe–B–Si amorphous interlayer alloy. Rare Met. 39, 408–412 (2020). https://doi.org/10.1007/s12598-015-0568-4

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  • DOI: https://doi.org/10.1007/s12598-015-0568-4

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