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Thermodynamic irreversibility and conjugate effects of integrated microchannel cooling device using TiO2 nanofluid

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Abstract

Thermal management is highly essential for the latest electronic devices to effectively dissipate heat in a densely packed environment. Usually, these high power devices are cooled by integrating micro scale cooling systems. Most of the works reported in the literature majorly concentrate on microchannel heat sink in which the characteristics of friction factor and enhancement of heat transfer are analyzed in detail. However, due to the advent of compact electronic devices a crucial investigation is required to facilitate an amicable environment for the neighboring components so as to improve the reliability of the electronic devices. Henceforth, in the present study a combined experimental and numerical analysis is performed to provide an insight to determine the performance of a copper microchannel integrated with aluminium block using TiO2 nanofluid for different particle configurations. Needless to say, the present study, which also focuses on entropy generation usually attributed to the thermodynamic irreversibility, is very much significant to design an optimum operating condition for better reliability and performance of the cooling devices.

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Abbreviations

Re :

Reynolds number

u :

velocity of the fluid (m/s)

k :

thermal conductivity (W/m. K)

\( {q}_{bot}^{{\prime\prime} } \) :

heat flux at the bottom (W/cm2)

T ∞ :

room temperature (°C)

n f :

nanofluid

b f :

base fluid

C p :

specific heat (J/kg. K)

n :

shape factor

Pr :

Prandtl number

Vf :

volume fraction

W1 :

width of the channel wall

W2 :

width of the channel

H:

height of the channel

D:

diameter of the heater

L:

length of the channel

Tw :

total width of the channel

Pin :

pressure at microchannel inlet

Pout :

pressure at microchannel outlet

T in :

temperature inlet

T out :

temperature outlet

T e :

temperature of the heater

TAl :

temperature of the aluminium block

TC :

temperature of the copper microchannel

\( \dot{m} \) :

mass flow rate

Nu :

Nusselt number

\( \dot{S} \) :

total entropy generation

Δp :

pressure drop (Pa)

ρ:

density (kg/m3)

υ m :

mean velocity of the fluid

μ :

viscosity (cP)

φ :

particle concentration factor

s :

solid

f :

fluid

p :

particle

bot :

bottom of the heat sink

m :

mean

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Authors and Affiliations

  1. Department of Mechanical Engineering, National Institute of Technology Karnataka, Surathkal, Mangalore, 575025, India

    G. Narendran, N. Gnanasekaran & D. Arumuga Perumal

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  1. G. Narendran
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  2. N. Gnanasekaran
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  3. D. Arumuga Perumal
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Correspondence to N. Gnanasekaran.

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Narendran, G., Gnanasekaran, N. & Perumal, D.A. Thermodynamic irreversibility and conjugate effects of integrated microchannel cooling device using TiO2 nanofluid. Heat Mass Transfer 56, 489–505 (2020). https://doi.org/10.1007/s00231-019-02704-z

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