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Iodide as Terminating Agent for Platinum Electrodeposition

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Abstract

“Approximate” Pt layers hold great promise to be highly active and durable oxygen reduction reaction (ORR) catalysts. Electrodeposition of such layers on relevant catalyst supports, for example TiOx, requires the application of a “Pt-on-Pt” deposition limiter to keep layers thin and leave no atom behind for catalysis. Classic Pt-on-Pt deposition limiting agents like CO and over-potential deposited hydrogen (Hopd) work reliably on gold but fail on TiOx substrates. Iodide, in contrast, is a new “Pt-on-Pt” deposition limiting agent that shows substantial Pt layer thickness reduction during electrodeposition on gold as well as TiOx substrates.

Limitations are not always a bad thing: The addition of NaI during Pt electrodeposition from Ar-saturated 0.1 mM K2PtCl4 + 0.1 M HClO4 solution limits the Pt deposition amount and leads to a substantial reduction in Pt layer thickness and a concurrent increase in ORR mass activity.

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Authors and Affiliations

  1. Toyota Central R&D Labs., Inc., 41-1, Yokomichi, Nagakute, Aichi, 480-1192, Japan

    Sebastian Proch, Shuhei Yoshino, Juntaro Seki, Naoko Takahashi, Kousuke Kitazumi, Kensaku Kodama & Yu Morimoto

  2. Sandvik Materials Technology, 81181, Sandviken, Sweden

    Sebastian Proch

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  1. Sebastian Proch
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  2. Shuhei Yoshino
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Correspondence to Sebastian Proch, Kensaku Kodama or Yu Morimoto.

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Proch, S., Yoshino, S., Seki, J. et al. Iodide as Terminating Agent for Platinum Electrodeposition. Electrocatalysis 11, 14–24 (2020). https://doi.org/10.1007/s12678-019-00562-1

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