Abstract
In the current study, Neodymium oxide (Nd2O3) was prepared by sol–gel method and deposited on P-type 〈100〉 silicon wafer. The chemical characterization of samples was done by Fourier transform infrared spectroscopy (FTIR), X-ray diffraction (XRD), scanning electron microscopy (SEM), energy-dispersive spectra (EDS) and atomic force microscopy (AFM). Nd–O bond formation was proven by FTIR, also cubic- Nd2O3 (c-Nd2O3) phase was detected by XRD. According to EDS analysis, neodymium concentration was approximately 59.41% while oxygen concentration was calculated as 10.21%. The amount of excess oxygen was 9.45% was originated by cristobalite formation. In addition, electrical characterizations of Nd2O3/p-Si MOS capacitor was performed by capacitance–voltage (C–V), conductance–voltage G/ω–V measurements at different frequencies between 250 kHz and 1 MHz. The maximum value of measured capacitance–voltage (C–V) and conductance–voltage (G/ω–V) was increased with decreasing in the applied voltage frequencies and after series resistance (Rs) correction, the measured C–V and G/ω–V characteristics, G/ω behavior started to decrease with rising the frequencies. According to the observed frequency dispersion, the deposited Nd2O3 on P-type 〈100〉 silicon exhibits stable insulation property for future microelectronic applications.
Similar content being viewed by others
References
H. Bentarzi, Transport in Metal-Oxide-Semiconductor Structures (Springer, Heidelberg, 2011)
S.M. Sze, K.K. Ng, Choice Rev. Online 27, 27 (2013)
E.H. Nicollian, J.R. Brews, MOS (Metal Oxide Semiconductor) Physics and Technology (Wiley, New York, 2003)
A.B. Ulaşan, A. Tataroğlu, Y. Azizian-Kalandaragh, Ş. Altındal, J. Mater. Sci. 29, 159 (2018)
S.A. Yerişkin, G.E. Demir, İ. Yücedag, J. Nanoelectron. Optoelectron. 14, 1126 (2019)
A. Kahraman, E. Yilmaz, A. Aktag, S. Kaya, I.E.E.E. Trans, Nucl. Sci. 63, 1284 (2016)
A. Kahraman, E. Yilmaz, J. Vac. Sci. Technol. A 35, 061511 (2017)
K. Seshan, Handbook of Thin-Film Deposition Processes and Techniques Principles, Methods, Equipment and Applications Second Edition (Elsevier, New York, 2002)
T.-M. Pan, J.-D. Lee, W.-H. Shu, T.-T. Chen, Appl. Phys. Lett. 89, 232908 (2006)
Y.Y. Gomeniuk, Y.V. Gomeniuk, A. Nazarov, V.S. Lysenko, H.J. Osten, A. Laha, Adv. Mater. Res. 276, 167 (2011)
A.A. Dakhel, Phys. Status Solidi 201, 745 (2004)
K. Hetherin, S. Ramesh, Y.H. Wong, Appl. Phys. A 123, 510 (2017)
V.S. Dharmadhikari, A. Goswami, Thin Solid Films 87, 119 (1982)
A. Kosola, J. Päiväsaari, M. Putkonen, L. Niinistö, Thin Solid Films 479, 152 (2005)
M. Salavati-Niasari, F. Soofivand, A. Sobhani-Nasab et al., J. Mater. Sci. 28, 14965 (2017)
L. Dimesso, Pechini processes: an alternate approach of the sol–gel method, preparation, properties, and applications, in Handbook of Sol-Gel Science and Technology, ed. by L. Klein, M. Aparicio, A. Jitianu (Springer, Cham, 2016).
B. Zhaorigetu, G. Ridi, L. Min, J. Alloys Compd. (2007).
S. Duhan, P. Aghamkar, M. Singh, Res. Lett. Phys. 2008, 1 (2008)
B. Umesh, B. Eraiah, H. Nagabhushana, S.C. Sharma, D.V. Sunitha, B.M. Nagabhushana, J.L. Rao, C. Shivakumara, R.P.S. Chakradhar, Mater. Res. Bull. 48, 180 (2013)
G.D. Dhamale, V.L. Mathe, S.V. Bhoraskar, S.N. Sahasrabudhe, S.D. Dhole, S. Ghorui, Nanotechnology 27, 085603 (2016)
M. Hirose, M. Hiroshima, T. Yasaka, M. Takakura, S. Miyazaki, Microelectron. Eng. 22, 3 (1993)
H. Xiao, S. Huang, Mater. Sci. Semicond. Process. 13, 395 (2010)
A.O. Cetinkaya, S. Kaya, A. Aktag, E. Budak, E. Yilmaz, Thin Solid Films 590, 7 (2015)
R. Lok, S. Kaya, H. Karacali, and E Yilmaz. J. Mater. Sci 27, 13154 (2016)
S. Kaya, R. Lok, A. Aktag, J. Seidel, E. Yilmaz, J. Alloys Compd. 583, 476 (2014)
Y. Kimoto, Y. Satoh, H. Tachihara, Trans. Jpn. Soc. Aeronaut. Space Sci. Aerosp. Technol. JAPAN 7 Tr_2_27 (2009).
G. Hui, L. Jin, G. Guang-Hua, L. Yu-Xiong, H. Lei, S. Bei-Bei, Chin. Phys. C 33, 774 (2009)
A. Kahraman, E. Yilmaz, S. Kaya, A Aktag. J. Mater. Sci 26, 8277 (2015)
D. Korucu, Ş. Altındal, T.S. Mammadov, S. Ozcelik, Optoelectron. Adv. Mat. 2, 525 (2008)
L. de Carlan, R. Price, J.-L. Chartier, I. Kodeli, B. Siebert, J. Henninger, J. Posselt, G. Gualdrini, S. Agosteo, R. Bedogni, J.-M. Bordy, P. Cassette, P. Ferrari, J.-M. Gomez Ros, B. Grosswendt, V. Lacoste, A. Pola, S. Rollet, F. Schultz, et al., Radiat. Prot. Dosim. 131, 15 (2008).
I. Yücedağ, A. Kaya, Ş. Altındal, I. Uslu, Chin. Phys. B 23, 047304 (2014)
A. Tataroğlu, Ş. Altındal, Microelectron. Eng. 85, 1866 (2008)
S. Kaya, E. Yilmaz, I.E.E.E. Trans, Electron Devices 62, 980 (2015)
E. Tanrıkulu, E. Demirezen, Ş. Altındal, I. Uslu, J. Mater. Sci. 29, 2890 (2018)
S. Nezhadesm-Kohardafchahi, S. Farjami-Shayesteh, Y. Badali et al., Mater. Sci. Semicond. Process. 86, 173 (2018)
A. Tataroğlu, Microelectron. Eng. 83, 2551 (2006)
A. Faigon, J. Lipovetzky, E. Redin, G. Krusczenski, I.E.E.E. Trans, Nucl. Sci. 55, 2141 (2008)
A.M. Mahajan, A.G. Khairnar, B.J. Thibeault, Semiconductors 48, 497 (2014)
A. Jaksic, Y. Kimoto, A. Mohammadzadeh, W. Hajdas, I.E.E.E. Trans, Nucl. Sci. 53, 2004 (2006)
A. Haran, M. Murat, J. Barak, D. David, Charge Yield and Total Ionizing Dose Measurements, in 9th European Conference on Radiation and Its Effects on Components and Systems (IEEE), p. 1 (2007).
P.M. Tirmali, A.G. Khairnar, B.N. Joshi, A.M. Mahajan, Solid. State. Electron. 62, 44 (2011)
D. Panda, T.-Y. Tseng, Thin Solid Films 531, 1 (2013)
M. Shahjahan, N. Takahashi, K. Sawada, M. Ishida, Jpn. J. Appl. Phys. 41, L1474 (2002)
Author information
Authors and Affiliations
Corresponding author
Additional information
Publisher's Note
Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Rights and permissions
About this article
Cite this article
Lok, R., Budak, E. & Yilmaz, E. Structural characterization and electrical properties of Nd2O3 by sol–gel method. J Mater Sci: Mater Electron 31, 3111–3118 (2020). https://doi.org/10.1007/s10854-020-02857-2
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10854-020-02857-2