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Microstructures and Mechanical Properties of Sn-58 wt.% Bi Solder with Ag-Decorated Multiwalled Carbon Nanotubes Under 85°C/85% Relative Humidity Environmental Conditions

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Abstract

The mechanical properties of Sn-58 wt.% Bi solder with different amounts (0 wt.%, 0.05 wt.%, 0.1 wt.%, and 0.2 wt.%) of Ag-decorated multiwalled carbon nanotube (MWCNT) nanoparticles under 85°C/85% relative humidity environmental conditions for 0 h to 1000 h was investigated. Sn-58 wt.% Bi solder is a lead-free option for use in solder joints due to its low melting temperature and good creep resistance; however, it is brittle and has reliability issues. Ag-decorated MWCNT nanoparticles were used to improve these weaknesses of Sn-58 wt.% Bi solder. A ball shear test was performed using a bond tester to investigate the solder's mechanical properties. The microstructures of the solder joints and fracture mode were analyzed using a field-emission scanning electron microscope. The results demonstrated that the addition of Ag-decorated MWCNT nanoparticles to Sn-58 wt.% Bi increased the shear strength and fracture energy by approximately 15% and 14%, respectively, compared with Sn-58 wt.% Bi alone. After a high-temperature, high-humidity test for 1000 h, the shear strength and fracture energy of Sn-58 wt.% Bi with 0.1 wt.% Ag-decorated MWCNT nanoparticles were 13% and 21% greater than for Sn-58 wt.% Bi alone.

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Acknowledgments

This research was supported by the Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Education (No. 2019R1A6A1A03033215). This work was supported by “Human Resources Program in Energy Technology” of the Korea Institute of Energy Technology Evaluation and Planning, granted financial resource from the Ministry of Trade, Industry & Energy, Republic of Korea (No. 20174030201800).

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Authors and Affiliations

  1. School of Advanced Materials Science and Engineering, Sungkyunkwan University, 2066 Seobu-ro, Jangan-gu, Suwon, 16419, South Korea

    Kyung Deuk Min, Choong-Jae Lee, Hyun-Joon Park & Seung-Boo Jung

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  1. Kyung Deuk Min
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  2. Choong-Jae Lee
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  4. Seung-Boo Jung
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Correspondence to Seung-Boo Jung.

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Min, K.D., Lee, CJ., Park, HJ. et al. Microstructures and Mechanical Properties of Sn-58 wt.% Bi Solder with Ag-Decorated Multiwalled Carbon Nanotubes Under 85°C/85% Relative Humidity Environmental Conditions. J. Electron. Mater. 49, 1527–1533 (2020). https://doi.org/10.1007/s11664-019-07863-7

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