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Quasi-elliptic band pass filter using resonators based on coupling theory for ultra-wide band applications Microelectron. Int. (IF 1.1) Pub Date : 2024-01-05 Divya Shree M., Srinivasa Rao Inabathini
Purpose This paper aims to present the simulation, fabrication and testing of a novel ultra-wide band (UWB) band-pass filters (BPFs) with better transmission and rejection characteristics on a low-loss Taconic substrate and analyze using the coupled theory of resonators for UWB range covering L, S, C and X bands for radars, global positioning system (GPS) and satellite communication applications.
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Design of UWB MIMO antenna using lean wearable textile substrate for reduced SAR Microelectron. Int. (IF 1.1) Pub Date : 2023-10-12 Sasireka Perumalsamy, Kavya G., Rajkumar S.
Purpose This paper aims to propose a two-element dual fed ultra-wideband (UWB) multiple input multiple output (MIMO) antenna system with no additional decoupling structures. The antenna operates from 3.1 to 10.6 GHz. The antenna finds its usage in on-body wearable device applications. Design/methodology/approach The antenna system measures 63.80 × 29.80 × 0.7 mm. The antenna radiating element is designed
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Investigation on the new reliability issues of PCB in 5G millimeter wave application Microelectron. Int. (IF 1.1) Pub Date : 2023-10-10 Xiao He, Lijuan Huang, Meizhen Xiao, Chengyong Yu, En Li, Weiheng Shao
Purpose The purpose of this paper is to illustrate the new technical demands and reliability challenges to printed circuit board (PCB) designs, materials and processes when the transmission frequency increases from Sub-6 GHz in previous generations to millimeter (mm) wave in fifth-generation (5G) communication technology. Design/methodology/approach The approach involves theoretical analysis and actual
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A numerical investigation on the influence of full vs perimeter arrays on the mechanical reliability of electronic assemblies under vibration Microelectron. Int. (IF 1.1) Pub Date : 2023-07-28 Mohammad A. Gharaibeh
Purpose This paper aims to compare and evaluate the influence of package designs and characteristics on the mechanical reliability of electronic assemblies when subjected to harmonic vibrations. Design/methodology/approach Using finite element analysis (FEA), the effect of package design-related parameters, including the interconnect array configuration, i.e. full vs perimeter, and package size, on
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An ultrawideband Koch fractal patch antenna Microelectron. Int. (IF 1.1) Pub Date : 2023-07-06 Iqra Masroor, Jamshed Aslam Ansari
Purpose Compact and wideband antennas are the need of modern wireless systems that preferably work with compact, low-profile and easy-to-install devices that provide a wider coverage of operating frequencies. The purpose of this paper is to propose a novel compact and ultrawideband (UWB) microstrip patch antenna intended for high frequency wireless applications. Design/methodology/approach A square
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Study on electronic transport performance of Ag-ZnO film by photoassisted conductive atomic force microscopy Microelectron. Int. (IF 1.1) Pub Date : 2023-06-05 Yidong Zhang
Purpose The purpose of this paper is to study the electronic transport performance of Ag-ZnO film under dark and UV light conditions. Design/methodology/approach Ag-doped ZnO thin films were prepared on fluorine thin oxide (FTO) substrates by sol-gel method. The crystal structure of ZnO and Ag-ZnO powders was tested by X-ray diffraction with Cu Kα radiation. The absorption spectra of ZnO and Ag-ZnO
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Bipolar power converter and control of switched reluctance generator system for renewable energy storage Microelectron. Int. (IF 1.1) Pub Date : 2023-05-18 Hao Chen, Fan Yang, Miguel Pablo Aguirre, Muhammad Asghar Saqib, Galina Demidova, Alecksey Anuchin, Mohamed Orabi, Ryszard Palka, Liudmila Ivanovna Sakhno, Nikolay Vladimirovich Korovkin
Purpose Because of the shortage of energy, the development of green and reliable energy is particularly important. As a green and clean energy, wind power is widely used. As the core component of wind power generation, it is particularly important to choose generators with high reliability. Switched reluctance machine is widely used as generators because of its strong fault tolerance and high reliability
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A chemosensitive-based ammonia gas sensor with PANI/PEO–ZnO nanofiber composites sensing layer Microelectron. Int. (IF 1.1) Pub Date : 2023-05-15 Gözde Konuk Ege, Özge Akay, Hüseyin Yüce
Purpose This study aims to investigate the ammonia-sensing performance of polyaniline/polyethylene oxide (PANI/PEO) and polyaniline/polyethylene oxide/zinc oxide (PANI/PEO-ZnO) composite nanofibers at room temperature. Design/methodology/approach Gas sensor structures were fabricated using microfabrication techniques. First, onto the SiO2 wafer, gold electrodes were fabricated via thermal evaporation
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Reliability evaluation on SRG with full-bridge power converter considering thermal stress Microelectron. Int. (IF 1.1) Pub Date : 2023-05-03 Fan Yang, Hao Chen, Shuai Xu
Purpose Quantitative reliability analysis can effectively identify the time the driving system needs to be maintained. Then, the potential safety problems can be found, and some catastrophic failures can be effectively prevented. Therefore, this paper aims to evaluate the reliability of the switched reluctance generator (SRG) driving system. Design/methodology/approach In this paper, a method considering
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Reduction of the warping of a silicon wafer coated with two thin layers by minimal geometric modifications Microelectron. Int. (IF 1.1) Pub Date : 2023-04-26 Imad El Fatmi, Soufyane Belhenini, Abdellah Tougui
Purpose The aim of this study is to make a contribution towards reducing the deflections of silicon wafers. The deformation of silicon wafers used in the manufacture of electronic micro-components is one of the most common problems encountered by industrialists during manufacturing. Stack warping is typically produced during the process of depositing thin layers on a substrate. This is due to the thermal-mechanical
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Magnetic alignment technology for wafer bonding Microelectron. Int. (IF 1.1) Pub Date : 2023-04-20 Lezhi Ye, Xuanjie Song, Chang Yue
Purpose Wafer bonding is a key process for 3 D advanced packaging of integrated circuits. It requires very high accuracy for the wafer alignment. To solve the problems of large movement stroke, position calibration error and low production efficiency in optical alignment, this paper aims to propose a new wafer magnetic alignment technology (MAT) which is based on tunnel magneto resistance effect. MAT
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Experimental study on the fracture behavior variation of the Au stud bump bonding with different high temperature storage times Microelectron. Int. (IF 1.1) Pub Date : 2023-04-17 Xiangou Zhang, Yuexing Wang, Xiangyu Sun, Zejia Deng, Yingdong Pu, Ping Zhang, Zhiyong Huang, Quanfeng Zhou
Purpose Au stud bump bonding technology is an effective means to realize heterogeneous integration of commercial chips in the 2.5D electronic packaging. The purpose of this paper is to study the long-term reliability of the Au stud bump treated by four different high temperature storage times (200°C for 0, 100, 200 and 300 h). Design/methodology/approach The bonding strength and the fracture behavior
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Effect of reflow temperature and solder size on Cu-Ni cross-interaction in the Cu/Sn/Ni micro solder joints Microelectron. Int. (IF 1.1) Pub Date : 2023-04-13 Xing Gao, Z.J. Zhang, Hong Wei, Xu Zhou, Quan Shi, Yang Wu, Lei Da Chen
Purpose Solder bumps for chip interconnections are downsizing from current approximately 100 µm to the expected 1 µm in future. As a result, the Cu-Ni cross-interaction in Cu/Solder/Ni solder joints will be more complicated and then strongly influence the growth of the intermetallic compounds (IMCs). Thus, it is critical to understand the fundamental aspects of interfacial reaction in micro solder
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Comparative study on solid-solid interfacial reaction and bonding property of Sn-Ag-Cu/Ni-P joints by laser and reflow soldering Microelectron. Int. (IF 1.1) Pub Date : 2023-03-27 Y. Wu, Z.J. Zhang, L.D. Chen, X. Zhou
Purpose Laser soldering has attracted attention as an alternative soldering process for microsoldering due to its localized and noncontact heating, a rapid rise and fall in temperature, fluxless and easy automation compared to reflow soldering. Design/methodology/approach In this study, the metallurgical and mechanical properties of the Sn3.0Ag0.5Cu/Ni-P joints after laser and reflow soldering and
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A chopper amplifier with a pseudo MOS resistor-based tunable bandwidth for EEG applications Microelectron. Int. (IF 1.1) Pub Date : 2023-03-23 Amrita Sajja, S. Rooban
Purpose The purpose of chopper amplifier is to provide the wideband frequency to support biomedical signals. Design/methodology/approach This paper proposes a chopper-stabilized amplifier with a cascoded operational transconductance amplifier. The high impedance loop is established using an MOS pseudo resistor and with a tunable MOS capacitor. Findings The total power consumption is 451 nW with a supplied
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A modal analysis based optimal mounting support locations of a printed circuit board Microelectron. Int. (IF 1.1) Pub Date : 2023-03-07 Muthuram N., Saravanan S.
Purpose This paper aims to improve the life of the printed circuit boards (PCB) used in computers based on modal analysis by increasing the natural frequency of the PCB assembly. Design/methodology/approach In this work, through experiments and numerical simulations, an attempt has been made to increase the fundamental natural frequency of the PCB assembly as high as practically achievable so as to
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Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees Microelectron. Int. (IF 1.1) Pub Date : 2023-03-07 Tian Huang, Guisheng Gan, Cong Liu, Peng Ma, Yongchong Ma, Zheng Tang, Dayong Cheng, Xin Liu, Kun Tian
Purpose This paper aims to investigate the effects of different ultrasonic-assisted loading degrees on the microstructure, mechanical properties and the fracture morphology of Cu/Zn+15%SAC0307+15%Cu/Al solder joints. Design/methodology/approach A new method in which 45 μm Zn particles were mixed with 15% 500 nm Cu particles and 15% 500 nm SAC0307 particles as solders (SACZ) and five different ultrasonic
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A chemosensitive based ammonia gas sensor with PANI/PEO- ZnO nanofiber composites sensing layer Microelectron. Int. (IF 1.1) Pub Date : 2023-03-07 Gözde Konuk Ege, Özge Akay, Hüseyin Yüce
Purpose The purpose of this study is to investigate the ammonia sensing performance of polyaniline/polyethylene oxide (PANI/PEO) and polyaniline/polyethylene oxide/zinc oxide (PANI/PEO-ZnO) composite nanofibers at room temperature. Design/methodology/approach Gas sensor structures were fabricated using micro-fabrication techniques. First, onto the SiO2 wafer, gold electrodes were fabricated via thermal
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DC-port voltage balance strategy for three-phase cascaded H-bridge rectifier based on logic combination modulation Microelectron. Int. (IF 1.1) Pub Date : 2023-02-28 Mingxiao Dai, Xu Peng, Xiao Liang, Xinyu Zhu, Xiaohan Liu, Xijun Liu, Pengcheng Han, Chao Wu
Purpose The purpose of this paper is to propose a DC-port voltage balance strategy realizing it by logic combination modulation (LCM). This voltage balance strategy is brief and high efficient, which can be used in many power electronic devices adopting the cascaded H-bridge rectifier (CHBR) such as power electronic transformer (PET). Design/methodology/approach The CHBR is typically as a core component
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The preparation of anisotropic conductive paste and its application in FOB interconnection Microelectron. Int. (IF 1.1) Pub Date : 2023-02-17 Xionghui Cai, Aixia Zhai, Chenglong Zhou, Kyung-Wook Paik
Purpose The purpose of this study is to investigate the reliability of flex-on-board (FOB) interconnection connected with an anisotropic conductive paste (ACP), which is prepared by dispersing nickel balls in the epoxy-curing system. Design/methodology/approach Differential scanning calorimetry was used to evaluate the curing characteristics of the paste. And the contact resistances of bonding joints
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The advanced leadless leadframe package and its characteristics Microelectron. Int. (IF 1.1) Pub Date : 2023-02-16 ByongJin Kim, HyeongIl Jeon, GiJeong Kim, WonBae Bang, JinYoung Khim
Purpose The purpose of this study is to offer the advanced leadless leadframe package which achieve small form factor and high thermal and electrical performance, according to the continuous market requirement. Because of demand and trends, new package structures that can accommodate many pins (I/Os) while maintaining the excellent thermal and electrical properties of the leadframe package was studied
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Influence of extended surface area of heatsink on heat transfer: design and analysis Microelectron. Int. (IF 1.1) Pub Date : 2023-02-16 Shanmugan Subramani, Mutharasu Devarajan
Purpose Light emitting diode (LED) has been the best resource for commercial and industrial lighting applications. However, thermal management in high power LEDs is a major challenge in which the thermal resistance (Rth) and rise in junction temperature (TJ) are critical parameters. The purpose of this work is to evaluate the Rth and Tj of the LED attached with the modified heat transfer area of the
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A failure location technology for SiP devices based on TDR nondestructive testing method Microelectron. Int. (IF 1.1) Pub Date : 2023-02-07 Hui Xiao, Xiaotong Guo, Fangzhou Chen, Weiwei Zhang, Hao Liu, Zejian Chen, Jiahao Liu
Purpose Traditional nondestructive failure localization techniques are increasingly difficult to meet the requirements of high density and integration of system in package (SIP) devices in terms of resolution and accuracy. Time domain reflection (TDR) is recognized as a novel positioning analysis technology gradually being used in the electronics industry because of the good compatibility, high accuracy
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Radiation-hardened flip-flop for single event upset tolerance Microelectron. Int. (IF 1.1) Pub Date : 2023-02-02 Chunhua Qi, Guoliang Ma, Yanqing Zhang, Tianqi Wang, Erming Rui, Qiang Jiao, Chaoming Liu, Mingxue Huo, Guofu Zhai
Purpose The purpose of this paper is to present a transition detector (TD)-based radiation hardened flip-flop (TDRH-FF) for single event upset (SEU). Design/methodology/approach With SEU recovery and single event transient (SET) detector mechanism, the TDRH-FF can tolerate SEU during hold mode and generate a warning signal for architecture-level recovery during transport mode when input signal contains
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Improving displacement of silicon V-shaped electrothermal microactuator using platinum sputter deposition process Microelectron. Int. (IF 1.1) Pub Date : 2023-02-02 Dzung Tien Nguyen, Phuc Hong Pham, Kien Trung Hoang
Purpose This paper aims to propose a method to reduce the resistance of silicon-based V-shaped electrothermal microactuator (VEM) by applying a surface sputtering process. Design/methodology/approach Four VEM’s samples have been fabricated using traditional silicon on insulator (SOI)-Micro-electro-mechanical System (MEMS) technology, three of them are coated with a thin layer of platinum on the top
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CVD processed ZnO thin film as solid thermal interface material in electronic devices: thermal and optical performance of LED Microelectron. Int. (IF 1.1) Pub Date : 2023-02-02 Shanmugan Subramani, Mutharasu Devarajan
Purpose Polymer-based thermal interface materials (TIMs) are having pump out problem and could be resolved for reliable application. Solid-based interface materials have been suggested and reported. The purpose of this paper is suggesting thin film-based TIM to sustain the light-emiting diode (LED) performance and electronic device miniaturization. Design/methodology/approach Consequently, ZnO thin
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A monopole polarisation diversity antenna for high density packaging MIMO applications Microelectron. Int. (IF 1.1) Pub Date : 2023-01-27 Dhanalakshmi K.M., Kavya G., Rajkumar S.
Purpose This paper aims to propose a single element, dual feed, polarisation diversity antenna. The proposed antenna operates from 2.9 to 10.6 GHz for covering the entire ultra-wideband (UWB) frequency range. The antenna is designed for usage in massive multiple input multiple output (MIMO) and closed packaging applications. Design/methodology/approach The size of the antenna is 24 × 24 × 1.6 mm3.
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Double-sided silicon vias (DSSVs) interconnection for large-sized interposer fabrication Microelectron. Int. (IF 1.1) Pub Date : 2023-01-20 Haibo Yang, Fengwei Dai, Liqiang Cao, Guofu Cao, Zhidan Fang, Qidong Wang
Purpose A large-scale detection system with more data in short time bins, small dead space and small signal identification is the ideology the scientists pursuing. These proposed demands are able to be solved by 2.5 D integration. The substance of a 2.5 D integration is called silicon interposer, which consists of the through silicon via (TSV) and redistribution layer. However, the state-of-the-art
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Facile ligand-exchange strategy to promote low-temperature nano-sintering of oleylamine-capped Ag nanoparticles Microelectron. Int. (IF 1.1) Pub Date : 2023-01-16 Liyun Li, Yu Zhang, Shiyu Xia, Zhefei Sun, Junjie Yuan, Dongchuan Su, Hunjun Cao, Xiaoming Chai, Qingtian Wang, Jintang Li, Zhihao Zhang
Purpose This study aims to develop a facile ligand-exchange strategy to promote nano-sintering of oleylamine (OAM)-capped silver nanoparticles (AgNPs). By using ligand exchange process with NH4OH to remove OAM from the surface of AgNP, this study reports effectively reducing the sintering temperature of AgNPs to achieve low-temperature nano-sintering. Compared with untreated AgNPs of OAM-capped, NH4OH-treated
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Effects of interface cracks on reliability of surface mount technology interconnection in service environment Microelectron. Int. (IF 1.1) Pub Date : 2023-01-12 Shaoyi Liu, Songjie Yao, Song Xue, Benben Wang, Hui Jin, Chenghui Pan, Yinwei Zhang, Yijiang Zhou, Rui Zeng, Lihao Ping, Zhixian Min, Daxing Zhang, Congsi Wang
Purpose Surface mount technology (SMT) is widely used and plays an important role in electronic equipment. The purpose of this paper is to reveal the effects of interface cracks on the fatigue life of SMT solder joint under service load and to provide some valuable reference information for improving service reliability of SMT packages. Design/methodology/approach A 3D geometric model of SMT package
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Structural analysis of paper substrate for flexible microfluidics device application Microelectron. Int. (IF 1.1) Pub Date : 2023-01-12 Supriya Yadav, Kulwant Singh, Anmol Gupta, Mahesh Kumar, Niti Nipun Sharma, Jamil Akhtar
Purpose The purpose of this paper is to predict a suitable paper substrate which has high capillary pressure with the tendency of subsequent fluid wrenching in onward direction for the fabrication of microfluidics device application. Design/methodology/approach The experiment has been done on the WhatmanTM grade 1, WhatmanTM chromatography and nitrocellulose paper samples which are made by GE Healthcare
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Recent progress on bumpless Cu/SiO2 hybrid bonding for 3D heterogeneous integration Microelectron. Int. (IF 1.1) Pub Date : 2022-12-27 Ge Li, Qiushi Kang, Fanfan Niu, Chenxi Wang
Purpose Bumpless Cu/SiO2 hybrid bonding, which this paper aims to, is a key technology of three-dimensional (3D) high-density integration to promote the integrated circuits industry’s continuous development, which achieves the stacks of chips vertically connected via through-silicon via. Surface-activated bonding (SAB) and thermal-compression bonding (TCB) are used, but both have some shortcomings
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A high performance RC-INV triggering SCR under 0.25 µm process Microelectron. Int. (IF 1.1) Pub Date : 2022-12-13 Xuebing Su, Yang Wang, Xiangliang Jin, Hongjiao Yang, Yuye Zhang, Shuaikang Yang, Bo Yu
Purpose As it is known, the electrostatic discharge (ESD) protection design of integrated circuit is very important, among which the silicon controlled rectifier (SCR) is one of the most commonly used ESD protection devices. However, the traditional SCR has the disadvantages of too high trigger voltage, too low holding voltage after the snapback and longer turn-on time. The purpose of this paper is
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Defected microstrip structure-based near-end and far-end crosstalk mitigation in high-speed PCBs for mixed signals Microelectron. Int. (IF 1.1) Pub Date : 2022-12-07 Yokesh V., Gulam Nabi Alsath, Malathi Kanagasabai
Purpose The design, fabrication and experimental validation of defected microstrip structure (DMS) are proposed to address the problem of near-end crosstalk (NEXT) and far-end crosstalk (FEXT) between the microstrip transmission lines in a printed circuit board. Design/methodology/approach The proposed DMS evolved with the combination of spur line (L-shaped DMS) and U-shaped DMS topologies. This technique
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A novel S-shaped frequency and pattern reconfigurable patch antenna for 4G LTE, WLAN/Wi-Max application Microelectron. Int. (IF 1.1) Pub Date : 2022-12-06 Pallav Rawal, Sanyog Rawat
Purpose In wireless communication system, use of multiple antennas for different requirements of system will increase the system complexity. However, reconfigurable antenna is maximizing the connectivity to cover different wireless services that operate different frequency range. Pattern reconfigurable antenna can improve security, avoid noise and save energy. Due to their compactness and better performance
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A DFT+U study of structural, electronic and optical properties of Ag- and Cu-doped ZnO Microelectron. Int. (IF 1.1) Pub Date : 2022-11-03 N. Hamzah, M.H. Samat, N.A. Johari, A.F.A. Faizal, O.H. Hassan, A.M.M. Ali, R. Zakaria, N.H. Hussin, M.Z.A. Yahya, M.F.M. Taib
Purpose The purpose of this paper is to investigate the structural, electronic and optical properties of pure zinc oxide (ZnO) and transition metal (Tm)-doped ZnO using Tm elements from silver (Ag) and copper (Cu) by a first-principles study based on density functional theory (DFT) as implemented in the pseudo-potential plane wave in CASTEP computer code. Design/methodology/approach The calculations
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Model of boron diffusion in silicon used for solar cell fabrication based on boric acid solutions Microelectron. Int. (IF 1.1) Pub Date : 2022-10-24 Wojciech Filipowski
Purpose The purpose of this paper is to develop a model that allows determining the boron concentration profile in silicon based on duration and temperature of the diffusion process. Design/methodology/approach The model was developed on the basis of the Fick’s second law, which is fundamental for describing the diffusion process. The explicit scheme of the finite difference method was used in the
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Two-step flash sintering of (Mg1/3Ta2/3)0.01Ti0.99O2 giant dielectric ceramics Microelectron. Int. (IF 1.1) Pub Date : 2022-10-20 Zhentao Wang, Pai Peng, Sujuan Zhong, Yafang Cheng, Dong Xu
Purpose The purpose of this paper on the one hand is to reduce the sintering temperature, shorten the sintering time and improve the electrical properties of the sample through the two-step flash sintering method and on the other hand is to study the effect of electric field on the phase structure, microstructure and electrical properties of the flash sintering sample. Design/methodology/approach In
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Design of radio frequency power amplifier for 2.45 GHz IoT application using 0.18 µm CMOS technology Microelectron. Int. (IF 1.1) Pub Date : 2022-10-18 Nuha Rhaffor, Wei Keat Ang, Mohamed Fauzi Packeer Mohamed, Jagadheswaran Rajendran, Norlaili Mohd Noh, Mohd Tafir Mustaffa, Mohd Hendra Hairi
Purpose The purpose of this study is to show that due to the emergence of the Internet of Things (IoT) industry in recent years, the demand for the higher integration of wireless communication systems with a higher data rate of transmission capacity and lower power consumption has increased tremendously. The radio frequency power amplifier (PA) design is getting more challenging and crucial. A PA for
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Influence of Ag particle shape on mechanical and thermal properties of TIM joints Microelectron. Int. (IF 1.1) Pub Date : 2022-10-13 Marcin Myśliwiec, Ryszard Kisiel, Mirosław J. Kruszewski
Purpose The purpose of this paper is to develop and test the thermal interface materials (TIM) for application in assembly of semiconductor chips to package. Good adhesion properties (>5 MPa shear strength) and low thermal interface resistance (better than for SAC solders) are the goal of this research. Design/methodology/approach Mechanical and thermal properties of TIM joints between gold plated
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Optimization of 1-µm gate length InGaAs-InAlAs pHEMT Microelectron. Int. (IF 1.1) Pub Date : 2022-10-11 Naeemul Islam, Nur Syahadah Yusof, Mohamed Fauzi Packeer Mohamed, Syamsul M., Muhammad Firdaus Akbar Jalaludin Khan, Nor Azlin Ghazali, Mohd Hendra Hairi
Purpose The purpose of this study is to demonstrate a pseudomorphic High Electron Mobility Transistor (pHEMT) cutoff frequency (fT) and maximum oscillation frequency (fmax) are determined by the role of its gate length (Lg). Theoretically, to obtain an Lg of 1 µm, the gate’s resist opening must be 1 µm wide. However, after the coat-expose-develop (C-E-D) process, the Lg became 13% larger after metal
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Atomic structure for AlN grown on different plane orientation of sapphire via numerical study Microelectron. Int. (IF 1.1) Pub Date : 2022-10-11 Mazwan Mansor, Syamsul M., Yusnizam Yusuf, Mohd Nazri Abdul Rahman
Purpose This study aims to present a numerical study of atomic structure for aluminium nitride (AlN) when the crystal was assumed grown on different orientation of sapphire substrate. The change of the AlN atomic structure with sapphire orientation was associated to the interface between the AlN and the sapphire. The results from this study would provide a guideline in selecting suitable orientation
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W-band antenna in package module with hybrid glass-compound WLFO process Microelectron. Int. (IF 1.1) Pub Date : 2022-09-30 Gang Wang, Chenhui Xia, Bo Wang, Xinran Zhao, Yang Li, Ning Yang
Purpose A W-band antennas-in-packages (AIP) module with a hybrid stacked glass-compound wafer level fan-out process was presented. Heterogeneous radio frequency (RF) chips were integrated into one single module with a microscale fan-out process. This paper aims to find a new strategy for 5G communication with 3D integration of multi-function chips. Design/methodology/approach The AIP module was composed
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Effects of 60Co γ ray radiation on the transmission characteristics of interconnection structures for 3D packaging Microelectron. Int. (IF 1.1) Pub Date : 2022-09-22 Youxin Zhang, Yang Liu, Rongxing Cao, Xianghua Zeng, Yuxiong Xue
Purpose Concerning the radiation effects on the three-dimensional (3D) packaging in space environment, this study aims to investigate the influence of the total dose effect on the transmission characteristics of high-frequency electrical signals using experimental and simulation methods. Design/methodology/approach This work carries out the irradiation test of the specimens and measures their S21 parameters
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Au-coated Ag alloy bonding wires with enhanced oxidation resistance for electronic packaging applications Microelectron. Int. (IF 1.1) Pub Date : 2022-09-21 Yuchen Xiao, Huiyi Tang, Hehe Zhang, Xiaoling Yang, Ling Sun, Yong Xie, Baoan Wu, Baifeng Luan, Weidong Xie, Xinnan Cai
Purpose The purpose of this paper is to develop high-performance Au-coated Ag alloy wires (ACAA wires) and demonstrate the effect of Au coating layers on the bonding performance and oxidation resistance for stable and reliable electronic packaging applications. Design/methodology/approach ACAA wire with a diameter of approximately 25 µm and Au layer thickness of approximately 100 nm were prepared by
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Surface quality prediction and lapping process optimisation on the fixed-abrasive lapping plate of sapphire wafers Microelectron. Int. (IF 1.1) Pub Date : 2022-08-24 Yanfu Wang, Xin Wang, Lifei Liu
Purpose Lapping is a vital flattening process to improve the quality of processed semiconductor wafers such as single-crystal sapphire wafers. This study aims to optimise the lapping process of the fixed-abrasive lapping plate of sapphire wafers with good overall performance [i.e. high material removal rate (MRR), small surface roughness (Ra) of the wafers after lapping and small lapping plate wear
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Fabrication of UV ZnO NRS photodetector based on seeded silicon substrate via the drop-casting technique Microelectron. Int. (IF 1.1) Pub Date : 2022-08-23 Shireen Mohammed Abed, Sabah M. Mohammad, Zainuriah Hassan, Aminu Muhammad, Suvindraj Rajamanickam
Purpose The purpose of this study is to fabricate an ultraviolet (UV) metal-semiconductor-metal (MSM) photodetector based on zinc oxide nanorods (ZnO NRs) grown on seeded silicon (Si) substrate that was prepared by a low-cost method (drop-casting technique). Design/methodology/approach The drop-casting method was used for the seed layer deposition, the hydrothermal method was used for the growth of
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Microstructure and properties of ZnO-Bi2O3-based varistor ceramics via flash sintering Microelectron. Int. (IF 1.1) Pub Date : 2022-08-16 Ming Jiang, Mengyang Shi, Jiamao Li, Juan Liu, Lei Zhang, Jian Qin, Yongtao Jiu, Bin Tang, Dong Xu
Purpose This paper aims to study the effects of MnO2 on the ZnO–Bi2O3-based varistor prepared via flash sintering (FS) Design/methodology/approach MnO2-doped ZnO–Bi2O3-based varistors were successfully prepared by the FS with a step-wise increase of the .current in 60 s at the furnace temperature <750°C under the direct current electric field of 300 V cm−1. The FS process, microstructure and the electrical
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An improved parallel five-level reinjection CSC for self-commutation of thyristor converter Microelectron. Int. (IF 1.1) Pub Date : 2022-07-29 Yumei Song, Jianzhang Hao, Changhao Dong, Xizheng Guo, Li Wang
Purpose This paper aims to study a multi-level reinjection current source converter (MLR-CSC) that adds attracting properties such as the self-commutation and pulse multiplication to the thyristor converter, which is of great significance for increasing the device capacity and reducing current harmonics on the grid side. Particularly, designing advantageous driving methods of the reinjection circuit
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Key techniques of ultra-low-power ADC and miniaturized RF transceiver circuits for 4G/LTE applications Microelectron. Int. (IF 1.1) Pub Date : 2022-07-15 Muhammad Yasir Faheem, Muhammad Basit Azeem, Abid Ali Minhas, Shun'an Zhong, Xinghua Wang
Purpose RF transceiver module is considered a vital part of any wireless communication system. This module consists of two important parts the RF transceiver and analog-to-digital converter (ADC). Usually, both these parts – RF transceiver and ADC – are used to enhance the perspective of size and power. The data processing in 4G communication makes hurdles and need research attention to make it faster
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Polyimide substrate textured by copper-seeding technique for enhanced light absorption in flexible black silicon Microelectron. Int. (IF 1.1) Pub Date : 2022-07-15 Halo Dalshad Omar, Auwal Abdulkadir, Md. Roslan Hashim, Mohd Zamir Pakhuruddin
Purpose This paper aims to present investigation on textured polyimide (PI) substrate for enhanced light absorption in flexible black silicon (bSi). Design/methodology/approach Flexible bSi with thickness of 60 µm is used in this work. To texture the PI substrate, copper-seeding technique is used. A copper (Cu) layer with a thickness of 100 nm is deposited on PI substrate by sputtering. The substrate
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Packaging design and thermal analysis for 1 mm2 high power VCSEL Microelectron. Int. (IF 1.1) Pub Date : 2022-07-15 Khairul Mohd Arshad, Muhamad Mat Noor, Asrulnizam Abd Manaf, Kawarada H., Falina S., Syamsul M.
Purpose Vertical-cavity surface-emitting laser (VCSEL) is a high-performance semiconductor device made of unique epitaxial layers grown on n-type GaAs or InP substrates. The VCSEL’s thermal resistance, Rth, is an essential metric that reflects its thermal properties and dependability. The purpose of this paper is to develop packaging for 1 mm2 VCSEL chips made of a variety of materials, such as ceramic
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Fabrication of fluorine and silver co-doped ZnO photodetector using modified hydrothermal method Microelectron. Int. (IF 1.1) Pub Date : 2022-06-14 Aminu Muhammad, Sabah M. Mohammad, Zainuriah Hassan, Suvindraj Rajamanickam, Shireen Mohammed Abed, M.G.B. Ashiq
Purpose The purpose of this study is to dope silver (Ag) and fluorine (F) in zinc oxide (ZnO) for the enhancement of electrical and optical properties of ZnO, as previous studies reported the improvement of these properties using individual doping of F and Ag. In this paper, F and Ag co-doped ZnO nanorods were synthesized using a modified hydrothermal method. Design/methodology/approach The hydrothermal
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Effects of indium composition on the surface morphological and optical properties of InGaN/GaN heterostructures Microelectron. Int. (IF 1.1) Pub Date : 2022-06-10 Nur Atiqah Hamzah, Mohd Ann Amirul Zulffiqal Md Sahar, Aik Kwan Tan, Mohd Anas Ahmad, Muhammad Fadhirul Izwan Abdul Malik, Chin Chyi Loo, Wei Sea Chang, Sha Shiong Ng
Purpose This study aims to investigate the effects of indium composition on surface morphology and optical properties of indium gallium nitride on gallium nitride (InGaN/GaN) heterostructures. Design/methodology/approach The InGaN/GaN heterostructures were grown on flat sapphire substrates using a metal-organic chemical vapour deposition reactor with a trimethylindium flow rate of 368 sccm. The indium
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Real-time contact angle’s measurement of molten solder balls in laboratory conditions Microelectron. Int. (IF 1.1) Pub Date : 2022-06-08 Daniel Dzivy, Alena Pietrikova
Purpose The purpose of this paper is to show a possibility to measure a change of a contact angle during the melting in real-time and to reveal significant factors of a wettability. Influence of the flux with combination of plasma on copper surface was investigated in experiment as well. Design/methodology/approach Laboratory equipment consists of heating and optical part that was developed and tested
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Miniaturized bandwidth reconfigurable microwave bandpass filter Microelectron. Int. (IF 1.1) Pub Date : 2022-06-06 Ponnammal P., Manjula J.
Purpose Modern wireless communications need novel microwave components that can be effectively used for high data rate and low-power applications. The operating environment decides the severity of the noise coupled to the transceiver system from the ambient environment. In a deep fading environment, narrowband systems fail where the wideband systems come for rescue. Thus, the microwave components are
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Influence of different etching methods on the structural properties of porous silicon Microelectron. Int. (IF 1.1) Pub Date : 2022-05-19 Fatimah Zulkifli, Rosfariza Radzali, Alhan Farhanah Abd Rahim, Ainorkhilah Mahmood, Nurul Syuhadah Mohd Razali, Aslina Abu Bakar
Purpose Porous silicon (Si) was fabricated by using three different wet etching methods, namely, direct current photo-assisted electrochemical (DCPEC), alternating CPEC (ACPEC) and two-step ACPEC etching. This study aims to investigate the structural properties of porous structures formed by using these etching methods and to identify which etching method works best. Design/methodology/approach Si
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Synthesis and characterization of ZnO based varistor ceramics: effect of sintering temperatures Microelectron. Int. (IF 1.1) Pub Date : 2022-05-17 Ahmed Bouchekhlal, Mohammed Boulesbaa
Purpose The purpose of this paper is to investigate the effects of the sintering temperature on the microstructural, morphological and electrical characteristics of Zinc oxide (ZnO)-based varistors. Design/methodology/approach This study used a conventional method to design and produce ZnO varistors by sintering ZnO powder with small amounts of various metal oxides. Furthermore, the effect of sintering
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Design and implementation of miniaturized tri-band microwave bandpass filter Microelectron. Int. (IF 1.1) Pub Date : 2022-05-10 Ponnammal P., Manjula J.
Purpose This paper is aimed to study the design of a miniaturized filter with tri-band characteristics. In this paper, perturbation is used to realize circuit miniaturization and multi-band by exploiting the inductive property. During this process, vias are added for twofold benefit, namely, circuit miniaturization and enhanced frequency selectivity at high frequency. Thus, with the introduction of
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Effect of alloy particle size and stencil aperture shape on solder printing quality Microelectron. Int. (IF 1.1) Pub Date : 2022-05-05 Mohamad Solehin Mohamed Sunar, Maria Abu Bakar, Azman Jalar, Mohamad Riduwan Ramli, Fakhrozi Che Ani
Purpose Reflow solder joint quality is significantly affected by the ability of the solder to perfectly fill pad space and retain good solder joint shape. This study aims to investigate solder joint quality by quantitatively analyzing the stencil printing-deposited solder volume, solder height and solder coverage area. Design/methodology/approach The dispensability of different solder paste types on