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Packaged Microwave Displacement Sensors With Wideband Filtering Function IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-14 Zhuowei Zhang, Gang Zhang, Kam-Weng Tam, Chi-Hou Chio, Xin Zhou, Teng Cheng, Ngai Kong
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A Synthesis Theory of Stripline Dual-Band Filtering Power Divider with Controllable Full-frequency Isolation IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-13 Taiyang Xie, Xiaolong Wang, Lei Zhu, Geyu Lu
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Origami-Driven Manufacturing of Reflectarrays or Transmitarrays with Feeds and Fixture IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-12 Kuan-Yu Ko, Fei-Peng Lai, Yen-Sheng Chen
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Influence of inhomogeneous anisotropic Copper grains in TSV on the thermo-mechanical behaviors in the annealing process IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-12 Yunpeng Zhang, Can Sheng, Shizhao Wang, Tianjian Liu, Zhongjie Gao, Sheng Liu
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Design of Absorptive Common-Mode Filters Based on Coupled Stripline λ/4 Resonator IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-12 Yi-Hao Ma, Yu-Bin Chen, Qi-Qiang Liu, Wen-Sheng Zhao
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A Stepwise Integration Separation of Variables Solver for Full-Chip Thermal Uncertainty Analysis IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-08 Luqiao Yin, Ao Wang, Wenxing Zhu, Aiying Guo, Jingjing Liu, Min Tang, Liang Chen, Jianhua Zhang
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Solar-Thermal Synthesized Graphitic Heat Spreader for Thermally Enhanced Organic Substrates IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-07 Min Jong Kil, Eythan Lam, Mostafa Abuseada, James F. Buckwalter, Timothy S. Fisher
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Effect of warpage on solder joint fatigue life by influencing the solder joint shape in BGA packages IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-05 Wei Shen, Zhenyang Lei, Kang Liang, Gai Wu, Tian Zeng, Sheng Liu
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Research on high-precision oxygen partial pressure sensor based on TDLAS technology IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-03-05 Feng He, Songhui Li, Bing Liu, Zhong Jin, Jinyu Li, Fangting Liu, Junhui Li
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Silicate-based Packaging Materials for Heterogeneous Integration of Microsystems IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-02-28 Ryan T. Benz, Devon Beck, Connor Belanger, Al Cabral, Matthew Ricci, Carl V. Thompson, Bradley Duncan
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A Micro SOI Pressure Sensor with Compensation hole for High Temperature Applications IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-02-28 Fangting Liu, Feng He, Xin Tang, Junhui Li
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Design and Transient Analysis of a 650V/150A GaN Power Modules with Integrated Bias Power and Gate-drive Circuit IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-02-28 Liyan Zhu, Yu Yan, Hua Bai
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Proof-of-Concept for an On-Chip Kelvin-Emitter RTD Sensor for Junction Temperature Monitoring of IGBTs IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-02-28 Nick Baker, Laurent Dupont, Szymon Michal Beczkowski, Francesco Iannuzzo
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Two-Phase Liquid Cooling for High-Power Microelectronics via Embedded Micro-Pin Fin Heat Sink IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-02-28 Huicheng Feng, Gongyue Tang, Xiaowu Zhang, Boon Long Lau, Ming Chinq Jong, Keng Yuen Jason Au, Jun Wei Javier Ong, King Jien Chui, Jun Li, Hongying Li, Duc Vinh Le, Jing Lou
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Gate Voltage Oscillation Mitigation in Solid-State Circuit Breakers with Single-Gate Driven Series-Connected Power Devices IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-02-28 Xinran Liang, Peichao Xu, Zhuowei Xie, Yang Xu, Miaoran Zhang, Tianwei Feng, Huiqing Wen
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Ultra-Miniaturized, High-Performance Filters on Alumina Ribbon Ceramic Substrates for 5G Small-Cell Applications IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-02-27 Nahid Aslani-Amoli, Fuhan Liu, Madhavan Swaminathan, Cheng-Gang Zhuang, Nikolay Z. Zhelev, Seong-Ho Seok, Cheolbok Kim
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PADS: Predictive Anomaly Detection for SMT Solder Joints Using Novel Features from SPI and Pre-AOI Data IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-02-26 Nieqing Cao, Daehan Won, Sang Won Yoon
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Toward Direct Cooling In High Voltage Power Electronics: Dielectric Fluid Microchannel Embedded Source Bussing Terminal IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-02-23 Ange-Christian Iradukunda, Bakhtiyar M. Nafis, David Huitink, Yuxiang Chen, H. Alan Mantooth, Geoff Campbell, David Underwood
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Study of interaction between Reflow solder flux and humidity in relation to failures in electronics IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-02-23 Anish Rao Lakkaraju, Helene Conseil-Gudla, Rajan Ambat
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Development of a Hybrid Capillary-driven Single-phase and Two-phase Micro-cooler for Power Electronics Cooling IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-02-22 Yujui Lin, Heungdong Kwon, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, H. Alan Mantooth, Kenneth E. Goodson
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State-of-the-art of Cu-Cu Hybrid Bonding IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-02-22 John H Lau
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Self-Packaged Wideband Filtering Baluns Based on Suspended Coplanar Waveguide-Microstrip Hybrid IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-02-16 Jian-Kang Xiao, Rong-Tao Wu, Xiao-Fang Li
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Comparative Drop Shock Reliability Study of SAC-Based Alloys in BGA Assemblies IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-02-13 Palash Pranav Vyas, Ali Alahmer, Seyed Soroosh Alavi, Mohamed El Amine Belhadi, Sa’d Hamasha
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On the Design of a Fast Mechanical Switch-Based Amplified Piezoelectric Actuator IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-02-02 Mohmmad Al-Dweikat, Guogang Zhang, Yu Liu, Jian Cui
Fast mechanical switches (FMSs) play a significant role in the control and protection of dc power systems. The need for fast response, rapid actuating, and compact size actuators is the key enabler for the development of future dc grids. Regardless of their stroke limitation, piezoelectric actuators are fast, very controllable, and highly reliable. They can fit in FMSs or disconnectors designed for
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Fracture Mechanism of Sintered Silver Film Revealed by In Situ SEM Uniaxial Tensile Loading IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-01-31 Keisuke Wakamoto, Daisuke Yasugi, Takukazu Otsuka, Ken Nakahara, Takahiro Namazu
This article investigates the mechanism of brittle-ductile deformation and fracture for sintered silver (s-Ag) film by means of in situ scanning electron microscopy (SEM) uniaxial tensile loading at room temperature (RT) and 300 °C. The s-Ag film specimen originating from nano-Ag paste, including 18-nm-diameter Ag particles, is sintered at 300 °C under 60-MPa pressure. A precrack and slope surface
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Reducing Thermal Interface Resistance by Oxygen Plasma Treatment for FCBGA Advanced Package IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-01-31 Mingming Yi, Ping Wu, Yiou Qiu, Jing Wen, Wenhui Zhu, Liancheng Wang
With the miniaturization and functionalization of electronic equipment, the problem of chip heat dissipation has become a serious challenge. In this article, a plasma reaction technology is applied to improve the heat dissipation performance between the thermal interface material (TIM) and the heat spreader. Oxygen plasma can not only improve the surface wettability of the heat spreader, but also form
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Investigation of the Surface Roughness Effect on the Performance of an X-Band RF Filter Manufactured by Laser Powder Bed Fusion IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-01-30 Akin Arslan, Emrecan Soylemez
Additive manufacturing (AM) offers the advantage of producing parts layer by layer, enabling the creation of intricate geometries with shorter production times. These benefits provide an opportunity to manufacture complex-shaped microwave technology parts, such as waveguides and radio frequency (RF) filters, which are conventionally difficult, costly, or impossible to manufacture. However, certain
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Analysis Method of Multilayer Ceramic Capacitor Fracture by the Phase-Field IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-01-29 Donghui Li, Yuguang Zhong, Xue Zhou, Guofu Zhai
The traditional method assesses the impact of fractures on electronics by calculating test results for many samples, which ignores variation in manufacturing parameters between individuals and does not accurately reflect the actual state. This article proposes a fracture analysis method for multilayer ceramic capacitors (MLCC) by the phase field because of complex structures and diverse manufacturing
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Enhanced Heat Spreading Performance of Printed Circuit Boards by Vapor Chamber Implementation IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-01-26 Jui-Cheng Yu, Chien-Neng Liao, Yu-Hsiang Chang, Hung-Hsien Huang, Chen-Chao Wang, Chin-Pin Hung
Efficient heat dissipation from active chips on printed circuit boards (PCBs) is crucial for high-power applications. Various techniques have been employed to reduce the chip junction temperature in microelectronic packages, including thermal via deployment, copper coin technology, and heat pipe (HP) integration. Vapor chambers (VCs), which operate similar to HPs by phase transformation and capillary
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A Two-Stage Optimization Method of High-Power DWPT System for Electric Vehicle IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-01-25 Junyi Li, Liyan Zhang, Xixiu Wu, Yuren Wang, Qihong Chen
Dynamic wireless power transfer (DWPT) technology provides a more convenient and safe charging method for electric vehicles. Power density $\alpha $ and transmission efficiency $\eta $ are the key indices of DWPT systems. This article proposes a two-stage optimization method with $\alpha $ – $\eta $ as the optimization objective and the coupling and resonant part as the optimization part. The method
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Electrical Characterization of Shielded TSVs With Airgap Isolation for RF/mmWave Applications IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-01-24 Shane Oh, Ting Zheng, Muhannad S. Bakir
In this article, shielded and airgap-isolated through-silicon vias (TSVs) are fabricated and measured up to 50 GHz. The unique TSV configuration is low-loss and electrically shielded, and the fabrication process includes a trench encapsulation process, improving surface planarity. TSV is an essential technology in heterogeneous integration, allowing chip manufacturers to stack disaggregated chiplets
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On the Use of an In-Package Dielectric Lens Antenna for Radar-Based Applications IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-01-18 Hajar Abedi, Ala Eldin Omer, John Hanna, Ahmad Ansariyan, Steven Ding, Andrei Felipe Perez, Tom Paraschuk, Plinio P. Morita, Jennifer Boger, Alexander Wong, Safieddin Safavi-Naeini, George Shaker
Extensive research on millimeter-wave (mm-wave) chipset solutions has led to a reduction in size and cost while adding sensitivity and accuracy. Recent mm-wave chipset solutions using antenna-in package approaches were developed for various applications with wide beamwidth and low gain. However, for some applications, such as gait monitoring in a long corridor/hallway, there is a strong need to achieve
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A Low-Temperature Hybrid Bonding Using Copper and Parylene for Heterogeneous Integration IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-01-17 Vikram Maharshi, Aamir Saud Khan, Ajay Agarwal, Bhaskar Mitra
This work demonstrates a low-temperature hybrid bonding integrating copper and Parylene-C for 3-D integration. The Parylene was deposited using a chemical vapor deposition process over electroplated copper bumps followed by chemical mechanical polishing (CMP) to planarize copper/parylene topology and flatten the roughness of a copper surface. The parylene shows a higher tolerance for height topology
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A Laser-Assisted Thermal Gradient Transient Liquid Phase Bonding Process Design for Thermally Sensitive Components in Hermetic Packaging IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-01-17 Shizun Hu, Jiaqi Song, Yu Liu, Chenran Wu, Tianhao Lei, Anxu Ge, Donglin Zhang, Xiuchen Zhao, Yongjun Huo, Chin C. Lee
In this article, we propose a thermal gradient mechanism-based laser-assisted bonding (TG-LAB) process, which can be used for the hermetic package of thermally sensitive components. The traditional transient liquid phase (TLP) method can realize the hermetic package of electronic devices. However, the whole structure needs to be heated during the packaging process, and it needs to be kept at a high
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Solderless Coax-to-Microstrip Connector up to 67 GHz Using Capsule Clearance Transition and Neural Network Optimization IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-01-16 Chin-Hsun Wang, Jun-Rui Huang, Jason Chen, Ruey-Beei Wu
As data rate increases into tens of gigahertz, the signal integrity for interconnects is compromised, so test connectors cannot be used at broadband and high frequencies. For the design of vertical solderless connectors from dc to 67 GHz, this study proposes a structure that uses a capsule clearance in layers 2–4 to mitigate return loss in the coax-to-microstrip transition region. A full-wave simulation
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Proposal and Analysis of Coaxial-Through-Glass Vias in 3-D Integration Using Multiresolution Time-Domain (MRTD) Technique IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-01-15 K. Madhu Kiran, Brajesh Kumar Kaushik, Rohit Dhiman
Coaxial through-glass via (coaxial-TGV), one of the promising 3-D integration solutions, can offer a reliable and high-performance signal transmission through a glass substrate at high frequencies. This article utilizes electromagnetic theory to derive analytical closed-form formulas for calculating the per-unit-length resistance and inductance of a coaxial-TGV configuration filled with the isolation
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A Low-Cost 60-GHz Modular Front-End Design for Channel Sounding IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-01-12 Muhammad Umar, Martin Laabs, Niels Neumann, Dirk Plettemeier
Millimeter-wave (mmWave) frequency bands are attractive for bandwidth (BW)-intensive applications. However, scholarly articles revealing straightforward and repeatable modular construction of mmWave front ends are scarce. Channel sounding, which is critical due to the distinct propagation characteristics of mmWaves, is predominantly done through bulky and expensive laboratory equipment due to the lack
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Characterization and Performance Improvement of Bondwire Interconnects in QFN Packages for Bandpass mm-Wave Applications IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-01-10 Pouya Namaki, Nasser Masoumi, Mohammad-Reza Nezhad-Ahmadi
In this article, the input and output impedances of the bondwire interconnects in quad flat no-lead (QFN) packages are extracted and analyzed over the wide frequency range of dc–100 GHz. It is shown that knowing the impedance parameters of a transition makes it simpler and faster to optimize the structure for a desired operating frequency. Using extracted impedance properties, a compensation bondwire
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Analysis and Design of the Interposer PDN With Optimal Arrangement of Decoupling Capacitors IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-01-10 Yang Wang, Gang Dong, Changle Zhi, Yinghao Feng, Zhangming Zhu, Yintang Yang
With the ever-increasing integration density of electronic systems and reduced noise margins, maintaining high power integrity has become a formidable challenge in the design of high-performance 3-D integrated circuits (3D ICs). To enhance power integrity, the insertion of decoupling capacitors (decaps) has proven to be an important and effective solution. However, existing decoupling capacitor optimization
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Air-Filled SIWs Using Laminate Dielectrics on Glass Substrate for D-Band Applications IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-01-09 Mutee ur Rehman, Lakshmi Narasimha Vijay Kumar, Serhat Erdogan, Madhavan Swaminathan
This article presents the first demonstration of Astra-based air-filled Substrate Integrated Waveguides (SIWs) in D-band (110 to 170 GHz). The material stack-up consists of two $63.5~\mu \text{m}$ thick Astra MT77 layers laminated together by $5~\mu \text{m}$ thick Ajinomoto Buildup Film (ABF) GL102 dry film. The top metal layer is patterned on the first Astra layer using a Semi-additive process (SAP)
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Effects of Interface Structure on the Mechanical Properties and Deformation Mechanisms of Copper–Tantalum Interface via Molecular Dynamic Simulation IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-01-08 Zhongjie Gao, Can Sheng, Shizhao Wang, Lianghao Xue, Yunpeng Zhang, Sheng Liu
Through silicon via (TSV) is a core technology in 3-D integration. Interface failure is one of the most noted failure forms of TSV. The barrier layer Ta, which is between the media Cu and the insulating layer SiO2, is often neglected due to its small thickness. However, the Cu/Ta interface is prone to cracking and debonding, thus plays an important role in TSV interface reliability. In this work, the
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A Novel Compact Dual-Functional Circuit With Differential-Mode Equalization and Broadband Common-Mode Suppression Using Patterned Ground Plane IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-01-08 Yu-Ren Chen, Yi-Ting Lin, Tzong-Lin Wu
A new passive differential-mode equalizer (DME) equipped with the function of common-mode (CM) suppression is proposed by using differential shunt stubs (DSSs) and patterned ground structure (PGS). The DSS is mainly responsible for generating the high-pass response in differential mode to achieve the equalization effect with a data rate of up to 10 Gbps, while the PGS is responsible for creating the
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LTCC With Temperature Sensor Array for Monitoring of Reactive Die Bond Processes–Design Optimization Using CFD IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-01-05 Adam Yuile, Steffen Wiese
This article discusses a design optimization for the integration of a temperature sensor array for monitoring the spatially distributed course of process temperature during a reactive die bond process. Since reactive multilayer systems produce the entire fusion heat in a millisecond time frame, it is very difficult to get information about the dynamics of a joining process that they are employed for
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Solder Joint Geometry Effects on Thermomechanical Fatigue Lifetime of End-Capped Chip Component Assemblies IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-01-05 Vincent Voet, Christophe De Fruytier, Thomas Pardoen, Aude Simar
Electronic component assemblies are exposed to thermal cycles that lead to the thermomechanical fatigue of the solder joints. The effect of the joint geometry on the fatigue lifetime of the assembly is investigated for rectangular end-capped chip components in order to both increase the predictive capabilities of integrity assessment schemes and to guide toward more durable designs. A two-step approach
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Our Thanks to Reviewers IEEE Transactions on Components, Packaging, and Manufacturing Technology IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-01-05
The individuals listed below have reviewed papers for the IEEE Transactions on Components, Packaging, and Manufacturing Technology publications during the past year. Serving as a Reviewer for the IEEE Transactions is a critical service necessary to maintain the quality of our publication and to provide the authors with a valuable peer review of their work.
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Terahertz Nondestructive Characterization of Conformal Coatings for Microelectronics Packaging IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-01-01 Haolian Shi, Serena Calvelli, Min Zhai, Marco Ricci, Stefano Laureti, P. Singh, H. Fu, Alexandre Locquet, D. S. Citrin
Measuring the thickness of conformal coatings (CCs) and detecting defects in a nondestructive and noncontact fashion are important to ensure the reliability and performance of packaged electronic components and systems. In this study, we explore the application of terahertz (THz) time-of-flight tomography (TOFT), a noncontact and nondestructive method applied to conformal-coating thickness. We measure
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Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2024-01-01 Bowen Zhang, Xinyan Lu, Haoxiang Ma, Di Wang, Yun-Hui Mei
The spontaneous aggregation and weak stability of nanosilver particles largely overshadowed the application of nanosilver paste as die-attach materials in wide bandgap (WBG) devices. Taking advantage of the self-decomposition of silver-ammonia complexes to form silver particles, a novel particle-free silver paste was successfully developed to achieve higher sintering driving force as well as bonding
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Design of Filtering Crossover Based on 180° Filtering Couplers IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2023-12-26 Qiang Shao, Ning Yang, Rui-Sen Chen, Guan-Long Huang, Fu-Chang Chen, Yi Wang
This article presents a novel crossover with an embedded bandpass filter function. The crossover is derived from the traditional crossover based on a tandem connection of two 3-dB 90° couplers by substituting them with 180° filtering couplers and introducing a filter function. In addition, a 180° phase shift realized by coupled resonators is added to keep the two cross paths in phase. The equivalent
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Electrical Contact Resistance Evolution and Interface Fretting Wear Characteristics of Conductor-Parallel Groove Clamp System Response to Breeze Vibration Environment IEEE Trans. Compon. Packag. Manuf. Technol. (IF 2.2) Pub Date : 2023-12-25 Jinye Wang, Yu Feng, Meng Cai, Wenxin He, Wei Wang
The issue of fretting wear failure of electrical contacts in conductor-parallel groove clamp system might be brought on by breeze vibration. This study discusses the fretting wear behavior of overhead conductor-wire clamp systems in wind-vibration environments and uses energy spectrometry, laser confocal microscopy, and scanning electron microscopy to analyze the wear surfaces and their morphology