Purpose Glass is a promising interposer substrate for 2.5 D integration; yet detailed analysis of the interfacial reliability of through-glass vias (TGVs) has been lacking. The purpose of this paper is to investigate the design and material factors responsible for the interfacial delamination in TGVs and identify methods to improve reliability. Design/methodology/approach The interfacial reliability

Purpose Owing to recent challenges of CMOS manufacturing and power consumption in silicon technologies among alternative technologies, Nanomagnetic logic (NML) is one of the most promising technologies, so it was selected for this study. NML is non-volatile with ultra-low power dissipation that operates at room temperature. This paper aims to propose novel implementation of 2% and 4% multiplexers (MUXs)

Purpose The purpose of this paper is to investigate the effect of high-k material HfO2 as a buffer layer for the fabrication of metal-ferroelectric-insulator-silicon (MFeIS) structures on Si (100) substrate. Design/methodology/approach RF-sputtered Pb[Zr0.35Ti0.65]O3 or (PZT) and plasma-enhanced atomic layer deposited HfO2 films were selected as the ferroelectric and high-k buffer layer, respectively

Purpose The purpose of this study is to find a new design that can increase the sensitivity of the sensor without sacrificing the linearity. A novel and very efficient method for increasing the sensitivity of MEMS pressure sensor has been proposed for the first time. Rather than perforation, we propose patterned thinning of the diaphragm so that specific regions on it are thinner. This method allows

Purpose This paper aims to study a high-temperature (up to 200 °C) data acquisition and processing circuit for logging. Design/methodology/approach With the decrease in thermal resistance by system-in package technology and exquisite power consumption distribution design, the circuit worked well at high temperatures environment from both theoretical analysis and real experiments evaluation. Findings

Purpose This study aims to characterize a novel glass/epoxy architecture sandwich structure for electronic boards. Understanding the thermo-mechanical behavior of these composites is important because it is possible to pre-determine whether defined “internal” thick laminates will be suitable for embedding components in the direction of the axis “z,” i.e. this method of manufacturing multilayer laminates

Purpose This paper aims to assess precise correlations between intermetallic compounds (IMCs) microstructure evolutions and the reliability of micro-joints with a Cu/SAC305solder/Ni structure using thermal shock (TS) tests. Design/methodology/approach This paper uses 200-µm pitch silicon flip chips with nickel (Ni) pads and stand-off height of approximately 60 µm, assembled on substrates with copper

Purpose The emulation of synapses is essential to neuromorphic computing systems. Despite remarkable progress has been made in the two-terminal device (memristor), three-terminal transistors evoke greater attention because of the controlled conductance between the source and drain. The purpose of this paper is to investigate the synaptic plasticity of the TiO2 nanowire transistor. Design/methodology/approach