Purpose The purpose of this study is to present a systematic investigation of the effect of high temperatures on transport characteristics of nitrogen-doped silicon carbide nanowire-based field-effect transistor (SiC-NWFET). The 3C-SiC nanowires can endure high-temperature environments due to their wide bandgap, high thermal conductivity and outstanding physical and chemical properties. Design/methodology/approach

Purpose The purpose of this paper is to enhance the efficiency of the LED by introducing three-step magnesium (Mg) doping profile. Attention was paid to the effects of the Mg doping concentration of the first p-GaN layer (i.e. layer close to the active region). Attention was paid to the effects of the Mg doping concentration of the first p-GaN layer (i.e. layer close to the active region). Design/

Purpose Si-based micro electro mechanical systems (MEMS) magnetometer does not require specialized magnetic materials avoiding magnetic hysteresis, ease in fabrication and low power consumption. It can be fabricated using the same processes used for gyroscope and accelerometer fabrication. The paper reports the dicing mechanism for the released MEMS xylophone magnetic sensor fabricated using wafer

Purpose The aims of this paper is to study the effects of the V/III ratio of indium gallium nitride (InGaN) quantum wells (QWs) on the structural, optical and electrical properties of near-ultraviolet light-emitting diode (NUV-LED). Design/methodology/approach InGaN-based NUV-LED is successfully grown on the c-plane patterned sapphire substrate at atmospheric pressure using metal organic chemical vapor

Purpose The purpose of this study is to investigate the influence of AlN nucleation thickness in reducing the threading dislocations density in AlN layer grown on sapphire substrate. Design/methodology/approach In this work, the effect of the nucleation thickness at 5 nm, 10 nm and 20 nm on reducing the dislocation density in the overgrown AlN layer by metal organic chemical vapor deposition was discussed

Purpose The purpose of this paper is to investigate the effect of growth temperature on the evolution of indium incorporation and the growth process of InGaN/GaN heterostructures. Design/methodology/approach To examine this effect, the InGaN/GaN heterostructures were grown using Taiyo Nippon Sanso Corporation metal-organic chemical vapor deposition (MOCVD) SR4000-HT system. The InGaN/GaN heterostructures

Purpose This paper aims to report the influence of sputtering plasma deposition time on the structural and mechanical properties of the a-axis oriented aluminium nitride (AlN) thin films. Design/methodology/approach The AlN films were prepared using RF magnetron sputtering plasma on a silicon substrate without any external heating with various deposition times. The films were characterized using X-ray

Purpose The purpose of this paper is to present the performance of an 8-bit hybrid DAC which is suitable for wireless application or part of a built-in test block for ADC. The hybrid architecture used is the combination of thermometer coding and binary-weighted resistor architectures. Design/methodology/approach The conventional DAC topology performance tends to degrade at high-resolution applications

Purpose The purpose of this study is to address the issue of technology equipment formerly dedicated to the process of 4- and even 5-inch photovoltaic cells and whose use has become critical with the evolution of silicon wafer size standards (M2–M10). Fortunately, the recent concept of 6'' half-cut cell with its many advantages appears promising insofar as it offers the possibility of further extend

Purpose The purpose of this study is the design, fabrication and evaluation of a miniature ozone generator using the principle of electric discharge are presented. Design/methodology/approach The device was fabricated using a low-temperature co-fired ceramics (LTCC) technology, by which a multilayered ceramic structure with integrated electrodes, buried channels and cavities in micro and millimeter

Purpose Optimization of light-emitting diodes’ (LEDs’) design together with long-term reliability is directly correlated with their photometric, electric and thermal characteristics. For a given thermal layout of the LED system, the maximum luminous flux occurs at an optimal electrical input power and can be determined using a photo-electro-thermal (PET) theory. The purpose of this study is to extend

Purpose This paper aims to present an adaptation of digital image correlation (DIC) to the electronics industry for reliability assessment of electronic packages. Two case studies are presented: one for warpage measurement of a micro-electro-mechanical system (MEMS) package under different temperature conditions and the other for the measurement of transient displacements on the surface of a printed

Purpose In the past several years, CH3NH3PbI3 perovskite material has been extensively evaluated as an absorber layer of perovskite solar cells due to its excellent structural and optical properties, and greater than 22% conversion efficiency. However, improvement and future commercialization of solar cells based on CH3NH3PbI3 encountered restrictions due to toxicity and instability of the lead element

Purpose This paper aims to determine the optimum set of temperatures through correlation study to attain the most effective capillary flow of underfill in a multi-stack ball grid array (BGA) chip device. Design/methodology/approach Finite volume method is implemented in the simulation. A three-layer multi-stack BGA is modeled to simulate the underfill flow. The simulated models were well validated

Purpose This paper aims to present the capacitance characterization of tapered dielectrophoresis (DEP) microelectrodes as micro-electro-mechanical system sensor and actuator device. The application of DEP-on-a-chip (DOC) can be used to evaluate and correlate the capacitive sensing measurement at an actual position and end station of liquid suspended targeted particles by DEP force actuator manipulation

The purpose of this study is to design and fabricate a simple passive sensor circuitry embedded into a printed circuit board (PCB) and then to examine its properties.,A passive sensor transponder integrated circuit (IC) working in the high frequency (HF) 13.56 MHz frequency band was selected for this study. A loop antenna was designed to make the reported sensor circuitry readable. Next, the sensor

The purpose of this paper is to demonstrate the acceptable performance by using the limited input range towards lower open-loop DC gain operational amplifier (op-amp) of an 8-bit pipelined analog-to-digital converter (ADC) for mobile communication application.,An op-amp with folded cascode configuration is designed to provide the maximum open-loop DC gain without any gain-boosting technique. The impact

This paper aims to perform experimental test on fatigue characteristics of package on package (POP) stacked chip assembly under thermal cycling load. Some suggestions for design to prolong fatigue life of POP stacked chip assembly are provided.,The POP stacked chip assembly which contains different package structure mode and chip position was manufactured. The fatigue characteristics of POP stacked

Purpose – This paper aims to present the dielectrophoresis (DEP) force (FDEP), defined as microelectrofluidics mechanism capabilities in performing selective detection and rapid manipulation of blood components such as red blood cells (RBC) and platelets. The purpose of this investigation is to understand FDEP correlation to the variation of dynamic dielectric properties of cells under an applied voltage

Glass is a promising interposer substrate for 2.5 D integration; yet detailed analysis of the interfacial reliability of through-glass vias (TGVs) has been lacking. The purpose of this paper is to investigate the design and material factors responsible for the interfacial delamination in TGVs and identify methods to improve reliability.,The interfacial reliability of TGVs is studied both analytically

Owing to recent challenges of CMOS manufacturing and power consumption in silicon technologies among alternative technologies, Nanomagnetic logic (NML) is one of the most promising technologies, so it was selected for this study. NML is non-volatile with ultra-low power dissipation that operates at room temperature. This paper aims to propose novel implementation of 2% and 4% multiplexers (MUXs) in

The purpose of this paper is to investigate the effect of high-k material HfO2 as a buffer layer for the fabrication of metal-ferroelectric-insulator-silicon (MFeIS) structures on Si (100) substrate.,RF-sputtered Pb[Zr0.35Ti0.65]O3 or (PZT) and plasma-enhanced atomic layer deposited HfO2 films were selected as the ferroelectric and high-k buffer layer, respectively, for the fabrication of metal-fe

This paper aims to investigate the usability of the nickel copper zinc ferrite with the composition Ni0.4Cu0.2Zn0.4Fe1.98O3.99 for the realization of high-temperature multilayer coils as discrete components and integrated, buried function units in low temperature cofired ceramics (LTCC).,LTCC tapes were cast and test components were produced as multilayer coils and as embedded coils in a dielectric

The purpose of this paper is to report on fabrication procedure and present microstructure and dielectric behavior of willemite ceramic material with addition of 5% Li2CO3 as a sintering aid.,The samples were fabricated by ball milling of the ceramic powders, preparation of granulate and pressing and co-firing using temperature profile based on heating microscope observation. The dielectric properties

The purpose of this paper is to improve the efficiency of dye-sensitized solar cells (DSSCs) which present promising low-cost alternative to the conventional silicon solar cells mainly due to comparatively low manufacturing cost, ease of fabrication and relatively good efficiency. One of the undesirable factor in DSSCs is the electron recombination process that takes place at the transparent conductive

The purpose of this study is to find a new design that can increase the sensitivity of the sensor without sacrificing the linearity. A novel and very efficient method for increasing the sensitivity of MEMS pressure sensor has been proposed for the first time. Rather than perforation, we propose patterned thinning of the diaphragm so that specific regions on it are thinner. This method allows the diaphragm

This paper aims to focus on the fabrication and characterization of mixed thin-/thick-film thermoelectric microgenerators, based on magnetron sputtered constantan (copper–nickel alloy) and screen-printed silver. To improve the adhesion of the constantan layer to the applied substrates, the additional chromium sublayer was used. The aim of the study was to investigate the influence of chromium sublayer

The purpose of this paper is to review possibilities of implementing ceramic additive manufacturing (AM) into electronic device production, which can enable great new possibilities.,A short introduction into additive techniques is included, as well as primary characterization of structuring capabilities, dielectric performance and applicability in the electronic manufacturing process.,Ceramic stereolithography

This paper aims to study a high-temperature (up to 200 °C) data acquisition and processing circuit for logging.,With the decrease in thermal resistance by system-in package technology and exquisite power consumption distribution design, the circuit worked well at high temperatures environment from both theoretical analysis and real experiments evaluation.,In thermal simulation, considering on board

This study aims to characterize a novel glass/epoxy architecture sandwich structure for electronic boards. Understanding the thermo-mechanical behavior of these composites is important because it is possible to pre-determine whether defined “internal” thick laminates will be suitable for embedding components in the direction of the axis “z,” i.e. this method of manufacturing multilayer laminates can

The purpose of this study is to directly measure and determine the Si/SiO2/AlOxNy interface state density on metal insulator semiconductor field effect transistor (MISFET) structures. The primary advantage of using aluminum oxynitride (AlOxNy) is the perfectly controlled variability of the properties of these layers depending on their stoichiometry, which can be easily controlled by the parameters

This paper aims to assess precise correlations between intermetallic compounds (IMCs) microstructure evolutions and the reliability of micro-joints with a Cu/SAC305solder/Ni structure using thermal shock (TS) tests.,This paper uses 200-µm pitch silicon flip chips with nickel (Ni) pads and stand-off height of approximately 60 µm, assembled on substrates with copper (Cu) pads. After assembly, the samples

The purpose of this study is to investigate the effect of the adhesive force and density ratio using lattice Boltzmann method (LBM) during underfill process.,To deal with complex flow in underfill process, a framework is proposed to improve the lattice Boltzmann equation. The fluid flows with different density ratio and bump arrangement in underfill are simulated by the incorporated Carnahan–Starling

Purpose The emulation of synapses is essential to neuromorphic computing systems. Despite remarkable progress has been made in the two-terminal device (memristor), three-terminal transistors evoke greater attention because of the controlled conductance between the source and drain. The purpose of this paper is to investigate the synaptic plasticity of the TiO2 nanowire transistor. Design/methodology/approach

Porous silicon (PS) was successfully fabricated using an alternating current photo-assisted electrochemical etching (ACPEC) technique. This study aims to compare the effect of different crystal orientation of Si n(100) and n(111) on the structural and optical characteristics of the PS.,PS was fabricated using ACPEC etching with a current density of J = 10 mA/cm2 and etching time of 30 min. The PS samples

Low temperature co-fired ceramics (LTCC) technology-based micro-hotplates are of immense interest owing to their ruggedness, high temperature stability and reliability. The purpose of this paper is to study the role of thermal mass of LTCC-based micro-hotplates on the power consumption and temperature for gas-sensing applications.,The LTCC micro-hotplates with different thicknesses are designed and

This paper aims to propose a new microfluidic portable experimental platform for quick detection of heavy metal ions (HMIs) in picomolar range. The experimental setup uses a microfabricated piezoresistive sensor (MPS) array of eight cantilevers with ion-selective self-assembled monolayer's (SAM).,Most of the components used in this experimental setup are battery operated and, hence, portable to perform

The purpose of this paper is to investigate the nanoscale electric performance of NiO thin films in grain boundary and grain face.,PeakForce tunnel atomic force is applied to visualize the nanoscale current imaging of the NiO thin film on fluorine tin oxide substrate.,The results show that the grain boundary has a significant impact on the nanoscale current of the NiO film. The electronic conductivity

The purpose of this paper is to examine the growth and characterization of the two different compound semiconductors, namely, n-zinc oxide (ZnO) and p-gallium antimonide (GaSb). In this paper, fabrication and characterization of n-ZnO/p-GaSb heterojunction diode is analyzed.,Thermo vertical direction solidification (TVDS) method was used to synthesize undoped GaSb ingot from high purity Ga (5N) and

The purpose of this paper is to propose an alternative approach to improve the performance of microelectromechanical systems (MEMSs) silicon (Si) condenser microphones in terms of operating frequency and sensitivity through the introduction of a secondary material with a contrast of mechanical properties in the corrugated membrane.,Finite element method from COMSOL is used to analyze the MEMS microphones

Lead frame tape is a crucial support for lead frames in the IC assembly process. The tape residue on the quad flat non-leaded (QFN) could result in low reliability and failure in electrical conductivity tests. The tape residue would affect overall performance of the chips and contribute to low pass yield. The purpose of this paper is to present an in-depth study of tape residue and factors that may

The purpose of this paper is to investigate electrical properties of eutectic In8Sb8Te84 and In10Sb51Te39 as made thin films to evaluate their potential for non-volatile phase-change memories, once the thermal measurements are very optimistic.,The films were deposited by pulse laser deposition technique. By using a very simple home-made cell, transversal current-voltage curves films were measured involving

This paper aims to review recent advances and applications of abrasive processes for microelectronics fabrications.,More than 80 patents and journal and conference articles published recently are reviewed. The topics covered are chemical mechanical polishing (CMP) for semiconductor devices, key/additional process conditions for CMP, and polishing and grinding for microelectronics fabrications and fan-out

The purpose of this paper is to investigate the structure and electrical properties of eutectic Sb7.4Te92.6 as made thin films to evaluate their potentiality for application to non-volatile phase-change memories.,The films were prepared by the pulsed laser deposition technique. The films were characterized by using X-ray diffraction in grazing-incident geometry, differential scanning calorimetry, Raman

In general, lighting application, white light emitting diode (LED) usually exposed to an extreme operating temperature of above 90°C. It is well-known that luminous efficacy and spectral characteristic of white LED are dependent on the temperature, causing thermal effects on luminous efficacy and color shift of white LED become a critical application checkpoint to be addressed by white LED manufactures

Purpose Because of the bioaccumulation effect, organophosphorus pesticides cause long-term damage to mammals, even at small concentrations. The ability to perturb the phospholipid bilayer structure as well as the overstimulation of cholinergic receptors makes them hazardous to humans. Therefore, there is a need for a quick and inexpensive detection of organophosphorus pesticides for agricultural and

The purpose of this paper is to investigate the behavior of interconnections between solar cells in a glass-free solar modules. As glass weight can be a limitation, it is still interesting to investigate other types of systems, especially when the glass was replaced with a polymeric front sheet. Such systems can be more sensitive for the solar cell interconnection ribbon fatigue.,To examine this effect

Purpose The low-temperature co-fired ceramics (LTCC) microfluidic-microwave devices fabrication requires careful consideration of two main factors: the accuracy of deposition of conductive paths and the modification needed to the standard process of the LTCC technology. Neither of them are well-described in the literature. Design/methodology/approach The first part of this paper deals with the individual

The purpose of this study was the comparison and analysis of the electrical parameters of two kinds of silicon solar cells (mono- and multicrystalline) of different emitter resistance.,By controlling of diffusion parameters, silicon mono- (Cz-Si) and multicrystalline (mc-Si) solar cells with different emitter resistance values were produced – 22 and 48 Ω/□. On the basis of current-voltage measurements

The purpose of this paper was the development of a model enabling precise determination of phosphorus concentration profile in the emitter layer of a silicon solar cell on the basis of diffusion doping process duration and temperature. Fick’s second law, which is fundamental for describing the diffusion process, was assumed as the basis for the model.,To establish a theoretical model of the process

Purpose The photovoltaic modules with front glass as a protective layer are the most popular type in the industry, but for some applications it can be considered as too heavy. One of the approaches is to laminate the cells using PMMA [Poly(methyl methacrylate)] as the front layer. This polymer has good mechanical strength and optical properties but exhibits low adhesion to lamination foil. To increase

The purpose of this paper is to present the influence of gate dielectric etching on obtained MISFET (metal insulator semiconductor field effect transistor) structures. Because of its properties, aluminum nitride (AlN) layers can be successfully used in a large area of applications. In addition, AIN has a wide bandgap (6.2eV) and high thermal conductivity (3.2 W/cm * K). Its melting temperature is greater

The fan-out wafer level package (FOWLP) becomes more and more attractive and popular because of its flexibility to integrate diverse devices into a very small form factor. The strength of ultrathin FOWLP is low, and the low package strength often leads to crack issues. This paper aims to study the strength of thin FOWLP because the low package strength may lead to the reliability issue of package crack

The purpose of this paper is to present the possibility of technology of chemical metallization for the production of electrodes and resistors based on Ni–P alloy on silicon (Si), alundum (Al2O3) and low temperature cofired ceramic (LTCC) substrates. The developed technology provides low cost in any form.,During the study monocrystalline Si plates and Al2O3 and LTCC substrates were used. On the surface

The purpose of this paper is to elucidate the aging effect in dye-sensitized solar cells (DSSCs) sealed with thermoplastic film and to compare it with unsealed DSSCs.,The paper presents the steps of the fabrication of standard DSSC, as well as the DSSC-sealing processes, by using thermoplastic film. Current-voltage characterization was performed to observe the changes in efficiency, fill factor, short

The purpose of this paper is to use a particle velocity measurement technique on a tapered microelectrode device via changes of an applied voltage, which is an enhancement of the electric field density in influencing the dipole moment particles. Polystyrene microbeads (PM) have used to determine the responses of the dielectrophoresis (DEP) voltage based on the particle velocity technique.,Analytical

Design optimization of the traditional AlGaN/GaN HEMT device has been comprehensively conducted in achieving improved performance and current handling capability using the Synopsys’ Sentaurus TCAD tool. Varying material and physical considerations, specifically investigating the effects of graded barriers, spacer interlayer, material selection for the channel as well as study of the effects in the

Purpose Analysis of the thermal effects during the packaging process or in the actual operating environment is necessary to develop small monolithic integrated sensing chips with heterogeneous integration. The use of multiple layers and various materials in monolithic integrated sensing chips addresses the coefficient of thermal expansion (CTE) mismatch issue. The purpose of this study is to focus

Purpose This paper aims to present an effective approach to integrated circuit (IC) throughput enhancement, called TΔT thermal control. It does not require any micro-architectural change of the IC. The only modification is the attachment of an additional temperature sensor at the heatsink boundary. TΔT control technique enables assessment of changes in the dimension of cooling conditions and quick

Purpose The purpose of this paper is to investigate the feasibility of using micro electromechanical systems (MEMS) to convert a binary phase shift keying (BPSK) signal to a simpler amplitude shift keying (ASK) scheme. Design/methodology/approach The prototype is designed within the SOIMUMPs® fabrication process constraints. The fabrication constraints imposed geometric limitations on what could be