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A low-loss fan-out wafer-level package (FOWLP) has been proposed for millimeter-wave application. To ensure the radio frequency (RF) signal transition in a ground–signal–ground (GSG) configuration, the signal structure in the redistribution layer (RDL) is tightly surrounded by its ground. Over a wideband, the proposed RDL structure results in a low loss and a good match at the RF port. Moreover, an

Flexible implantable bioelectrodes have the potential to advance neural sensing and muscle stimulation, especially in peripheral nerve injuries. In such cases, the application of electrical stimulation to muscles prevents muscular atrophy and helps to bridge the gap between the injured nerve and the corresponding muscle. This article investigates the fabrication and characterization of a novel, cost-effective

During usage, printed electronic components are often stretched, bent, folded, and/or twisted to conform to underlying structure. In this article, tests have been developed for characterizing the mechanical and high-frequency electrical behavior of inkjet-printed patch antennas on flexible polyethylene terephthalate (PET) substrates under uniaxial and biaxial bending. A patch antenna is designed to

Better mechanical, thermal properties and longer lifetimes are needed for the die attach layer in high-power electronic packaging. As traditional Sn–Ag–Cu (SAC) solders have many limitations, the sintered nanosilver materials are becoming one of the substitutes for high-power electronic packaging. However, the high performance of sintered nanosilver materials is only achieved when its fine sintering

In this study, a very high-throughput and low-cost packaging method for fabricating the fan-in chip-scale package is presented. Emphasis is placed on the utilization of the existing printed circuit board (PCB) panel carriers and the corresponding PCB equipment for making the redistribution-layers (RDLs), vias, under bump metallurgy (UBM), contact pads, solder mask, and surface finishing of the package

In this article, the fan-out chip-last panel-level packaging for heterogeneous integration is investigated. Emphasis is placed on the design, materials, process, fabrication, and simulation of thermomechanical reliability of a heterogeneous integration of one large chip (10 mm $\times 10$ mm) and two small chips (7 mm $\times 5$ mm) by a fan-out method with a redistribution-layer (RDL)-first substrate

Hybrid dc switches have better performance with regard to energy conservation and less arc erosion than conventional semiconductor switches and mechanical switches. A novel hybrid dc switch based on a SiC-MOSFET is developed, and it accomplishes arc-less commutation if the current is below a threshold value, which is mainly determined by the boiling voltage of its contact material. However, as it is

As the size of metal–oxide semiconductor field-effect transistors (MOSFETs) is shrinking, there are new challenges at different stages of very-large-scale integration (VLSI) design flow. Several devices are densely placed compared to the older counterparts. 3-D integrated chip (3-D IC) packaging is one of the famous packaging technologies where in IC contains multiple dies having various modules or

In this article, an attempt is made to explore the effects of normal force and temperature on the threshold displacement amplitudes of tin-plated electrical contacts at elevated temperatures. Fretting tests were conducted at 323, 348, and 373 K at normal forces of 1, 1.25, 1.5, and 2 N. Riders and flats made from a 0.3-mm-thick brass sheet were coated with $10~\mu \text{m}$ of tin. Dimples were commonly

Photosensitive polymers or dielectric materials such as polyimides (PIs) have been used in fan-out wafer-level packaging process (FOWLP) as a redistribution layer for quite some time. In the condensed 2-D and 3-D packaging processes, the dielectric materials are applied multiple times to create as many as four or five redistribution layers. At the end of the process, the first layer may experience

The reliability of electronic assemblies is exceedingly reliant on the life of solder joints. Many factors may influence the fatigue life and mechanical properties of solder joints. Aging is one of the main factors that adversely affect the reliability of solder joints. In this article, the mechanical reliability of individual SnAgCu solder joints is studied at different aging conditions. The experiments

In many high-performance compact air-cooling technologies, it is desirable to adopt materials that provide combined heat dissipation with noise reduction (NR) in the same device. A device that adopts such material is termed here as a “noise-reducing heat sink” (NRHS). NRHS design would involve fundamental thermal-acoustic performance tradeoffs, thus necessitating investigation of their combined thermal-acoustic

The quantum dot (QD)–phosphor hybrid structure is promising for efficient white light-emitting diodes (LEDs). In this article, separation packaging structures (SPSs) having green-QD and red-phosphor configurations for backlight displays are studied. The LEDs with green-QD-down and red-phosphor-down SPSs were achieved to have the same color coordinate (0.282, 0.257) which is a typical cool white color

This article proposes and implements a novel technique for high spatial isolation that includes the placement of L-shaped metal-plate resonator shunt open-circuited stubs as a band-rejection filter on the lid of a microwave/radio frequency (RF) module. The low-cost, lightweight resonators are realized using a thin metal plate, which is patterned, with high design flexibility, and bent. This article

Feeding techniques for textile antennas are of crucial importance to simultaneously address mechanical requirements of robustness while maintaining high RF performance. To assist in determining which planar feeding mechanism is best suited for textile antennas, a dedicated study of various planar feeding mechanisms is undertaken as one of the main aims of this article. Two of the most prominent techniques

This article presents the design and development of surface electrode ion traps on glass and Si substrates and their radio frequency (RF) characterizations and performance benchmarking. In this case, the ion trap on glass shows superior performances in all necessary criteria. In terms of RF characterizations, ion traps on glass have a ${Q}$ factor of greater than 900. This is significantly higher than

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This article aims to characterize the warpage evolution of fan-out wafer-level packaging (FOWLP) during the wafer-level mold cure process. A finite-element analysis (FEA)-based process modeling framework, which includes the effects of geometric nonlinearity, gravity, and the cure-dependent chemical shrinkage of epoxy molding compound (MC), is presented to determine the warpage behavior of the molded

This letter reports the transformation of large-area planar metal–insulator–metal (MIM) nanomembrane capacitors into compact tubular 3-D architectures. By combining the powerful approach of strain-induced nanomembrane self-assembly with an external magnetic field, a stable winding process over a large distance in the range of centimeters is demonstrated. A wet release platform based on encapsulated

This study presents the development and characterization of biodegradable electrical interconnects for transient implantable medical devices. The interconnects comprised micropatterned biodegradable conductive polymer composites, which were developed using iron (Fe) microparticles as the conductive filler and polycaprolactone (PCL) as the insulating matrix. The electrical properties of the composites

Mechanical concepts and designs in inorganic circuits for different levels of stretchability are reviewed in this paper, through discussions of the underlying mechanics and material theories, fabrication procedures for the constituent microscale/nanoscale devices, and experimental characterization. All of the designs reported here adopt heterogeneous structures of rigid and brittle inorganic materials

This paper presents a novel technique for the integration of small CMOS chips into a large area substrate. A key component of the technique is the CMOS chip based self-aligned masking. This allows for the fabrication of sockets in wafers that are at most 5 µm larger than the chip on each side. The chip and the large area substrate are bonded onto a carrier such that the top surfaces of the two components