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This article presents a wireless packaging design for SiC power device, which displays low induction, good thermal management performance, and excellent high-temperature reliability. A novel organic-free nanomaterial fabricated by ultrafast pulsed laser deposition (PLD) is employed as the bonding material for both die attach and die top. With $t_{\text {on}} =20$ s and $\Delta T_{J} =200$ K, longtime

Silicone-based UV curing has recently been developed as a novel kind of encapsulation technology, which is time-saving and cost-effective for the package of light-emitting diodes (LEDs). In this work, to improve the light output power (LOP) and device reliability of LEDs packaged by UV curing, Al 2 O 3 nanoparticles (NPs) are doped into silicone. Different compositions of Al 2 O 3 NPs are used and

Integrating electronics into the body of complex structural parts through 3-D printing is one of the most promising new technologies in additive manufacturing, giving the potential of lighter weight and smaller electronic systems. Although fused filament fabrication (FFF) is one of the cheapest and most widely available 3-D printing approaches available, FFF has lagged behind alternatives, such as

We have derived a gas ingress and egress equation from the first principles of ideal gases. This work is intended to benefit the hermetic microelectronics packaging community, but it may be applied to other fields that require a deep understanding of gas ingress and egress dynamics. The equation outlined herein encompasses package material properties, package characteristics, hermetic testing conditions

An integration and modularization solution for a passive computational radio frequency identification (RFID) module is proposed for wireless patient monitoring. In the proposed integrated configuration, all the electronic components are encapsulated within the cavity of a textile antenna. This forms a compact protected embodiment suitable for concealment in a hospital garment, with the aim of being

The bondability and reliability of Ag–5Pd–3.5Au alloy wire was verified previously for application in light-emitting diode (LED) packages. This Ag-alloy bonding wire has an electrical resistivity of 4.6 $\mu \Omega \cdot $ cm, lower than those of the ternary Ag–3Pd–20Au (8.6 $\mu \Omega \cdot $ cm) and Ag–3Pd–8Au wires (5.0 $\mu \Omega \cdot $ cm). Further evaluation of the resistance of ion migration

Adaptive 5G architecture consisting of three functional sections (four antenna components, tunable matching network (TMN), and radio frequency (RF) front-end package) is proposed, analyzed, and verified. In the 5G millimeter-wave (mmWave) spectrum, the RF performance is highly dependent on the specific antenna package technology. However, compact antenna packages, oftentimes, result in undesired interference

Interposer-based 2.5-D integrated circuits (ICs) enable the chip-level reuse of hard intellectual properties (IPs), also known as chiplets. Such system-level integration shortens the design cycle considerably for large-scale and heterogeneous chips. Besides traditional interposers, which only provide passive elements and routing, active interposers are furthermore comprised of logic components. When

In this article, we present a PAM-4 IBIS-AMI model derived from machine learning for time-domain simulation. More specifically, we report a Laguerre–Volterra-expanded feed-forward neural network (LVFFN) approach with one hidden layer and ten neurons to model the 28-Gb/s PAM-4 high-speed link buffer. The proposed LVFFN model reduces the model size and improves the computational efficiency dramatically

Mode-selective transmission line (MSTL) has been studied and realized in support of ultrabroadband and ultrafast electromagnetic signal guidance. Its operation is based on the fact that its dominant mode behaves as a quasi-TEM microstrip mode at low frequencies and is gradually converted into a quasi-TE 10 waveguide mode at higher frequencies notwithstanding its longitudinal uniformity. In the first

This article proposes a novel substrate integrated suspended line (SISL) platform with multiple inner boards, and it uses all FR4 material with very low cost. A new coupling scheme which significantly eliminates the dielectric loss is proposed. When compared with the conventional multilayer coupled-line circuits where the coupling is from one metal layer to another metal layer on the same board, the

This article proposes a new method for semiautomatically generating the image Mask required for training Mask R-CNN. Since manual labeling is very time-consuming and laborious to obtain the image mask, we propose a very simple and fast method based on graph cut to obtain image Mask method, which uses graph cut-based image segmentation to output pixel-level segmentation results and obtain Mask of the

This article focuses on the 3-D modeling methodology development of the wafer-to-wafer hybrid bonding (W2W-HB) annealing process. With its successful application in a 2-stack wafer-to-wafer bonding, the Cu-to-Cu bonding area is derived and compared for various design and process conditions, such as dishing value, annealing temperature, and dwell duration, through-silicon via (TSV) depth, and TSV/Cu

Land grid arrays (LGAs) and ball grid arrays (BGAs) constitute the board-level interconnect technologies for a large number of packaged ICs. These technologies are used in socketing and surface mount (SMT) applications, respectively. The concept of socketable BGA packages, with solder spheres coated with a barrier layer/noble metal coating, was introduced to develop a single package design for processor

The feasibility of using selective thermal cobalt metal (Co) atomic layer deposition (ALD) as high density Cu–Cu interconnect bonding is demonstrated at a low temperature (200 °C) and with minimal surface pretreatment. A Cu/Gap/Cu structure, which emulates 3-D ICs stacking is fabricated. Cobalt ALD showing seamless interconnection between copper (Cu) pads with 30- $\mu \text{m}$ pitch is demonstrated

Microdispensed transmission lines (TLs) show high conductor losses at microwave frequencies. Recently, laser micromachining has been introduced as a technique to form the slots of the coplanar waveguide (CPW). Smoother and highly conductive signal trace and ground plane edges have been obtained to enhance the CPW’s effective conductivity. Since conductor loss depends on the TL type and geometry, it

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On October 10, 2020, we learned sadly of Prof. Avram Bar-Cohen’s passing away. It is no understatement to call Prof. Bar-Cohen, better known to so many of us simply as Avi, a legend in our field of microelectronics packaging, especially in the area of thermal management. His immense body of work, the success of his students, and the positive imprint of his personality and influence are writ large on

Not a day goes by without the issue of global warming and the depletion of the planet’s resources being addressed in the media. And it is clear that the societal and environmental challenges posed are of considerable magnitude because we all must drastically reduce our carbon footprint. At the same time, the amount of data exchanged around the world is constantly increasing. Do we need to be reminded

Substrates and packages of active implantable medical devices are often fabricated from ceramics, such as alumina. Screen-printed PtAu paste is the state-of-the-art metallization for functional structures. Due to solid-state and liquid diffusion of Au during thermal exposure, solder times are limited. Otherwise, metal structures tend to delaminate. Moreover, it was shown that PtAu with solder fails

This article investigates silver-palladium (AgPd) microelectrical contact coated with graphene (Gr). An analysis is carried out for 2-D, circle-rectangle microelectrical contact using COMSOL multiphysics finite element analysis (FEA) simulation software tool. Under applied force between 6 and $15~\mu \text{N}$ , mechanical performance parameters such as contact radius, depth of penetration, and contact

As 3-D packaging is expected to meet new requirements for next-generation system-in-packaging (SiP), various technologies have been discussed for vertical integration. To enable high-performance vertical interconnects, Cu-to-Cu bonding is an essential process for decreasing the metal-interconnect size between vertically stacked devices and for improving system performance. However, the high-temperature

A conformal coating is a protective chemical material that can be applied as a thin layer on printed circuit board assemblies (PCBAs). The purpose of conformal coating is to prevent the interaction between external environmental factors and the electrical assembly. However, since conformal coating materials have different mechanical properties than electronic components, their use may induce additional

A low-cost 77/79-GHz ladder-type forward-wave directional coupler (FWDC) is proposed based on microstrip and substrate integrated waveguide (SIW) for frequency modulated continuous wave (FMCW) radar application in this article. The SIW structures are periodically loaded between two parallel microstrip lines. In the circuit topology of the proposed FWDC, the impedance matching between the even/odd modes

An arbitrary power divider (PD), which can be fully integrated on a multilayered printed circuit board (PCB), is presented without using the surface-mounted device (SMD) resistors. In the proposed SMD-resistor-free isolation network, a new multiple microstrip gap-coupled resonators (MM-GCRs) is designed in an FR4 substrate based on an optimization algorithm to achieve an equivalent grounded resistor

This article presents an overview of testing methods applied to flexible hybrid electronics (FHE). It starts by briefly summarizing and discussing the main properties of substrates, chips, and materials commonly used for flip-chip bonding of FHE. It also describes general accelerated testing methods and how they are related to the current progress in FHE testing. Stressors, such as temperature cycling

This article presents the design, simulation, and fabrication of printed microstrip transmission line (TL) and microwave ring resonators using aerosol-jet printing for system-in-package applications. The printed TLs are 8 mm long and their S-parameters are measured over a wide bandwidth ranging from 1 to 26 GHz. Their insertion loss ranges between 0.02 dB/mm at 1 GHz and 0.56 dB/mm at 26 GHz. Ring

Radio frequency (RF) or microwave printed circuit board (PCB) is a type of PCB designed to operate on signals in megahertz-to-gigahertz frequency (medium to extremely high frequency) ranges. The materials used to construct these PCBs are advanced composites with very specific characteristics for dielectric constant, loss tangent, and coefficient of thermal expansion (CTE). These microwave materials

Thermocompression bonding (TCB) is an important process in electronic packaging and is widely seen as a promising technology for miniaturized electronic devices. However, this process usually yields a lower throughput compared to more conventional mass-reflow processes, mainly because the thermal distribution uniformity across the bonding plane, as required for reliable joints, is achieved with longer

Sintering of aerosol jet printed nano-Ag traces leads to nanoporous structures that are macroscopically brittle, but the reduction in strain localization offered by the support of a flexible polyimide substrate means that the traces are still quite flexible and can withstand much higher strains than the free-standing structures. The resulting behavior under cyclic loading conditions is very different

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Modern technologies and devices ranging from smartphones, computers, cloud computing, industrial automation, automobiles, to the Internet of Things are enabled by integrated circuits (ICs) and their associated packages. The ICs have evolved from the early small-scale integration (SSI) to the later more complex very-large-scale integration (VLSI) and the subsequent ultra-large-scale integration (ULSI)

The interaction between the continuous microstructure evolution during thermal cycling and the long-term reliability of wafer-level chip-scale packages (WLCSPs) with Sn–1.0Ag–0.5Cu (wt%) (SAC105), Sn–3.0Ag–0.5Cu (wt%) (SAC305), and Sn–3.9Ag–0.6Cu (wt%) (SAC396) solder ball interconnects were investigated. Three different body-sized WLCSP with three different solder alloys on three different board thickness

Many connections exist in complex electronic equipment, which leads to a long duration of intermittent fault test and difficulty in achieving comprehensive coverage of intermittent fault. The intermittent fault mechanism and the multichannel intermittent fault parameter parallel capture method are investigated. A smaller module covers multiple intermittent connection faults in electronics and prevents

A rapid method based on activation energy values for the lifetime assessment of PP films used as dielectrics for capacitors is proposed. The activation energy is determined from a nonisothermal measurement made by differential scanning calorimetry and an aging test at a single elevated temperature. The use of the onset temperature of the exothermal peak is proposed to evaluate the activation energy

Stud bumping using a traditional wire bonding process followed by the severing of the wire material from the ball bond has been widely applied in flip chip packages. Traditionally, Au stud bumps were employed because of the physical properties of gold, but the mediocre reliability of Au with Al pads and the cost of gold make this material unfavorable for industrial needs. Copper stud bumps were also

In order to control the impact behavior of the microprobe test process in microelectronics final test, based on the rapid response and intelligent controllability of magnetorheological (MR) fluid, a novel micro-MR flexible loader was designed to be loaded into the microprobe test system. The results show that the new system can effectively achieve smooth loading, and over-loading could be avoided by

With the advantages of high-power density, easy series connection, and failure short-circuit mode, the press pack packaging technology has been widely adapted in insulated gate bipolar transistors (IGBTs) which are applied for high-voltage and high-power density power apparatuses. Accurate modeling of temperature field in the press pack IGBTs (PP IGBTs) is vitally significant with the increasing power

This article focuses on the electrical performance of a new Ethernet contact with four differential pairs called “Octomax.” The eight pins of the contact are inserted in a section of 17 mm 2 . Such a high-speed interconnect solution is specially developed to operate at 10 Gbits/s in harsh environments for military and aerospace applications. The theoretical study up to 1 GHz enables quantifying the

This article presents the improved formulations for the latency insertion method (LIM) for diodes and MOSFETs utilizing the voltage-in-current framework. LIM is a fast circuit simulation algorithm, which computes the solutions to the voltages and currents in a circuit in a leapfrog manner, instead of a simultaneous matrix solution typically performed in the modified nodal analysis formalism. This allows

The conventional finite-difference time-domain (FDTD) method is efficient for microwave frequencies, but requires a large number of time steps for low frequencies. In this work, a hybrid Crank–Nicolson (CN) FDTD-SPICE method is applied to field-circuit analyses in low- frequency wideband problems. The unconditionally stable CN-FDTD method is used to give a rapid full wave solution by overcoming the

Bonding wires are widely used in microwave circuits and chip packaging. The exposure to harsh environments may lead to connection failure in these wires. In this article, the impact of such failures on signal transmission was studied using model analysis and experimental testing. The effects of gold bonding wire failure on both the dc and high frequency characteristics were analyzed. Signal reflection

Modern wireless devices operate on multiple frequency bands and, thus, can benefit from frequency-reconfigurable radio frequency (RF) components, especially filters that are typically larger in size and are required for every frequency band. In addition, many applications, such as wearable electronics, desire stable performance from the devices when they are bent or flexed. However, most of the reconfigurable

In manufacturing industries, yield is the essential quality for any mass production process. Particularly, in advanced and complex semiconductor processes, the yield requirements are becoming more stringent. Process capability index $C_{pk} $ has been widely employed to measure yield for processes with a very low fraction defective. However, unobserved slight and temporary process variations due to

A 650-V and 10-A silicon carbide (SiC) stacked cascode assembly has been proposed and demonstrated, in which a low-voltage Si-MOSFET (LV Si-MOSFET) is stacked on a high-voltage SiC buried gate static induction transistor (HV SiC-BGSIT). This is achieved by mounting Al bumps on the source pad of the HV SiC-BGSIT die and inserting a stacked Ag paste/epoxy layer between the HV SiC-BGSIT die and LV Si-MOSFET

In this letter, we propose a novel signaling figure of merit (s-FoM) for comparison of signaling schemes across different packaging technologies. It considers all the essential metrics that affect system performance and efficiency and combines them in a simple, easily quantifiable manner. These include energy per bit, data-bandwidth per unit shoreline, latency, length of the link, and real-estate overhead

Environmental temperatures may affect the high-frequency electrical performance of passive components, including passive intermodulation (PIM) characteristics. This work proposes a theoretical model of the third-order intermodulation distortion (IM3) signal as a function of the material properties and contact characteristics in a connector. A cross-sectional model of the inner conductor supported by

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Modern technologies and devices ranging from smartphones, computers, cloud computing, industrial automation, and automobiles to the Internet of Things are enabled by integrated circuits (ICs) and their associated packages. The ICs have evolved from the early small-scale integration (SSI) to the later more complex very-large-scale integration (VLSI) and the subsequent ultra-large-scale integration (ULSI)