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Higher Order Mode Elimination for SAW Resonators Based on LiNbO$_{3}$/SiO$_{2}$/poly-Si/Si Substrate by Si Orientation Optimization J. Microelectromech. Syst. (IF 2.7) Pub Date : 2024-03-08 Huiping Xu, Sulei Fu, Rongxuan Su, Peisen Liu, Boyuan Xiao, Shuai Zhang, Rui Wang, Cheng Song, Fei Zeng, Weibiao Wang, Feng Pan
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A 3 Degrees-of-Freedom Electrothermal Micro-Positioner for Optical Chip-to-Chip Alignment J. Microelectromech. Syst. (IF 2.7) Pub Date : 2024-03-07 Almur A. S. Rabih, Seyedfakhreddin Nabavi, Michaël Ménard, Frederic Nabki
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Optimization of Hemispherical Shell Resonator Structure Based on Thermoelastic Dissipation J. Microelectromech. Syst. (IF 2.7) Pub Date : 2024-03-05 Xiaoyan Sun, Haikuan Chen, Zhouwei He, Haoning Zheng, Ji’an Duan, Youwang Hu
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Surface Micromachined CMOS-MEMS Pirani Vacuum Gauge With Stacked Temperature Sensor J. Microelectromech. Syst. (IF 2.7) Pub Date : 2024-02-28 Xiangyu Song, Lifeng Huang, Yuanjing Lin, Linze Hong, Wei Xu
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JMEMS Letters.1pt Infrared-Driven Rapid Quantification of Magnetophoretically Trapped Drug J. Microelectromech. Syst. (IF 2.7) Pub Date : 2024-02-23 Vinit Kumar Yadav, Pankaj Pathak, Preetha Ganguly, Prashant Mishra, Samaresh Das, Dhiman Mallick
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Dynamic Modeling of a MEMS Electro-Thermal Actuator Considering Micro-Scale Heat Transfer With End Effectors J. Microelectromech. Syst. (IF 2.7) Pub Date : 2024-02-22 Hengbo Zhu, Yun Cao, Wanli Ma, Xiaoyu Kong, Shenghong Lei, Haining Lu, Weirong Nie, Zhanwen Xi
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A Radiofrequency Threshold Temperature Sensor Using a Hf0.5Zr0.5O2 Device and a Microacoustic Piezoelectric Resonant Sensor J. Microelectromech. Syst. (IF 2.7) Pub Date : 2024-02-22 Onurcan Kaya, Luca Colombo, Pietro Simeoni, Benyamin Davaji, Matteo Rinaldi, Cristian Cassella
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2023 Reviewers List J. Microelectromech. Syst. (IF 2.7) Pub Date : 2024-02-02
The IEEE Journal of Microelectromechanical Systems (JMEMS) Board of Editors greatly appreciates the support of those important people who, along with anonymous colleagues, contributed reviews for one or more articles processed by JMEMS during the year 2023 (from October 18, 2022 through December 31, 2023). Their contributions in time and expertise play an essential role in the ongoing development of
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TechRxiv: Share Your Preprint Research with the World! J. Microelectromech. Syst. (IF 2.7) Pub Date : 2024-02-02
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JMEMS Letters.1pt A Q-factor Boost Strategy for High-Order Width-Extensional Mode MEMS Resonators by Varied Unit Length J. Microelectromech. Syst. (IF 2.7) Pub Date : 2024-01-30 Liangliang Lv, Qingrui Yang, Haolin Li, Zhaoxun Wang, Quanning Li, Xuejiao Chen, Menglun Zhang, Wei Pang
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A Review on MEMS Silicon Resonant Accelerometers J. Microelectromech. Syst. (IF 2.7) Pub Date : 2024-01-26 Zhao Zhang, Hemin Zhang, Yongcun Hao, Honglong Chang
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Experimental and Simulative Correlations of the Influence of Solder Volume and Receptor Size on the Capillary Self-Alignment of Micro Solar Cells J. Microelectromech. Syst. (IF 2.7) Pub Date : 2024-01-23 Victor Vareilles, Elisa Kaiser, Philippe Voarino, Maike Wiesenfarth, Romain Cariou, Frank Dimroth, Yannick Veschetti, Mohamed Amara, Henning Helmers
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Enhanced Performance in Energy of Low Frequency Triboelectric-Nanogenerator Systems J. Microelectromech. Syst. (IF 2.7) Pub Date : 2024-01-23 Gaëtan Vauche, Christophe Corbier
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Silicon-Based Suspended Microchannel Resonator Developed Using Au Thermal Diffusion Bonding for Mass Sensing of Biomaterials J. Microelectromech. Syst. (IF 2.7) Pub Date : 2024-01-22 Keita Funayama, Atsushi Miura, Fumihito Arai, Hiroya Tanaka
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JMEMS Letters.1pt Conformally Overlaid Ferromagnetic Shadow Masks for Etching and Deposition Processes J. Microelectromech. Syst. (IF 2.7) Pub Date : 2024-01-17 Minwoo Choi, Taeyeong Kim, Bong Jae Lee, Jaeman Song, Jungchul Lee
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Electrowetting Ionic Liquid Flow Controller J. Microelectromech. Syst. (IF 2.7) Pub Date : 2024-01-17 Jonathan MacArthur, Paulo Lozano
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High-Quality Light Field Microscope Imaging Based on Microlens Arrays J. Microelectromech. Syst. (IF 2.7) Pub Date : 2024-01-11 Tongkai Gu, Sitong Yan, Lanlan Wang, Yasheng Chang, Hongzhong Liu
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A PZT Thin-Film Traveling-Wave Micro-Motor With Stator Teeth Based on MEMS Technology J. Microelectromech. Syst. (IF 2.7) Pub Date : 2024-01-09 Tianyu Yang, Yu Chen, Binglei Zhang, Binlei Cao, Xiaoshi Li, Kaisheng Zhang, Jiangbo He, Wei Su
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Multi Degrees-of-Freedom Hybrid Piezoelectric-Electrostatic MEMS Actuators Integrated With Displacement Sensors J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-12-19 Almur A. S. Rabih, Seyedfakhreddin Nabavi, Michaël Ménard, Frederic Nabki
This work presents novel multi degrees-of-freedom (DOF) actuators based on piezoelectric and electrostatic actuation to generate both in-plane and out-of-plane motions, intended to position a suspended optical waveguide for chip-to-chip alignment in photonic integrated circuits. In this context, the mechanical structures of the actuators with a suspended platform to carry the waveguide, are designed
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3D Flexible Wind Sensor With its Optimization and Environmental Effect J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-12-15 Zhenxiang Yi, Yu Wan, Ming Qin, Qing-An Huang
This paper proposes a new three-dimensional (3D) flexible wind sensor by utilizing dual-layer differential capacitors. The deformation of the sensor caused by wind leads to eight capacitances variation, which can be applied to obtain the wind speed along the x, y, and z axes (vx, vy and vz). Consequently, the 3D wind speed and direction are calculated by the vector synthesis. The feasibility of this
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Sealed-Cavity Bulk Acoustic Resonator for Subsequent Fabrication and Higher Order Mode J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-12-12 Jiashuai Xu, Zong Liu, Junyan Zheng, Fangsheng Qian, Man Wong, Yansong Yang
This focuses on developing a new platform for the thin-film bulk acoustic wave (BAW) resonator, which features predefined sealed cavities, self-formed acoustic boundaries, and compatibility with subsequent fabrication. Different from conventional BAW resonator fabrication methods, this work has simplified fabrication by using silicon migration technology: building freely predefined cavities with self-formed
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A Large-Stroke 3-DOF Micromirror With Novel Lorentz Force-Based Actuators Utilizing Metallic Glass Thin Film J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-12-07 Chuan-Hui Ou, Nguyen Van Toan, Yao-Chuan Tsai, Ioana Voiculescu, Masaya Toda, Takahito Ono
An electromagnetic tip-tilt-piston micromirror with a large stroke is presented. This research introduced a novel actuation structure, based on a spring made from conductive metallic glass with excellent mechanical properties. For the first time, two functional elements, an electromagnetic actuation element and a mechanical support structure, were successfully integrated into a single-layer spring
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Monolithically Integrated 3D Atomic Chip for Quantum Optical Magnetometry J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-12-05 Ziji Wang, Junming Wu, Gong Sun, Jintang Shang
A monolithically integrated 3D atomic chip for weak magnetic field detection is presented in this work. A 14.8 ohm MEMS thin film non-magnetic micro heater is monolithically integrated onto a micro spherical alkali vapor cell to realize on-chip atomic density control. Both magnetic and thermal characteristics of the non-magnetic heater are analyzed theoretically. Based on the heater-integrated atomic
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Roll to Roll Imprinting PDMS Microstructures Under Reduced Ambient Pressures J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-12-05 Olli-Heikki Huttunen, Johanna Hiitola-Keinänen, Jarno Petäjä, Eero Hietala, Hannu Lindström, Jussi Hiltunen
High-volume manufacturing of microstructures is essential for the uptake of the related scientific results for commercial use and also if hundreds or thousands of devices with repeatable performance are needed during the large-scale experimental research. Polydimethyl siloxane (PDMS) is one of the most widely used materials for academia to prepare microfluidic test devices. This has also motivated
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Novel Area-Changed Capacitive Methods for Simultaneous Displacement Transducing and Force Balance in a Nano-g MEMS Accelerometer J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-12-01 Fangzheng Li, Dandan Liu, Le Gao, Bingyang Cai, Lujia Yang, Yuan Wang, Chun Zhao, Wenjie Wu, Liangcheng Tu
High-precision MEMS accelerometers with nano-g resolution are emergent instruments for geophysical applications and proved their competence in terms of functionality. The electromagnetic actuator, which serves as an auxiliary component in nano-g MEMS accelerometers for improving the dynamic response, faces the challenges of process incompatibility, temperature sensitivity, and large form factor. Thereby
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Development of PMUT-Based High Sensitivity Gas Flow Sensor J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-12-01 Tapio Pernu, Teuvo Sillanpää, Cyril Baby Karuthedath, Abhilash Thanniyil Sebastian
Piezoelectric micromachined ultrasound transducers (PMUTs) and a high sensitivity PMUT-based gas flowmeter were designed, fabricated and characterised. In this work a single side measurement geometry is introduced for a simple PMUT assembly and enabling high sensitivity for the low flowrate measurement. While PMUT-based gas flow sensors of previous work serve higher flowrate ranges, the advantage of
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Frequency Tuning Method on Teeth-Like Tines of the Fused Silica Micro-Hemispherical Resonator Using Femtosecond Laser J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-11-28 Youwang Hu, Haoning Zheng, Yao Wang, Yalong Wang, Xiaoyan Sun, Ji’an Duan
The fused silica micro-hemispherical resonant gyroscope is a new type of solid-wave gyroscope and offers numerous benefits including high precision, low power consumption, small size, and long life. The core component of the gyroscope is the micro-hemispherical resonator (MHR). The inevitable frequency split of the MHR working modes will directly restrict the performance improvement of the gyroscope
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Response Speed Characterization of a Thermally Actuated Programmable Metamaterial J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-11-22 Chenyang Luo, Jonathan B. Hopkins, Michael A. Cullinan
This work details the experimental characterization of a MEMS thermal actuator, which constitutes a three-dimensional meso-robotic metamaterial lattice that can achieve actively controlled mechanical properties such as tunable stiffness. To achieve a target stiffness value via closed-loop control in a timeframe that is practical for most metamaterial applications, it is necessary that such actuators
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A Near-Zero Thermoelectric RF Power Sensor for High Dynamic Range Applications J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-11-16 Zhiqiang Zhang, Runqi Gu, Yifei Jiang, Yan Cui, Chunhua Cai
A novel broadband and thermoelectric RF power sensor with the near-zero power consumption is proposed for high dynamic range detection applications. This sensor is based on the RF power-heat-electricity operating principle and is fabricated using microelectromechanical systems (MEMS) and GaAs monolithic microwave integrated circuit (MMIC) processes. During operation, the device consumes no DC power
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Frequency Selection in a MEMS Flexural Beam Resonator by Electrostatic Actuation J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-11-16 Mohammad Kazemi, Seyedfakhreddin Nabavi, Mathieu Gratuze, Frederic Nabki
The utilization of MEMS resonators in microelectronics has garnered significant attention, given their crucial role in a multitude of applications, including timing and sensing. Among the various types of resonators, tunable resonators are particularly noteworthy, as they possess the capability of dynamically adjusting their resonant frequency. Accordingly, this work presents an innovative method for
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Impedance Sensing in CMOS-Embedded Microfluidics Using BEOL Electrodes J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-11-03 Wei-Yang Weng, Jun-Chau Chien
This paper describes a novel CMOS-embedded microfluidics platform featuring on-chip impedance-sensing electrodes. The platform employs a single-step wet etching process, removing the CMOS back-end-of-line (BEOL) routing metals, to create hollow fluidic channels that can be closely integrated with active circuits. We optimize the process parameters and improve the etch rate by 10Í through screening
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Theoretical Analysis and Verification on ScAlN-Based Piezoelectric Micromachined Ultrasonic Transducers With DC Bias J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-10-24 Zekai Wang, Wenjuan Liu, Bohao Hu, Yuhao Xiao, Chaoxiang Yang, Liangyu Lu, Yao Cai, Yan Liu, Chengliang Sun
Applying a DC bias can effectively tune the performance of a piezoelectric ultrasonic micromachined transducer (PMUT) to meet the requirements in multiple application scenarios. However, the effect of DC bias on various parameters of PMUT has not been systematically analyzed and verified. In this work, a theoretical model of scandium-doped aluminum nitride (ScAlN) based PMUT under different DC biases
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Thin-Film Lithium Niobate Acoustic Filter at 23.5 GHz With 2.38 dB IL and 18.2% FBW J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-10-20 Omar Barrera, Sinwoo Cho, Lezli Matto, Jack Kramer, Kenny Huynh, Vakhtang Chulukhadze, Yen-Wei Chang, Mark S. Goorsky, Ruochen Lu
This work reports an acoustic filter at 23.5 GHz with a low insertion loss (IL) of 2.38 dB and a 3-dB fractional bandwidth (FBW) of 18.2%, significantly surpassing the state-of-the-art. The device leverages electrically coupled acoustic resonators in 100 nm 128° Y-cut lithium niobate (LiNbO3) piezoelectric thin film, operating in the first-order antisymmetric (A1) mode. A new film stack, namely transferred
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Design and Fabrication of a Micropillar-Pumped Polymer Loop Heat Pipe J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-10-20 Masaaki Hashimoto, Taiga Kawakami, Abdulkareem Alasli, Ryobu Nomura, Hosei Nagano, Ai Ueno
This letter presents a micropillar-pumped polymer loop heat pipe (LHP) with potential applications in flexible electronics. A unique evaporator with a micro pillar wick was designed for a flexible polymer LHP. The polymer LHP was fabricated via simple and cost-effective soft lithography, omitting the need for a porous wick. This design and fabrication approach facilitated passive two-phase cooling
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Millimeter Wave Thin-Film Bulk Acoustic Resonator in Sputtered Scandium Aluminum Nitride J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-10-20 Sinwoo Cho, Omar Barrera, Pietro Simeoni, Emily N. Marshall, Jack Kramer, Keisuke Motoki, Tzu-Hsuan Hsu, Vakhtang Chulukhadze, Matteo Rinaldi, W. Alan Doolittle, Ruochen Lu
This work reports a millimeter wave (mmWave) thin-film bulk acoustic resonator (FBAR) in sputtered scandium aluminum nitride (ScAlN). This paper identifies challenges of frequency scaling sputtered ScAlN into mmWave and proposes a stack and new fabrication procedure with a sputtered Sc0.3 Al0.7 N on Al on Si carrier wafer. The resonator achieves electromechanical coupling ( ${k} ^{2}$ ) of 7.0% and
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Hybrid MEMS Actuator With 3 Degrees-of- Freedom for Efficient Planar Optical Switching J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-10-20 Suraj Sharma, Seyedfakhreddin Nabavi, Almur Abdelkreem Saeed Rabih, Michaël Ménard, Frederic Nabki
This work demonstrates a hybrid MEMS actuator platform that combines electrostatic and piezoelectric actuators to displace a suspended MEMS platform along 3 degrees-of-freedom (DOF). The prototype MEMS actuator tested produces maximum displacements of $8.8 \mu \text{m}$ along the positive X-axis, and $8.5 \mu \text{m}$ along the negative X-axis, with digital control. Analog control produces maximum
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Phononic Graded Meta-MEMS for Elastic Wave Amplification and Filtering J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-10-12 Federico Maspero, Jacopo Maria De Ponti, Luca Iorio, Annachiara Esposito, Riccardo Bertacco, Andrea di Matteo, Alberto Corigliano, Raffaele Ardito
Inspired by recent graded metamaterials designs, we create phononic arrays of micro-resonators for frequency signal amplification and wave filtering. Leveraging suspended waveguides on a thick silicon substrate, we hybridize surface Rayleigh and Lamb flexural waves to effectively achieve phononic signal control along predefined channels. The guided waves are then spatially controlled using a suitable
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A Low-Noise Piezoelectric MEMS Oscillator Based on a Flexural Mode Membrane Resonator Array Toward In-Air Resonant Sensors J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-10-12 Hexu Luo, Menglun Zhang, Yi Gong, Yuan Ning, Xuejiao Chen, Quanning Li, Wei Pang
Flexural mode MEMS resonators are ideal candidates for resonant microsensors. However, their high motional resistance in air restricts the performance of corresponding oscillators and consequently the sensor performance. In this work, we report a piezoelectric MEMS oscillator based on a flexural mode membrane resonator array for in-air resonant sensors. Array design and piezoelectric transduction of
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A ScAlN-Based Piezoelectric MEMS Microphone With Sector-Connected Cantilevers J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-10-09 Bohao Hu, Wenjuan Liu, Chaoxiang Yang, Liangyu Lu, Zekai Wang, Yan Liu, Yao Cai, Jian Wang, Shishang Guo, Chengliang Sun
With increasing requirements for massive sound acquisition, piezoelectric MEMS microphones (PMMs) have attracted widespread attention due to the advantages of low power consumption, fast response, waterproof and dustproof. This work presents a PMM with sector-connected cantilevers, where the anchors are located at the center of a circular operating area of 0.5-mm2. According to theoretical analysis
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A MEMS Frequency Comb Energy Harvester J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-10-09 Teng Zhang, Ashwin A. Seshia
This paper reports on the observation of frequency comb phenomena in a mechanically driven piezoelectric MEMS structure configured as a vibration energy harvesting device. By exploring different mechanical driving conditions, both autoparametric resonance and frequency comb response is observed at relatively low drive amplitudes. The harvester response is characterized for both sinusoidal driving and
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High-Order Modes of Thin Film Amorphous Silicon Coupled Disk Resonator Arrays J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-09-26 Tiago G. Pestana, Rui M. R. Pinto, Rosana A. Dias, Virginia Chu, João Pedro Conde
High-order resonance modes of disk resonators are promising due to their high quality factors in dissipative media. In this work, thin film hydrogenated amorphous silicon disk resonators actuated by lateral electrodes were mechanically coupled in arrays ranging from one (single resonator) up to four elements. The resonators were moderately to weakly coupled, which can allow further enhancement of sensitivity
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System-Level Optimization of MEMS Thermal Wind Sensor Based on the Co-Simulation of Macromodel and Board-Level Interface Circuits J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-09-22 Hao Xu, Jiuzhou Wang, Zai-Fa Zhou, Zhenxiang Yi, Ming Qin, Qing-An Huang
The low efficiency of iterative optimization in Microelectromechanical Systems (MEMS) devices is due to their complete separation from interface circuits. In the case of board-level circuits, this problem is particularly evident. To solve this problem, this paper proposes a system-level co-simulation strategy that combines the macromodel of a MEMS device extracted by Verilog-A with board-level circuits
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The Effect of Squeeze-Film Damping on the Step Response of Electrostatic Micro-Actuators J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-09-22 Peleg Levin, Amit Yonaei, Slava Krylov
In this paper we study the response to a step-function actuation of variously shaped parallel plates electrostatic MEMS actuators subject to pronounced squeeze-film damping in the transition and free molecular flow regimes. We conclude that mass inertial effects are negligible and that switching times are governed by pressure equilibration through ambient gas diffusion into the squeeze film gap. We
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A Microfabricated Nanobubble-Based Sensor for Physiological Pressure Monitoring J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-09-15 Xuechun Wang, Eugene Yoon, Ellis Meng
A microfabricated nanobubble-based sensor was developed for real-time physiological pressure monitoring. The fully immersed sensor utilizes an electrolytic bubble generated and localized within a microfluidic channel that is in communication with the local environment. Bubble size varies with local pressure changes, allowing pressure to be monitored by tracking the resulting electrochemical impedance
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Design and Fabrication Method of a Large-Size Electromagnetic MEMS Two-Dimensional Scanning Micromirror J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-09-15 Tong Zhou, Qilong Wu, Bo Pang, Yan Su
This paper proposes a design and fabrication method to address the technical challenges associated with the design and fabrication of large-size Micro Electro Mechanical Systems (MEMS) two-dimensional scanning micromirrors. The method employs the Lagrangian energy method to establish a kinetic model for the micromirror and utilizes the material mechanics method to analyze the structural parameters
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Multi-Gate In-Plane Actuated NEMS Relays for Effective Complementary Logic Gate Designs J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-09-15 Bennett Smith, Md. Ataul Mamun, Benjamin Horstmann, Ümit Özgür, Vitaliy Avrutin
Nano electro-mechanical systems (NEMS) based combinational logic circuits have garnered attention as possible replacements for electronic logic systems in safety critical environments where conditions make the use of electronics non-ideal. The principal advantages of NEMS are the inherent near zero leakage current and ability to operate in harsh conditions where substantial parasitic field effects
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On the Design and Modeling of a Full-Range Piezoelectric MEMS Loudspeaker for In-Ear Applications J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-09-15 Chiara Gazzola, Valentina Zega, Fabrizio Cerini, Silvia Adorno, Alberto Corigliano
MEMS loudspeakers are emerging as very promising solutions to meet the ever-increasing requirements for modern audio devices to become smaller, lighter and potentially more power efficient. The piezoelectric actuation principle, thanks to the relatively large driving force achievable at low voltages, represents the most promising implementation of loudspeakers at the microscale. Despite a significant
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A Monolithic LTCC-MEMS Microfabrication Process J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-09-08 Ehsan Fallahnia, Ammar B. Kouki
A novel end-to-end monolithic process for the fabrication and integration of Micro Electro Mechanical Systems (MEMS) on functional Low Temperature Co-fired Ceramics (LTCC) substrates is presented. The first phase is a conventional LTCC process that produces a functional multi-layer LTCC substrate that embeds all necessary passives in the inner layers and provides for surface to MEMS and other surface
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Piezoelectric Micromachined Ultrasonic Transducers With Superior Frequency Control J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-08-22 Yi Gong, Menglun Zhang, Sheng Sun, Wenlan Guo, Chen Sun, Wei Pang
It is a long-lasting issue that process variations, such as residual stress and poor dimension definition, deteriorate resonant frequency control of a piezoelectric micromachined ultrasonic transducer (PMUT). This letter presents a tapered cantilever cluster PMUT with tight frequency control. The PMUT could release residual stress via cantilever deformation and its front cavity could precisely define
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Phononic Frequency Combs in Atomically Thin Nanoelectromechanical Resonators Via 1:1 and 2:1 Internal Resonances J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-06-20 S M Enamul Hoque Yousuf, Jaesung Lee, Steven W. Shaw, Philip X.-L. Feng
We report on the first experimental demonstrations of phononic frequency comb (PnFC) generation in atomically thin molybdenum disulfide (MoS 2 ) nanoelectromechanical systems (NEMS) vibrating near ~20MHz and ~50MHz in the high frequency (HF) and very high frequency (VHF) bands. Frequency comb patterns are generated by tuning two resonance modes with gate voltage ( $V_{\mathrm {g}})$ to satisfy 1:1
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Investigation of Vapor HF Sacrificial Etching Characteristics Through Submicron Release Holes for Wafer-Level Vacuum Packaging Based on Silicon Migration Seal J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-06-20 Tianjiao Gong, Yukio Suzuki, Muhammad Jehanzeb Khan, Karla Hiller, Shuji Tanaka
Vapor hydrogen fluoride (vHF) sacrificial SiO 2 etching is a crucial process for wafer-level packaging based on silicon migration seal (SMS) technology. In this study, by using test samples with several kinds of test patterns and structures, the characteristics of vHF etching through release holes with a diameter of $0.5 \mu \text{m}$ were investigated. The results showed that through-hole etch rate
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Transmission Target for a MEMS X-Ray Source J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-06-19 Paweł Urbański, Marcin Białas, Michał Krysztof, Tomasz Grzebyk
This paper describes a major step towards the development of the first fully MEMS X-ray source. It focuses mostly on the development of a transmission target that is responsible for converting the electron beam into radiation. The simulation and experimental results are presented, allowing investigation of the influence of the target material, target thickness, and electron beam energy on the obtained
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Toward Band n78 Shear Bulk Acoustic Resonators Using Crystalline Y-Cut Lithium Niobate Films With Spurious Suppression J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-06-15 Soumya Yandrapalli, Seniz Küçük Eroglu, Jordi Mateu, Carlos Collado, Victor Plessky, Luis Guillermo Villanueva
This work presents the study of suspended Y-cut Lithium Niobate shear bulk acoustic resonators for wide band filter applications in the frequency range of 3.5-4.5GHz. The resonators consist of a Lithium Niobate film with Aluminum top interdigitated electrodes (IDE) and floating bottom metal plate. Through vertical electric field excitation, shear bulk acoustic waves are generated in each unit cell
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Atomization of High Viscous Liquids Using a MEMS Vibrating Mesh With Integrated Microheater J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-06-13 Pallavi Sharma, Irma Rocio Vazquez, Nathan Jackson
Aerosol generation is important for a wide range of applications including drug delivery, additive manufacturing, spray cooling, and numerous other applications. However, current aerosol generation devices often have poor droplet uniformity or are limited to low viscosity liquids (< 2 cp). This work presents the development of a Microelectromechanical systems vibrating mesh atomizer capable of atomizing
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Temperature Dependence Modeling and Thermal Sensitivity Reduction of Bulk Micromachined Silicon MEMS Lamé Resonators J. Microelectromech. Syst. (IF 2.7) Pub Date : 2023-06-08 Amir-Reza Kolahdouz-Moghaddam, Seyedfakhreddin Nabavi, Frederic Nabki
The elastic properties of structural materials considerably influence the resonant frequency of silicon MEMS resonators and their sensitivity to temperature variations. This work studies the effect of several methods on the temperature coefficient of frequency (TCF) of bulk micromachined silicon Lamé resonators. These include depositing a thin silicon oxide layer onto the resonating structure, including