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Electrodeposition of Ag onto Au(111) from Deep Eutectic Solvents
ChemElectroChem ( IF 4 ) Pub Date : 2018-11-30 , DOI: 10.1002/celc.201801192
Maximilian U. Ceblin 1, 2, 3 , Sven Zeller 1, 2, 3 , Benjamin Schick 2 , Ludwig A. Kibler 2 , Timo Jacob 1, 2, 3
Affiliation  

Silver electrodeposition onto Au(111) has been studied as a function of composition of deep eutectic solvent (DES) type III and IV. The electrochemical investigations were performed by using cyclic voltammetry and in‐situ electrochemical quartz crystal microbalance experiments. Scanning electron microscopy coupled with Auger spectroscopy and atomic force microscopy were used to characterize the deposited metal overlayers. Silver deposition from DES type III shows several analogies to the electrocrystallization from aqueous solutions, such as the presence of underpotential deposition. It is shown that the hydrogen‐bond donor exerts a strong influence on the silver growth mode and on the structure of the metal deposits. In addition, the hydrogen‐bond donor turns out to exert a rather strong influence on the plating process during silver deposition from DES type IV.

中文翻译:

深共晶溶剂将Ag电沉积到Au(111)上

已经研究了银在Au(111)上的电沉积与III和IV型深共熔溶剂(DES)的成分的关系。通过使用循环伏安法和原位进行电化学研究电化学石英晶体微量天平实验。扫描电子显微镜,俄歇光谱和原子力显微镜用于表征沉积的金属覆盖层。从Ⅲ型DES进行的银沉积显示出与从水溶液进行电结晶的几种类比,例如存在欠电位沉积。结果表明,氢键供体对银的生长方式和金属沉积物的结构有很大的影响。此外,氢键供体对DES型IV沉积银过程中的电镀过程产生了相当大的影响。
更新日期:2018-11-30
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