Despite the increasingly important role of stretchable electronics for use as the human–machine interface, their manufacturing in a commercially realistic manner remains an unresolved challenge. The bottleneck lies in the efficiency and scalability of transfer printing that is typically employed in the fabrication process to enable device stretchability via strain isolation. Here, the use of a polymer substrate with programmable rigidity for direct manufacturing of stretchable electronics is reported, forgoing the need for transfer printing while significantly enhancing strain isolation. The process starts with a stretchable elastomeric substrate synthesized via the thiol‐acrylate click chemistry. Designable rigid islands can be introduced via spatially confined oxidation of the elastomer. Strain‐sensitive microdevices can then be directly fabricated onto the rigid islands without transfer printing. Following this manufacturing scheme, a fast‐responding stretchable temperature sensor is demonstrated, with unusual accuracy and real‐time temperature monitoring capability suitable for use in a highly dynamic environment. Importantly, the critical fabrication step that introduces the programmable substrate rigidity is fully integrated into a well‐established lithographic process. Therefore, the methodology not only reduces greatly the complexity in fabricating prototype devices but also points to a highly effective way for potential manufacturing in a commercial setting.

中文翻译：

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具有工艺集成的可编程刚度的可伸缩电子产品在聚合物基板上的直接制造

尽管将可伸缩电子设备用作人机界面的作用日益重要，但以商业现实的方式制造可伸缩电子设备仍是一项尚未解决的挑战。瓶颈在于转移印刷的效率和可扩展性，通常在制造过程中采用该转移印刷以通过应变隔离实现设备的可拉伸性。在此，报道了将具有可编程刚度的聚合物基板用于可拉伸电子器件的直接制造，从而放弃了在显着增强应变隔离的同时进行转移印刷的需求。该过程始于通过硫醇丙烯酸酯点击化学合成的可拉伸弹性体基材。可通过弹性体的空间限制氧化来引入可设计的刚性岛。然后，可以将应变敏感的微型设备直接制造到刚性岛上，而无需进行转印。根据该制造方案，展示了一种快速响应的可拉伸温度传感器，具有异常的精度和实时温度监控功能，适合在高动态环境中使用。重要的是，引入可编程衬底刚度的关键制造步骤已完全集成到完善的光刻工艺中。因此，该方法不仅大大减少了制造原型设备的复杂性，而且指出了一种在商业环境中进行潜在制造的高效方法。具有非凡的精度和实时温度监控功能，适合在高度动态的环境中使用。重要的是，引入可编程衬底刚度的关键制造步骤已完全集成到完善的光刻工艺中。因此，该方法不仅大大减少了制造原型设备的复杂性，而且指出了一种在商业环境中进行潜在制造的高效方法。具有非凡的精度和实时温度监控功能，适合在高度动态的环境中使用。重要的是，引入可编程衬底刚度的关键制造步骤已完全集成到完善的光刻工艺中。因此，该方法不仅大大减少了制造原型设备的复杂性，而且指出了一种在商业环境中进行潜在制造的高效方法。