The miniaturization of electronics has been following Moore's Law for decades and has resulted in the development of sequentially evolutionized multifunctional nanoengineered devices. The conventional electronic devices are processed over planar hierarchically nanopatterned substrates having mechanical rigidity and stiffness which limit the degree of utility due to its inability to interface with soft curvilinear morphology, brittle nature, and inferior optical transparency. However, flexible substrates assembled over polymeric framework would, therefore, play a key role by offering light weighted thin film architecture, wearability, improved optical transparency, and morphological configuration to curvilinearity. The flexibility of substrate is defined when the material is processed such that individual component complies to a comparable degree of bending without deterioration of electronic/optoelectronic performance. Since the fabricated structure is pliable, the mechanical integrity of the structure governs the electromechanical performance of flexible electronic devices. The structure may undergo delamination, which occurs due to the stress field gradient developed due to the coefficient of thermal expansion, thereby generating a built-in strain potentially capable of breaking the adhering bonds. This article provides a consolidated review of numerous processing techniques to fabricate flexible electronics ranging from printing, sol-gel, chemical vapor deposition to chemical synthesis route, etc. and their applications in thin-film transistors, solar cells, sensors, health monitoring e-skins, optical devices, etc. along with a theoretical mechanical two layer film substrate model.

中文翻译：

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电子应用的柔性聚合物基板

电子的小型化遵循摩尔定律已有数十年之久，并导致了顺序进化的多功能纳米工程设备的发展。传统的电子设备在具有机械刚度和刚度的平面分层纳米图案化基板上进行处理，由于其无法与软曲线形态，脆性和较差的光学透明性接触，因此限制了实用程度。但是，组装在聚合物框架上的柔性基板将通过提供轻量级的薄膜结构，耐磨性，改进的光学透明性和曲线形貌来发挥关键作用。基材的柔韧性是在加工材料时定义的，以使单个组件符合相当的弯曲度而不会降低电子/光电性能。由于所制造的结构是柔韧的，因此结构的机械完整性决定了柔性电子设备的机电性能。结构可能会发生分层，这是由于热膨胀系数引起的应力场梯度而发生的，从而产生潜在地可能破坏粘结力的内建应变。本文提供了从印刷，溶胶-凝胶，化学气相沉积到化学合成路线等各种制造柔性电子产品的加工技术的综合综述，以及它们在薄膜晶体管中的应用，