Metal oxide thin films for soft and flexible electronics require low cost, room temperature fabrication, and structuring processes. We here introduce an anodic printing process to realize the essential building blocks of electronic circuitry, including resistors, capacitors, field-effect transistors, diodes, rectifiers, and memristors directly on imperceptible plastic substrates. Largely independent on surface properties, we achieve high-quality, few nanometer thin dielectric and semiconducting films even on rough substrates via localized anodisation of valve metals using a scanning droplet cell microscope. We demonstrate printing-like fabrication of 3D multilayer solid-state capacitors with a record-high areal capacity of 4 µF cm⁻². Applicable to the whole class of valve metals and their alloys, our method provides a versatile fabrication technique for the circuits that empower the flexible and stretchable electronics of tomorrow.

用于软性和柔性电子产品的金属氧化物薄膜需要低成本，室温制造和结构化工艺。我们在这里介绍一种阳极印刷工艺，以直接在不易察觉的塑料基板上实现电子电路的基本组成部分，包括电阻器，电容器，场效应晶体管，二极管，整流器和忆阻器。我们在很大程度上不依赖于表面性质，即使是在粗糙的基板上，也可以通过使用扫描液滴细胞显微镜对阀门金属进行局部阳极氧化来获得高质量，几纳米的薄介电和半导体薄膜。我们展示了3D多层固态电容器的印刷样制造，其面容量达到了创纪录的4 µF cm ^-2。我们的方法适用于所有类型的阀门金属及其合金，为电路提供了一种灵活的制造技术，可为未来的柔性和可拉伸电子设备提供动力。