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In situ growth of Cu(OH)2@FeOOH nanotube arrays on catalytically deposited Cu current collector patterns for high-performance flexible in-plane micro-sized energy storage devices†
Energy & Environmental Science ( IF 32.5 ) Pub Date : 2018-08-02 00:00:00 , DOI: 10.1039/c8ee01979g
Jin-Qi Xie 1, 2, 3, 4, 5 , Ya-Qiang Ji 1, 2, 3, 4 , Jia-Hui Kang 1, 2, 3, 4 , Jia-Li Sheng 1, 2, 3, 4 , Da-Sha Mao 1, 2, 3, 4, 5 , Xian-Zhu Fu 1, 2, 3, 4, 6 , Rong Sun 1, 2, 3, 4 , Ching-Ping Wong 4, 7, 8, 9, 10
Affiliation  

Although integrated energy storage devices, such as in-plane micro-supercapacitors (MSCs), are attractive for powering portable microelectronic devices, it is still challenging to develop patterning techniques with high practicability and to rationally design and fabricate electrochemically active materials using feasible procedures. Here, we propose a facile solution-immersion method of fabricating interdigitated copper electrodes with an in situ converted array of Cu(OH)2@FeOOH nanotubes (NTs). A copper current collector can be patterned together with widely employed copper circuits by a facile copper-patterning approach based on cost-effective electroless catalytic deposition of copper with patterned Ag catalysts, which is greatly conducive to the integration of in-plane energy storage devices into microelectronic systems. Furthermore, the rationally designed array of Cu(OH)2@FeOOH NTs, which was converted in situ from the patterned copper electrodes, was demonstrated to be an excellent electrochemically active material with advantages that included a porous structure with a large specific surface area, excellent wettability by the electrolyte, short ion diffusion lengths and one-dimensional electron transport pathway. The resulting MSC devices that were fabricated with the interdigitated Cu(OH)2@FeOOH/Cu electrodes exhibited a high specific capacitance (58.0 mF cm−2 at 0.1 mA cm−2), a high energy density (18.07 μW h cm−2), excellent cycling stability and desirable flexibility.

中文翻译:

高性能柔性平面内微型储能装置中,催化沉积的铜集流体图案上的Cu(OH)2 @FeOOH纳米管阵列原位生长

尽管诸如面内微型超级电容器(MSC)之类的集成式能量存储设备对于为便携式微电子设备供电是有吸引力的,但是开发具有高实用性的图案化技术以及使用可行的程序合理地设计和制造电化学活性材料仍然具有挑战性。在这里,我们提出了一种简便的溶液浸没法,以原位转换的Cu(OH)2阵列制造叉指式铜电极@FeOOH纳米管(NTs)。铜集电器可通过一种简便的铜图案化方法与广泛使用的铜电路一起进行图案化,该方法基于具有成本效益的无图案化Ag催化剂化学镀铜的化学沉积,非常有利于将面内储能装置集成到其中微电子系统。此外,对Cu(OH)2 @FeOOH NTs进行了合理设计的阵列,将其原位转化从图案化的铜电极得到的碳纳米管被证明是一种优异的电化学活性材料,其优点包括具有大比表面积的多孔结构,优异的电解质润湿性,短的离子扩散长度和一维电子传输路径。即用所述相互交叉的Cu制造的所得MSC装置(OH)2 @的FeOOH / Cu的电极显示出高的比电容(58.0 mF及其厘米-2在0.1mA厘米-2),高能量密度(18.07μW高厘米-2),出色的循环稳定性和理想的柔韧性。
更新日期:2018-08-02
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