The role of thermal interface materials (TIMs) has become substantial due to their critical applications in electronic devices for effective heat dissipation. Dimethyl silicone oil-based thermal pastes are widely used as TIMs because they can provide an intimate bonding between the heat sink and the electronic chip; however, the thermal conductivities of typical silicone oil-based thermal pastes are low. In this study, we prepared thermally conductive emulsion-based thermal pastes with two kinds of boron nitride (BN) fillers and investigated their rheological behavior and thermal conductivities. The emulsion was composed of dimethyl silicone oil, n-butanol, and sorbitan monooleate (Span 80) as an emulsifier. The fillers were boron nitride fibers (BNFs) and boron nitride nanosheets (BNNSs). The viscosity, storage modulus, and loss modulus of the emulsion-based pastes were smaller than those of the corresponding silicone oil-based ones. The thermal conductivities of the emulsion based pastes were larger than those of the silicone oil-based ones because of their lower viscosity and higher baseline thermal conductivity. The pastes with BNNSs had larger thermal conductivities in comparison with the corresponding ones with BNFs. To further enhance the thermal conductivity, BNNSs were coated with two silane coupling agents, 3-aminopropyl-triethoxy silane (KH550) and 3-(Trimethoxysilyl)propyl methacrylate (KH570), and then introduced into the emulsion. The maximum thermal conductivity was 1.04 W m⁻¹ K⁻¹ for the emulsion-based paste with KH550-coated BNNSs at a filler loading of 39 vol.%, which was a ∼ 7-fold increase in comparison with that of neat silicone oil (0.13 W m⁻¹ K⁻¹).

中文翻译：

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乳液基导热膏的流变行为和导热系数

由于热界面材料（TIMs）在电子设备中为有效散热的关键应用，其作用已变得十分重要。二甲基硅油基导热膏被广泛用作TIM，因为它们可以在散热器和电子芯片之间提供紧密的结合。但是，典型的硅油基导热膏的导热率很低。在这项研究中，我们用两种氮化硼（BN）填料制备了导热乳液基导热膏，并研究了它们的流变行为和导热率。该乳液由二甲基硅油，正丁醇和脱水山梨糖醇单油酸酯（Span 80）作为乳化剂组成。填料是氮化硼纤维（BNFs）和氮化硼纳米片（BNNSs）。粘度，储能模量，乳液基糊剂的损耗模量和损耗模量小于相应的硅油基糊剂的损耗模量。乳液基浆料的导热系数比硅油基浆料的导热系数大，这是因为它们的粘度较低，基线导热系数较高。与相应的含BNFs的糊相比，含BNNS的糊具有更高的导热率。为了进一步提高热导率，BNNSs涂有两种硅烷偶联剂：3-氨基丙基-三乙氧基硅烷（KH550）和甲基丙烯酸3-（三甲氧基甲硅烷基）丙酯（KH570），然后将其引入乳液中。最大导热系数为1.04 W m 乳液基浆料的导热系数比硅油基浆料的导热系数大，这是因为它们的粘度较低，基线导热系数较高。与相应的含BNFs的糊相比，含BNNS的糊具有更高的导热率。为了进一步提高热导率，BNNSs涂有两种硅烷偶联剂：3-氨基丙基-三乙氧基硅烷（KH550）和甲基丙烯酸3-（三甲氧基甲硅烷基）丙酯（KH570），然后将其引入乳液中。最大导热系数为1.04 W m 乳液基浆料的导热系数比硅油基浆料的导热系数大，这是因为它们的粘度较低，基线导热系数较高。与相应的含BNFs的糊相比，含BNNS的糊具有更高的导热率。为了进一步提高热导率，BNNSs涂有两种硅烷偶联剂：3-氨基丙基-三乙氧基硅烷（KH550）和甲基丙烯酸3-（三甲氧基甲硅烷基）丙酯（KH570），然后将其引入乳液中。最大导热系数为1.04 W m BNNS涂有两种硅烷偶联剂：3-氨基丙基-三乙氧基硅烷（KH550）和甲基丙烯酸3-（三甲氧基甲硅烷基）丙基酯（KH570），然后将其引入乳液中。最大导热系数为1.04 W m BNNS涂有两种硅烷偶联剂：3-氨基丙基-三乙氧基硅烷（KH550）和甲基丙烯酸3-（三甲氧基甲硅烷基）丙基酯（KH570），然后将其引入乳液中。最大导热系数为1.04 W m^-1  ķ ^-1用于基于乳液的膏KH550涂覆BNNSs在39体积％的填料填充量，这是在与整齐硅油的比较〜7倍的增加（0.13女男。^-1  ķ ^{- 1}）。