Abstract

Cooling is critically needed for reliability, power and further miniaturization of microelectronics. Heat sinks are obviously important for heat dissipation. However, thermal interface materials (TIMs) are needed to improve thermal contacts, such as the thermal contact between a heat source (e.g., a microprocessor) and a heat sink. This commentary is directed at clarifying some misconceptions related to the design and testing of TIMs.

中文翻译：

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热界面材料

抽象的

冷却对于微电子的可靠性，功率和进一步的小型化至关重要。散热器对于散热显然很重要。然而，需要热界面材料（TIM）来改善热接触，例如热源（例如，微处理器）和散热器之间的热接触。该评论旨在澄清一些与TIM设计和测试有关的误解。