Abstract

X-ray tomography was used to monitor damage evolution in nano-silver sintered joints during thermal cycling. Samples consisted of a silicon die joined to a direct bond copper substrate by sintering nano-silver paste. The amount of observable damage was significantly affected by the amount of allowable warping during the thermal cycling tests. By fully constraining the sample from flexing during thermal cycling, all observable damage was eliminated.

中文翻译：

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X射线显微断层照相术在烧结纳米银接头热循环过程中组分柔韧性的影响

抽象的

X射线断层扫描用于监测热循环过程中纳米银烧结接头的损伤演变。样品由一个硅片组成，该硅片通过烧结纳米银浆连接到直接键合的铜基板上。在热循环测试期间，可观察到的损坏量受到可允许翘曲量的显着影响。通过完全限制样品在热循环过程中的挠曲，消除了所有可观察到的损坏。