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W–Cu composites with submicron- and nanostructures: progress and challenges
NPG Asia Materials ( IF 9.7 ) Pub Date : 2019-12-20 , DOI: 10.1038/s41427-019-0179-x
Chao Hou , Xiaoyan Song , Fawei Tang , Yurong Li , Lijun Cao , Jie Wang , Zuoren Nie

W–Cu composite materials are widely used in civilian industries and aerospace fields owing to their integrated properties of high hardness, wear and arc resistance, electrical and thermal conductivities, and low coefficient of thermal expansion. The recently developed submicron- and nanostructured W–Cu composites exhibit superior performance compared to their conventional coarse-grained counterparts and are expected to further expand applications of this group of materials. This review is focused on recent important progress in the preparation, characterization, and mechanical and physical properties of W–Cu composites with refined structures. We summarize the technologies that are capable of refining component structures and evaluate their advantages and limitations. Furthermore, the effects of component refinement and additives such as alloying elements and dispersed particles on the comprehensive performance of W–Cu composites are demonstrated. At the end of the review, we propose potential research issues and directions worthy of attention for the future development of W–Cu composites.



中文翻译:

具有亚微米和纳米结构的W-Cu复合材料:进展和挑战

钨铜复合材料由于具有高硬度,耐磨,耐电弧,导电性和导热性以及低热膨胀系数等综合特性而被广泛用于民用工业和航空航天领域。最近开发的亚微米和纳米结构的W-Cu复合材料与常规的粗颗粒复合材料相比,表现出卓越的性能,并有望进一步扩大这类材料的应用范围。这篇综述集中在具有精细结构的W-Cu复合材料的制备,表征以及机械和物理性能方面的最新重要进展。我们总结了能够完善组件结构的技术,并评估了它们的优势和局限性。此外,证明了成分细化和添加剂(例如合金元素和分散的颗粒)对W-Cu复合材料综合性能的影响。在评论的最后,我们提出了潜在的研究问题和方向,这些都是W-Cu复合材料未来发展中值得关注的方向。

更新日期:2019-12-20
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