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Study on electroless composite plating for an Ni-P bond micro diamond wheel
Journal of Materials Processing Technology ( IF 6.3 ) Pub Date : 2020-05-01 , DOI: 10.1016/j.jmatprotec.2019.116561
Tianfeng Zhou , Yupeng He , Qian Yu , Zhiqiang Liang , Shidi Li , Xiaohua Liu , Xiaobin Dong , Xibin Wang

Abstract In this paper, nickel phosphorous diamond (Ni-P-D) composite plating is introduced as a new method to fabricate a micro diamond wheel with a diameter of φ450 μm. In the fabrication process, the steel substrate (SKD-11) is first ground to a ball end shape with a radius of 200 μm. Nickel phosphorous (Ni-P) and micro diamond particles with an average grain size of 3.5 μm are then electrolessly plated on the steel substrate tip, with a final plating thickness of approximately 25 μm. Parameters of the Ni-P-D plating conditions, including substrate rotation, stirring speed, and diamond grain density are then investigated. The topography of the micro wheel shows that diamond grains as the reinforced phase are embedded omnidirectionally and uniformly in the Ni-P plating along both the surface direction and the thickness direction. Energy dispersive spectrometer (EDS) results indicate that the ratio of diamond grains is approximately 27 wt%, and the Ni-P plating layer is an alloy in the amorphous state. Once fabricated, the micro diamond wheel performance is tested by grinding microgrooves on single crystalline silicon. The machined microgroove has a surface roughness of Ra 26 nm without obvious cracks. Micro tool wear after grinding proves that the bonding strength between diamond grains and Ni-P alloy, as well as the adhering strength between the Ni-P plating and steel substrate, are strong enough to meet the requirements of the micro grinding wheel.

中文翻译:

Ni-P结合微金刚石砂轮化学镀复合镀层研究

摘要 本文介绍了镍磷金刚石(Ni-PD)复合镀层作为制造直径为φ450 μm的微型金刚石砂轮的一种新方法。在制造过程中,首先将钢基板(SKD-11)研磨成半径为200μm的球头形状。然后将平均晶粒尺寸为 3.5 μm 的镍磷 (Ni-P) 和微型金刚石颗粒化学镀在钢基材尖端上,最终镀层厚度约为 25 μm。然后研究了 Ni-PD 电镀条件的参数,包括基板旋转、搅拌速度和金刚石晶粒密度。微轮形貌表明,作为增强相的金刚石晶粒沿表面方向和厚度方向全方位均匀地嵌入Ni-P镀层中。能谱仪 (EDS) 结果表明金刚石晶粒的比例约为 27 wt%,Ni-P 镀层为非晶态合金。制成后,通过在单晶硅上磨削微槽来测试微型金刚石砂轮的性能。加工出的微槽表面粗糙度为Ra 26 nm,无明显裂纹。磨削后的微小刀具磨损证明金刚石晶粒与Ni-P合金的结合强度,以及Ni-P镀层与钢基体的结合强度足以满足微型砂轮的要求。通过在单晶硅上磨削微槽来测试微金刚石砂轮的性能。加工出的微槽表面粗糙度为Ra 26 nm,无明显裂纹。磨削后的微小刀具磨损证明金刚石颗粒与Ni-P合金之间的结合强度,以及Ni-P镀层与钢基体之间的结合强度足以满足微型砂轮的要求。通过在单晶硅上磨削微槽来测试微金刚石砂轮的性能。加工出的微槽表面粗糙度为Ra 26 nm,无明显裂纹。磨削后的微小刀具磨损证明金刚石颗粒与Ni-P合金之间的结合强度,以及Ni-P镀层与钢基体之间的结合强度足以满足微型砂轮的要求。
更新日期:2020-05-01
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