In this study, new barrier-free Cu(NbC) alloy films with two different thicknesses, i.e., 8 and 300 nm, containing 0.3 at% C and 0.5 at% Nb, which are deposited via co-sputtering on three types of substrates, viz., Si, stainless steel and polyimide (PI), have been developed, annealed, measured and analysed. The resistivity value of the new 300-nm-thick films atop Si substrates is 3.07μΩcm\documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy} \usepackage{mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin}{-69pt} \begin{document}$$3.07~\upmu \Omega ~\hbox {cm}$$\end{document} after annealing at 450∘C\documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy} \usepackage{mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin}{-69pt} \begin{document}$$450^{\circ }\hbox {C}$$\end{document} for 200 h. The low resistivity and diffusion depth of the new films exhibit their good quality in anti-oxidation stability in a high-temperature environment. The films also display high-adhesive strength atop either stainless-steel or PI substrates, ∼\documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy} \usepackage{mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin}{-69pt} \begin{document}$${\sim }$$\end{document}7–8 times greater than that of their pure-Cu counterparts. In sharp contrast, the antibacterial ratio of the new films is ∼96%\documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy} \usepackage{mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin}{-69pt} \begin{document}$${\sim }96\%$$\end{document} while that of their pure-Cu counterparts is 0%. In addition, the contact angles of Cu(NbC) films are greater than those of their pure-Cu counterparts, resulting in a far superior antibacterial efficacy for the new films to pure-Cu films against, for example, Staphylococcusaureus BCRC 10451. With these desirable merits, the new films seem to be a good candidate material for bacteria killing and prevention, reduction of legionella spread inside hospitals and / or large buildings, biological medical care systems and advanced surgical tools. The new films deposited on PI substrates also seem to be suitable for making supple electrically conductive parts or devices, such as flexible panels, keyboards, screens, smartphones embedded in smart textiles and so forth.

中文翻译：

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新型 Cu(NbC) 薄膜的某些方面

在这项研究中，新的无障碍 Cu(NbC) 合金薄膜具有两种不同的厚度，即 8 和 300 nm，含有 0.3 at% C 和 0.5 at% Nb，通过共溅射沉积在三种类型的基板上，即，硅、不锈钢和聚酰亚胺 (PI)，已被开发、退火、测量和分析。Si 衬底上新的 300 纳米厚薄膜的电阻值为 3.07μΩcm\documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy } \usepackage{mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin}{-69pt} \begin{document}$$3。07~\upmu \Omega ~\hbox {cm}$$\end{document} 退火后在 450∘C\documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage {amssymb} \usepackage{amsbsy} \usepackage{mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin}{-69pt} \begin{document}$$450^{\circ }\hbox {C}$$\end{文件} 200 小时。新薄膜的低电阻率和扩散深度在高温环境下表现出良好的抗氧化稳定性。这些薄膜还在不锈钢或 PI 基材上显示出高粘合强度，∼\documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy} \usepackage{mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin} {-69pt} \begin{document}$${\sim }$$\end{document} 比纯铜对应物大 7-8 倍。与此形成鲜明对比的是，新薄膜的抗菌率约为 96%\documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy} \usepackage {mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin}{-69pt} \begin{document}$${\sim }96\%$$\end{document} 而他们的纯铜对应物是 0% . 此外，Cu(NbC)薄膜的接触角大于纯铜薄膜的接触角，导致新薄膜的抗菌功效远远优于纯铜薄膜，例如针对金黄色葡萄球菌 BCRC 10451。 凭借这些理想的优点，新薄膜似乎是杀灭和预防细菌、减少军团菌传播的良好候选材料医院和/或大型建筑物内、生物医疗保健系统和先进的手术工具。沉积在 PI 基板上的新薄膜似乎也适用于制造柔软的导电部件或设备，例如柔性面板、键盘、屏幕、嵌入智能纺织品的智能手机等。减少军团菌在医院和/或大型建筑物、生物医疗保健系统和先进手术工具内的传播。沉积在 PI 基板上的新薄膜似乎也适用于制造柔软的导电部件或设备，例如柔性面板、键盘、屏幕、嵌入智能纺织品的智能手机等。减少军团菌在医院和/或大型建筑物、生物医疗保健系统和先进手术工具内的传播。沉积在 PI 基板上的新薄膜似乎也适用于制造柔软的导电部件或设备，例如柔性面板、键盘、屏幕、嵌入智能纺织品的智能手机等。