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Including substrate temperature in berg model FOR reactive sputtering
Thin Solid Films ( IF 2.1 ) Pub Date : 2020-02-01 , DOI: 10.1016/j.tsf.2019.137761
Júlia Karnopp , Julio César Sagás

Abstract Reactive magnetron sputtering deposition can be qualitatively simulated by the well known Berg model. However, such model does not take into account explicitly the dependence of the substrate temperature on the sticking coefficient. The substrate temperature plays a major role in film properties and also affects the hysteresis curves. In order to analyze the effect of substrate heating on the hysteresis curves, the Berg model equations were rewritten by using both the Langmuir and the Kisliuk adsorption models. The theoretical results show that a raise on substrate temperature causes variations in the first critical point, but the adsorptions models exhibit different temperature dependences. In the experimental hysteresis curves obtained for Ti and Al targets using N2 and O2 as reactive gases, the effects of substrate temperature are very small, therefore, negligible.

中文翻译:

在反应溅射的 berg 模型中包括衬底温度

摘要 反应磁控溅射沉积可以通过著名的伯格模型进行定性模拟。然而,这种模型没有明确考虑基板温度对粘附系数的依赖性。基板温度对薄膜特性起着主要作用,也会影响滞后曲线。为了分析基板加热对滞后曲线的影响,使用 Langmuir 和 Kisliuk 吸附模型重写了 Berg 模型方程。理论结果表明,衬底温度的升高会导致第一临界点的变化,但吸附模型表现出不同的温度依赖性。在使用 N2 和 O2 作为反应气体为 Ti 和 Al 靶获得的实验滞后曲线中,
更新日期:2020-02-01
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