In this research, the microscale strain rate sensitivity and high-temperature mechanical properties of cured isotropic conductive adhesive (ICA) were investigated using microindentation. The indentation modulus and hardness of cured ICA with high silver content are relatively large. The slopes of contact stiffness–depth curve, modulus and hardness increase with increasing loading strain rate. The elastic modulus, hardness and creep behaviour at high temperature were characterised on the basis of the “rapid loading–holding–rapid unloading” loading mode and the semiempirical method from the generalised Kelvin model. With increasing temperature, the elastic modulus and hardness of cured ICA decrease from 3000–7000 and 100–300 MPa in the glassy state to 6–200 and 1–10 MPa, respectively, in the rubbery state. Creep compliance, which is relatively high in the rubbery state, increases with increasing holding time. On the retardation spectrum, the widened retardation peaks reflect different retardation processes with increasing retardation time.

在这项研究中，使用微压痕技术研究了固化的各向同性导电胶（ICA）的微观应变速率敏感性和高温机械性能。具有高银含量的固化的ICA的压痕模量和硬度相对较大。接触刚度-深度曲线，模量和硬度的斜率随载荷应变率的增加而增加。根据“快速加载-保持-快速卸载”加载模式和广义开尔文模型的半经验方法，对高温下的弹性模量，硬度和蠕变行为进行了表征。随着温度的升高，固化后的ICA的弹性模量和硬度分别从玻璃态的3000-7000和100-300 MPa降低到橡胶态的6-200和1-10 MPa。蠕变合规性 在橡胶态时较高，其随保持时间的增加而增加。在延迟谱上，加宽的延迟峰会随着延迟时间的增加而反映出不同的延迟过程。