High purity tantalum was respectively processed by unidirectional rolling (UR) and clock rolling (CR), and the through-thickness microstructures were investigated by multiple characterization techniques including electron backscatter diffraction (EBSD), Vickers hardness (HV) and X-ray diffraction (XRD). Results show that the through-thickness stored energy distribution in CR specimens is more homogeneous than in UR specimens due to uniform texture distribution. {111} grains possess larger Schmid factors and the corresponding Schmid factor difference ratio than {100} grains, indicating the activation of uniserial slipping in {111} grains, which leads to inhomogeneous deformation and higher stored energy. Besides, X-ray line profile analysis (XLPA) suggests that the stored energy of {111} grains increases successively from the surface to center layer, regardless of strain paths, due to the influence of redundant friction on the surface layers. While the occurrence of multiple slipping in {100} grains leads to homogeneous deformation and lower stored energy.

高纯钽分别通过单向轧制（UR）和时钟轧制（CR）进行处理，并通过多种表征技术研究了贯穿厚度的微观结构，包括电子背散射衍射（EBSD），维氏硬度（HV）和X射线衍射（ XRD）。结果表明，由于质地分布均匀，CR样品的全厚度储能分布比UR样品更均匀。{111}晶粒比{100}晶粒具有更大的Schmid因子和相应的Schmid因子差异比，表明{111}晶粒中无序滑动的激活，导致不均匀变形和更高的储能。除了，X射线线轮廓分析（XLPA）表明，{111}晶粒的存储能量从表面到中心层连续增加，而与应变路径无关，这归因于表面层上的多余摩擦力的影响。在{100}晶粒中发生多次滑动会导致均匀变形并降低储能。