Abstract The interfacial reaction between solid Ni and liquid Al, such as dissolution behaviors of solid Ni and formation mechanisms of intermetallic compounds, are not thoroughly clarified yet, especially under the conditions of short holding time and high reaction temperature. In this study, a hot-dip method was designed to investigate the isothermal interfacial reaction mechanism of solid Ni and liquid Al at temperature of 700 °C, 800 °C and 900 °C for 0–40 s. The dissolution behavior of solid Ni in liquid Al was analyzed. The dissolution rate constant, KNi, and dissolution activation energy, Ea, were calculated. The microstructure analysis with scanning electron microscope (SEM) and transmission electron microscopy (TEM) revealed that the dissolved thickness of solid Ni in pure liquid Al has linear relationship with the reaction time. The microstructure of the reaction interface consisted of Ni, Ni based solid solution, Al3Ni2 layer, adhered Al3Ni layer, free Al3Ni, Al3Ni + Al eutectic structure and Al. Ni based solid solution structure firstly formed at the holding stage. Nano-scale Al3Ni2 and irregular adhered Al3Ni appeared at the interface during fast cooling stage.

中文翻译：

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固态镍和液态铝在几十秒内的界面反应：固态镍的溶解动力学和金属间化合物的形成

摘要 固态Ni与液态Al之间的界面反应，如固态Ni的溶解行为和金属间化合物的形成机制尚未完全阐明，尤其是在短保温时间和高反应温度条件下。在这项研究中，设计了一种热浸法来研究固体 Ni 和液体 Al 在 700 °C、800 °C 和 900 °C 的温度下 0-40 s 的等温界面反应机理。分析了固态镍在液态铝中的溶解行为。计算溶解速率常数 KNi 和溶解活化能 Ea。扫描电子显微镜（SEM）和透射电子显微镜（TEM）的微观结构分析表明，纯液态铝中固体镍的溶解厚度与反应时间呈线性关系。反应界面的微观结构由Ni、Ni基固溶体、Al3Ni2层、粘附Al3Ni层、游离Al3Ni、Al3Ni+Al共晶结构和Al组成。Ni基固溶体结构首先在保温阶段形成。在快速冷却阶段，界面处出现纳米级Al3Ni2和不规则粘附的Al3Ni。