Cu–Zn–Sn shape memory alloys (SMAs) with an average composition of 56.0at%, 36.1at%, and 7.9at% for Cu, Zn, and Sn, respectively, were successfully fabricated via an electrodeposition–annealing route. The produced SMAs were assessed for shape memory response in terms of percent displacement (martensite phase recovery) by subjecting the ternary alloys to flame tests and subsequently characterizing them via differential scanning calorimetry (DSC), optical microscopy, scanning electron microscopy in conjunction with energy- dispersive spectroscopy (SEM-EDS), and X-ray diffraction (XRD) analysis. The flame tests showed that the highest displacement was ca. 93%, with average austenite and martensitic start transformation temperature of 225°C and 222°C, respectively. XRD analysis revealed that the intermetallic phases responsible for the observed shape memory properties have substitutional Zn in the lattice occupied by Cu and Sn, leading to the formation of Cu(Zn,Sn) and Cu₆(Zn,Sn)₅ variants. The formation of these variants was attributed to the faster interdiffusion of Cu into Sn, driven by an activation energy of 34.82 kJ·mol⁻¹. Five cycles of repeated torching–annealing revealed an essentially constant shape memory response, suggesting that the fabricated SMAs were consistent and sufficiently reliable for their intended service application.

通过电沉积-退火工艺成功地制造了平均成分分别为56.0at％，36.1at％和7.9at％的Cu-Zn-Sn形状记忆合金（SMAs）。通过对三元合金进行火焰测试，然后通过差示扫描量热法（DSC），光学显微镜，扫描电子显微镜结合能谱仪对它们进行表征，以位移百分比（马氏体相恢复）的形式评估所生产的SMA的形状记忆响应。色散光谱（SEM-EDS）和X射线衍射（XRD）分析。火焰测试表明，最大位移为。93％的平均奥氏体和马氏体的起始相变温度分别为225°C和222°C。₆（Zn，Sn）_5个变体。这些变体的形成归因于在34.82 kJ·mol ^-1的活化能的驱动下，Cu更快扩散到Sn中。五个重复的割炬-退火循环显示出基本恒定的形状记忆响应，这表明所制造的SMA在其预期的服务应用中是一致且足够可靠的。