A series of poly(benzimidazole-imide)s (PBIPIs) derived from different dianhydrides and 2-(3-aminophenyl)-5-aminobenzimidazole (m-BIA) were synthesized via thermal imidization to form flexible films. This series of PBIPIs showed great T_gs ranging from 296 to 484 °C, excellent thermal stability performed in 5% weight loss temperatures (T_d5%s) of 502–529 °C in N₂ and good mechanical properties (tensile strengths of 89–127 MPa, tensile moduli of 2.9–4.1 GPa and elongations at break of 3.9–6.9%). Compared with PIs derived from 6-amino-2-(4-(4-aminophenoxy)phenyl)-1H-benzimidazole (p-BIODA), m-BIA based PBIPI films exhibited higher T_g, and better solubility. Besides, the thermoplastic PBIPI resin (PI-6-PA) derived from 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride (BPADA) and m-BIA exhibited good melt processability with high T_g of 273 °C, melt flow index (MFI) of 7.76 g/10 min, minimum complex viscosity of 11.9 × 10³ Pa·s at 402 °C and low melt viscosity ratio of 2.46 at 400 °C.

从不同的二酐和2-（3-氨基苯基）衍生的一系列聚（苯并咪唑酰亚胺）（PBIPIs）-5-氨基苯并咪唑（米-BIA）经热酰亚胺化合成以形成柔性膜。这一系列的PBIPIs在296至484°C的温度范围内具有出色的T _g s，在502–529 °C的5％失重温度（T _d5％ s）中，在N _2中具有出色的热稳定性，并且具有良好的机械性能（抗拉强度为89-127 MPa，拉伸模量为2.9-4.1 GPa，断裂伸长率为3.9-6.9％）。与衍生自6-氨基-2-（4-（4-氨基苯氧基）苯基）-1H-苯并咪唑（p -BIODA）的PI相比，基于m -BIA的PBIPI薄膜显示出更高的T _g，并具有更好的溶解度。此外，热塑性树脂PBIPI（PI-6-PA）由2,2-双[4-（3,4-二羧基）苯基]丙烷二酐（BPADA）和衍生米-BIA表现出良好的熔融加工性高Ť_克的273°C，熔体流动指数（MFI）为7.76 g / 10 min， 在402°C下的最低复数粘度为11.9×10 ³ Pa·s，在400°C下的低熔体粘度比为2.46。