Abstract

The mechanical reliability of Sn–MWCNT composite solder containing various content of Sn-decorated MWCNTs (0, 0.05, 0.1, and 0.2 wt%) and Sn–58Bi solder were investigated. The Sn-decorated MWCNTs nanoparticles were used to improve the mechanical reliability of Sn–58Bi solder, which is a representative, low-temperature, lead-free solder. The Sn-decorated MWCNT nanoparticles were synthesized using the polyol method, and the Sn–MWCNT composite solder paste was fabricated by mechanical mixing. The shear and bending tests were conducted to evaluate the mechanical properties of the solder joints. We identified the microstructure of solder to investigate the intermetallic compound and failure mechanism of Sn–MWCNT composite solder. Furthermore, a high-temperature storage test at 100 °C for 1000 h was performed to determine long-term reliability. The shear strength and fracture energy increased about 21% and 23%, respectively, with 0.1 wt% Sn-decorated MWCNTs. In addition, the bending reliability of Sn–58Bi solder increased approximately 25%.

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抽象的

研究了含不同含量的Sn-修饰的MWCNT（0、0.05、0.1和0.2 wt％）和Sn-58Bi焊料的Sn-MWCNT复合焊料的机械可靠性。锡装饰的MWCNTs纳米颗粒用于提高Sn-58Bi焊料的机械可靠性，Sn–58Bi焊料是一种代表性的低温无铅焊料。采用多元醇法合成了装饰锡的MWCNT纳米颗粒，并通过机械混合制备了Sn-MWCNT复合锡膏。进行了剪切和弯曲测试，以评估焊点的机械性能。我们确定了焊料的微观结构，以研究金属间化合物和Sn-MWCNT复合焊料的失效机理。此外，在100°C下进行了1000小时的高温存储测试，以确定长期可靠性。用0.1％（重量）锡装饰的MWCNT，剪切强度和断裂能分别增加了约21％和23％。此外，Sn–58Bi焊料的弯曲可靠性提高了约25％。

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