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Biodegradable Flexible Substrate Based on Chitosan/PVP Blend Polymer for Disposable Electronics Device Applications.
The Journal of Physical Chemistry B ( IF 3.3 ) Pub Date : 2019-12-20 , DOI: 10.1021/acs.jpcb.9b08897
Ritesh Kumar 1 , Sapana Ranwa 2 , Gulshan Kumar 1
Affiliation  

To provide a more sustainable future, development and implementation of green electronics incorporating natural materials has become an essential requirement. In this study, we demonstrated a low-temperature and low-cost fabrication route to develop chitosan/PVP (CHP) substrate for flexible electronics device applications. A combination of natural polymer (chitosan) and synthetic polymer (poly(vinylpyrrolidone), PVP) has been used to fabricate biodegradable, low-cost, and flexible substrate. The CHP substrate has been prepared by the solution casting method. The CHP flexible substrate demonstrates a high optical transmittance (∼90% in the visible region), high-temperature stability (up to 250 °C), smooth surface, and good mechanical stability along with a high biodegradation rate (within 6 days) into the soil. Radio frequency (RF) sputtering and thermal evaporation techniques have been used to deposit high-quality ZnO thin films and Au/Ti electrodes over the CHP substrate. This fabricated metal-semiconductor-metal (MSM) device gives a clear indication about the accountability of the CHP polymer substrate as a potential option for flexible electronics. The current-voltage characteristic with flat and bending cycles (three flat-bending-flat cycles) shows almost same current conduction. These flexible CHP substrates can find a new way toward environmentally friendly, flexible electronics.

中文翻译:

基于壳聚糖/ PVP共混聚合物的可生物降解柔性基板,用于一次性电子设备应用。

为了提供更可持续的未来,开发和实施包含天然材料的绿色电子产品已成为一项基本要求。在这项研究中,我们展示了一种低温且低成本的制造路线,可以开发用于柔性电子设备应用的壳聚糖/ PVP(CHP)基板。天然聚合物(壳聚糖)和合成聚合物(聚乙烯吡咯烷酮,PVP)的组合已用于制造可生物降解,低成本和柔性的基材。通过溶液流延法制备CHP基材。CHP柔性基板显示出高的光学透射率(在可见光区域中约为90%),高温稳定性(高达250°C),光滑的表面和良好的机械稳定性以及高的生物降解率(6天之内)。土壤。射频(RF)溅射和热蒸发技术已被用于在CHP衬底上沉积高质量的ZnO薄膜和Au / Ti电极。这种制造的金属-半导体-金属(MSM)器件清楚地表明了CHP聚合物基板作为柔性电子产品的潜在选择的责任。具有平坦和弯曲周期(三个平坦弯曲-平坦周期)的电流-电压特性显示出几乎相同的电流传导。这些柔性CHP基板可以为环保,柔性电子学找到新途径。这种制造的金属-半导体-金属(MSM)器件清楚地表明了CHP聚合物基板作为柔性电子产品的潜在选择的责任。具有平坦和弯曲周期(三个平坦弯曲-平坦周期)的电流-电压特性显示出几乎相同的电流传导。这些柔性CHP基板可以为环保,柔性电子学找到新途径。这种制造的金属-半导体-金属(MSM)器件清楚地表明了CHP聚合物基板作为柔性电子产品的潜在选择的责任。具有平坦和弯曲周期(三个平坦弯曲-平坦周期)的电流-电压特性显示出几乎相同的电流传导。这些柔性CHP基板可以为环保,柔性电子学找到新途径。
更新日期:2019-12-20
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