Interfacial properties play a key role in determining the solubility of solids in liquids for both low- and high-temperature processes. In this study, the interfacial interactions between inclusions comprising TiO2 or TiN and the mold flux were investigated. The results of sessile drop tests show that the wettability of the mold flux on the TiO2 substrate was better than that on the TiN substrate when the temperature was below 1503 K. However, the contact angle on the TiN substrate decreased more than that on the TiO2 substrate when the temperature was above 1503 K due to the enhancement of the interfacial reaction. The thermodynamic calculations suggest that the reactions of TiN with O2 and SiO2 resulted in a bubbling phenomenon during the TiN sessile drop test. The scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS) results show that the final products of the interfacial interaction between the mold flux and the TiO2 substrate comprised perovskites, whereas those for the TiN substrate comprised perovskites and SiTi.

中文翻译：

---

钛稳定不锈钢铸造过程中TiO2或TiN夹杂物与结晶器熔剂的界面相互作用

对于低温和高温过程，界面特性在确定固体在液体中的溶解度方面起着关键作用。在这项研究中，研究了包含 TiO2 或 TiN 的夹杂物与保护渣之间的界面相互作用。静滴试验结果表明，当温度低于 1503 K 时，助焊剂在 TiO2 基体上的润湿性优于在 TiN 基体上的润湿性，但在 TiN 基体上的接触角下降幅度大于 TiO2由于界面反应的增强，当温度高于 1503 K 时。热力学计算表明，TiN 与 O2 和 SiO2 的反应在 TiN 静滴试验过程中导致了鼓泡现象。