In the current scenario, thermal management plays a vital role in electronic system design. The temperature of the electronic components should not exceed manufacturer-specified temperature levels in order to maintain safe operating range and service life. The reduction in heat build-up will certainly enhance the component life and reliability of the system. The aim of this research work is to analyze the effect of multi-walled carbon nanotube and graphene coating on the heat transfer capacity of a microprocessor used in personal computers. The performance of coating materials was investigated at three different usages of central processing unit. Multi-walled carbon nanotube-coated and graphene-coated microprocessors showed better enhancement in heat transfer as compared with uncoated microprocessors. Maximum decrease in heat build-up of 7 and 9℃ was achieved for multi-walled carbon nanotube-coated and graphene-coated microprocessors compared to pure substrate. From the results, graphene has been proven to be a suitable candidate for effective heat transfer compared to with multi-walled carbon nanotubes due to high thermal conductivity characteristics of the former compared to the latter.

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碳基纳米粒子涂层对微处理器传热特性影响的实验研究

在当前情况下，热管理在电子系统设计中起着至关重要的作用。电子元件的温度不应超过制造商指定的温度水平，以保持安全的工作范围和使用寿命。热量积聚的减少肯定会提高系统的部件寿命和可靠性。这项研究工作的目的是分析多壁碳纳米管和石墨烯涂层对个人计算机中使用的微处理器传热能力的影响。在中央处理器的三种不同用途下研究了涂层材料的性能。与未涂层的微处理器相比，多壁碳纳米管涂层和石墨烯涂层微处理器在传热方面表现出更好的增强。与纯基板相比，多壁碳纳米管涂层和石墨烯涂层微处理器实现了 7 和 9 摄氏度的最大发热降低。结果表明，与多壁碳纳米管相比，石墨烯已被证明是有效传热的合适候选者，因为前者与后者相比具有高导热特性。