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Investigation of the mechanical and microstructural evolution of a Cu based bulk metallic glass during ion irradiation
Intermetallics ( IF 4.4 ) Pub Date : 2020-01-01 , DOI: 10.1016/j.intermet.2019.106655
J. Brechtl , S. Agarwal , M.L. Crespillo , J. Salasin , T. Yang , H. Bei , S.J. Zinkle

Abstract Ion irradiation and annealing experiments were performed on Cu60Zr20Hf10Ti10 bulk metallic glass (BMG) specimens to investigate their irradiation- and temperature-induced microstructural and mechanical property evolution. For the ion irradiations, samples were exposed to 9 MeV Ni3+ ions to a midrange (~1.2 μm depth) dose of 10 displacements per atom (dpa) at temperatures ranging from room temperature to 360 °C (the corresponding peak dose at ~2.8 μm depth was ~25 dpa). Bulk X-ray diffraction (XRD) and transmission electron microscopy (TEM) characterization revealed that the alloy did not crystallize during irradiation up to 290 °C but did partially crystallize at 360 °C. XRD analysis revealed that the crystallization which occurred in the sample irradiated at 360 °C was caused by thermal effects instead of irradiation displacement damage. Subsequent Rietveld refinement analysis of the XRD measurements revealed the presence of two distinct crystal phases, namely a CuTiZr hexagonal structure belonging to the P63/mmc space group and a CuTi tetragonal structure belonging to the P4/mmm space group. Nanoindentation experiments revealed that no pronounced hardness changes occurred in the specimens irradiated at room temperature and 290°C, although significant hardening was observed in the sample irradiated at 360 °C. The significant increase in the hardness at 360°C was ascribed to thermally induced partial crystallization of the alloy instead of the ion irradiation. In general, the results of the nanoindentation experiments and XRD characterization suggest that although the Cu BMG exhibits good stability during irradiation at temperatures up to 290 °C it is not suitable for irradiation environments where the temperature is 360 °C for extended periods of time. The Lam and Chong extrapolation method, which has been used to study the indentation size effect (ISE) in amorphous alloys, was employed to quantify how irradiation and temperature affect this type of behavior in the BMG. However, the poor linear fitting of the indentation hardness data by this model indicate that a new ISE model is likely needed to quantify indentation hardening in BMGs.

中文翻译:

离子辐照过程中铜基块状金属玻璃的机械和微观结构演变研究

摘要 对 Cu60Zr20Hf10Ti10 块状金属玻璃 (BMG) 样品进行了离子辐照和退火实验,以研究其辐照和温度诱导的微观结构和机械性能演变。对于离子照射,样品暴露于 9 MeV Ni3+ 离子中,每原子 10 个位移 (dpa) 的中等剂量(~1.2 μm 深度),温度范围从室温到 360 °C(相应的峰值剂量在~2.8 μm深度约为 25 dpa)。体相 X 射线衍射 (XRD) 和透射电子显微镜 (TEM) 表征表明,合金在高达 290 °C 的辐照期间不会结晶,但在 360 °C 时会部分结晶。XRD 分析表明,在 360 °C 辐照下的样品中发生的结晶是由热效应引起的,而不是由辐照位移损伤引起的。随后对 XRD 测量进行的 Rietveld 细化分析揭示了两种不同晶相的存在,即属于 P63/mmc 空间群的 CuTiZr 六方结构和属于 P4/mmm 空间群的 CuTi 四方结构。纳米压痕实验表明,在室温和 290°C 照射下的样品中没有发生明显的硬度变化,尽管在 360°C 下照射的样品中观察到显着的硬化。360°C 硬度的显着增加归因于合金的热诱导部分结晶而不是离子照射。一般来说,纳米压痕实验和 XRD 表征的结果表明,尽管 Cu BMG 在高达 290 °C 的温度下在辐照期间表现出良好的稳定性,但它不适用于温度为 360 °C 的长时间辐照环境。Lam 和 Chong 外推法已用于研究非晶合金中的压痕尺寸效应 (ISE),用于量化辐照和温度如何影响 BMG 中的此类行为。然而,该模型对压痕硬度数据的线性拟合不佳表明可能需要一个新的 ISE 模型来量化 BMG 中的压痕硬化。已用于研究非晶合金中的压痕尺寸效应 (ISE),用于量化辐照和温度如何影响 BMG 中的此类行为。然而,该模型对压痕硬度数据的线性拟合不佳表明可能需要一个新的 ISE 模型来量化 BMG 中的压痕硬化。已用于研究非晶合金中的压痕尺寸效应 (ISE),用于量化辐照和温度如何影响 BMG 中的此类行为。然而,该模型对压痕硬度数据的线性拟合不佳表明可能需要一个新的 ISE 模型来量化 BMG 中的压痕硬化。
更新日期:2020-01-01
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