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Molecular dynamics simulations of ejecta formation in helium-implanted copper
Scripta Materialia ( IF 6 ) Pub Date : 2020-03-01 , DOI: 10.1016/j.scriptamat.2019.11.005
R.M. Flanagan , E.N. Hahn , T.C. Germann , M.A. Meyers , S.J. Fensin

Abstract The effect of He concentration and morphology on ejecta production is investigated via molecular dynamics simulations. Identical He concentrations are inserted into Cu single crystals as interstitial atoms or bubbles near a flat free surface. The resulting ejecta is quantified through total mass, cluster size, and velocity of ejected particles. The presence of He increases total ejected mass as compared to pure Cu; He bubbles produce 56% more mass than atomic He. This increase is attributed to non-planarities in the shock front and reflected pulse due to He bubbles, akin to ejecta resulting from traditional Richtmeyer–Meshkov instabilities.

中文翻译:

氦注入铜中喷射物形成的分子动力学模拟

摘要 通过分子动力学模拟研究了氦浓度和形态对喷射物产生的影响。相同的 He 浓度被插入到 Cu 单晶中,作为间隙原子或靠近平坦自由表面的气泡。产生的喷射物通过喷射粒子的总质量、簇大小和速度进行量化。与纯铜相比,He 的存在增加了总喷射质量;He 气泡产生的质量比原子 He 多 56%。这种增加归因于激​​波前沿和由氦气泡引起的反射脉冲的非平面性,类似于传统的 Richtmeyer-Meshkov 不稳定性导致的喷射物。
更新日期:2020-03-01
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