Semi-aromatic thermosetting polyimide resins containing alicyclic units were prepared by the polymerization of 1,2,4,5- cyclohexanetetrcarboxylic dianhydride (HPMDA), aromatic diamines and nadic anhydride (NA) served as reactive capping agent. To obtain the homogeneous poly (amic ester) (PAE) matrix resins, the 2-methoxyethanol (EGME) was used to esterify HPMDA. The chemical structure of PAE resins dried at different temperatures were characterized in detail by FT-IR, ¹H NMR and TGA-GCMS. Compared with the full-aromatic API-1, the alicyclic units with less Pi(π) bonds and twisted structure endow the semi-aromatic PI resins with loose polymer chains packing and weak intermolecular forces, which contribute to low melt viscosities, good solubility and excellent dielectric properties. The cured semi-aromatic PI resins show low dielectric constants ranging from 2.8 to 3.0 and dielectric loss of <0.01 at a range of frequencies from 1GHz to 12GHz. The results indicate the semi-aromatic thermosetting PI resins are promising dielectric interlayer materials for high frequency substrates.

通过将1,2,4,5-环己烷四羧酸二酐（HPMDA），芳族二胺和纳迪酸酐（NA）用作反应性封端剂进行聚合，可以制备出含脂环族单元的半芳族热固性聚酰亚胺树脂。为了获得均质的聚（酰胺酸酯）（PAE）基体树脂，使用2-甲氧基乙醇（EGME）酯化HPMDA。FT-IR详细描述了在不同温度下干燥的PAE树脂的化学结构，¹1 H NMR和TGA-GCMS。与全芳香族API-1相比，具有更少Pi（π）键和扭曲结构的脂环单元使半芳香族PI树脂具有疏松的聚合物链堆积和弱的分子间作用力，这有助于降低熔体粘度，良好的溶解性和优异的介电性能。固化的半芳族PI树脂在1GHz至12GHz的频率范围内显示出低的介电常数，范围为2.8至3.0，介电损耗<0.01。结果表明，半芳族热固性PI树脂是用于高频基板的有前途的介电中间层材料。