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Microparticle‐Based Soft Electronic Devices: Toward One‐Particle/One‐Pixel
Advanced Functional Materials ( IF 19.0 ) Pub Date : 2019-05-01 , DOI: 10.1002/adfm.201901810
Hyejin Hwang 1 , Unyong Jeong 1
Affiliation  

While microparticle (MP) assemblies have long attracted academic interest, few practical applications of assembled MPs have been achieved because of technological difficulties related to MP synthesis, MP position registration, and the absence of device concepts. The precise positioning of functional MPs in a proper stencil can produce flexible/stretchable electronic devices, even when the MPs themselves are rigid. In recent years, remarkable progress has been made in the programmable position registration of MPs, production of functional MPs, and concepts for MP‐based, pixel‐type electronic devices. This progress report reviews the recent technological advances in MP assembly and discusses the technological challenges preventing the realization of the one‐particle/one‐pixel concept.

中文翻译:

基于微粒的软电子设备:迈向单颗粒/单像素

尽管微粒(MP)组件长期以来一直吸引着学术兴趣,但是由于与MP合成,MP位置配准和缺少设备概念相关的技术难题,所以组装的MP的实际应用很少。即使MP本身是刚性的,在适当的模板中对功能MP的精确定位也可以生产出柔性/可拉伸的电子设备。近年来,在MP的可编程位置注册,功能MP的生产以及基于MP的像素型电子设备的概念方面,已经取得了显着进步。该进展报告回顾了MP组装的最新技术进展,并讨论了阻碍实现单粒子/单像素概念的技术挑战。
更新日期:2020-01-11
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