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Influence of Indium addition on microstructural and mechanical behavior of Sn solder alloys: Experiments and first principles calculations
Acta Materialia ( IF 9.4 ) Pub Date : 2023-03-11 , DOI: 10.1016/j.actamat.2023.118853
Amey Luktuke, Arun Sundar Sundaram Singaravelu, Arun Mannodi-Kanakkithodi, Nikhilesh Chawla

The composition of alloying elements in Sn-rich solder plays a pivotal role in determining the performance of solder joints in an electronic package. Recently, Indium (In) has attracted special attention due to its ability to reduce the melting point and its inherent ductile nature. However, the effect of In addition on pure Sn solder microstructure and mechanical properties is not very well understood. This research investigates the influence of small additions of In (2–10 wt%) to pure Sn solder properties. The combination of characterization techniques such as scanning electron microscopy (SEM), electron backscattered diffraction (EBSD), and wavelength dispersive spectroscopy (WDS) provided unique insights into the microstructure formation of bulk solder as well as interfacial intermetallic (IMC) layer. The mechanisms behind the coarsening of bulk IMCs and grain refinement of microstructure due to In addition were discussed. Unique surface relief features were observed in Sn-10In solder which exhibited a two-phase microstructure (βSn + γ-(Sn, In)). Moreover, these microstructural changes were correlated with mechanical properties determined non-destructively by using nanoindentation. The IMC scallops were indented in as-reflowed condition. Precise locations of IMC scallops were determined using scanning probe microscopy (SPM). To understand the mechanisms behind changes in IMC properties at the atomistic level, first-principles calculations were carried out. The experimental and calculated modulus values of IMCs followed similar trends.



中文翻译:

添加铟对 Sn 焊料合金的微观结构和机械性能的影响:实验和第一性原理计算

富锡焊料中合金元素的组成在决定电子封装焊点性能方面起着关键作用。最近,铟 (In) 因其降低熔点的能力及其固有的延展性而受到特别关注。然而,添加对纯 Sn 焊料微观结构和机械性能的影响还不是很清楚。本研究调查了少量添加 In(2–10 wt%)对纯 Sn 焊料性能的影响。扫描电子显微镜 (SEM)、电子背散射衍射 (EBSD) 和波长色散光谱 (WDS) 等表征技术的结合提供了对块状焊料和界面金属间化合物 (IMC) 层微观结构形成的独特见解。讨论了由于添加导致块状 IMC 粗化和微观结构晶粒细化背后的机制。在具有两相微观结构 (βSn + γ-(Sn, In)) 的 Sn-10In 焊料中观察到独特的表面起伏特征。此外,这些微观结构变化与通过使用纳米压痕非破坏性确定的机械性能相关。IMC 扇贝在回流条件下缩进。使用扫描探针显微镜 (SPM) 确定了 IMC 扇贝的精确位置。为了解原子级 IMC 特性变化背后的机制,进行了第一性原理计算。IMC 的实验和计算模量值遵循相似的趋势。在具有两相微观结构 (βSn + γ-(Sn, In)) 的 Sn-10In 焊料中观察到独特的表面起伏特征。此外,这些微观结构变化与通过使用纳米压痕非破坏性确定的机械性能相关。IMC 扇贝在回流条件下缩进。使用扫描探针显微镜 (SPM) 确定了 IMC 扇贝的精确位置。为了解原子级 IMC 特性变化背后的机制,进行了第一性原理计算。IMC 的实验和计算模量值遵循相似的趋势。在具有两相微观结构 (βSn + γ-(Sn, In)) 的 Sn-10In 焊料中观察到独特的表面起伏特征。此外,这些微观结构变化与通过使用纳米压痕非破坏性确定的机械性能相关。IMC 扇贝在回流条件下缩进。使用扫描探针显微镜 (SPM) 确定了 IMC 扇贝的精确位置。为了解原子级 IMC 特性变化背后的机制,进行了第一性原理计算。IMC 的实验和计算模量值遵循相似的趋势。IMC 扇贝在回流条件下缩进。使用扫描探针显微镜 (SPM) 确定了 IMC 扇贝的精确位置。为了解原子级 IMC 特性变化背后的机制,进行了第一性原理计算。IMC 的实验和计算模量值遵循相似的趋势。IMC 扇贝在回流条件下缩进。使用扫描探针显微镜 (SPM) 确定了 IMC 扇贝的精确位置。为了解原子级 IMC 特性变化背后的机制,进行了第一性原理计算。IMC 的实验和计算模量值遵循相似的趋势。

更新日期:2023-03-16
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