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Ultra-thermostable embedded liquid cooling in SiC 3D packaging power modules of electric vehicles
Energy Conversion and Management ( IF 10.4 ) Pub Date : 2022-11-26 , DOI: 10.1016/j.enconman.2022.116499
Xiaobin Zhang, XiaoLiang Zhao, Wei Li, Zhenyu Wang, Anmou Liao, Yunqian Song, Yun Wang, Lijun Zhang

As the enhanced acceleration performance of electric vehicles demands improved mileage capabilities, 3D packaging is a promising solution for developing high-power-density SiC power modules. However, 3D packaging causes instability owing to the increased heat flux and heat dissipation inside the power module. Thus, this paper proposes an ultra-thermostable embedded liquid cooling strategy for the thermal management of SiC 3D packaging power modules in electric vehicles. We constructed an embedded micro pin–fin (E-MPF) with non-uniform density in the SiC substrate to mount the SiC Schottky barrier diodes (SBDs). The thermostability and temperature uniformity of the SiC 3D packaging power modules containing E-MPF SiC and direct bond copper (DBC) substrates were verified. The results revealed that the SiC SBDs mounted on the E-MPF SiC substrate could stably operate up to a total power dissipation of 320 W at a 100 mL/min coolant (water) flow rate, whereas those attached on the DBC substrate could be operated only under 144 W (operation terminated at a maximum junction temperature of 175 ℃). Furthermore, the junction-to-coolant thermal resistance of the E-MPF SiC substrate could be reduced by 78.89 % compared to that of the DBC substrate. Moreover, the prepared 3D stacking package effectively improved the temperature uniformity of the SiC power modules by 68.69 %. The presented ultra-thermostable E-MPF substrate SiC power module can steadily render a motor torque elevation that is one magnitude greater than that required for sustaining the boiling-free condition on the DBC substrate. This embedded liquid-cooling architecture affords a feasible solution for the thermal management of upcoming high-power electric vehicle SiC inverters.



中文翻译:

电动汽车 SiC 3D 封装功率模块中的超耐热嵌入式液冷

由于电动汽车加速性能的提高需要提高里程能力,因此 3D 封装是开发高功率密度 SiC 功率模块的有前途的解决方案。然而,由于功率模块内部的热通量和散热量增加,3D 封装会导致不稳定。因此,本文提出了一种用于电动汽车 SiC 3D 封装功率模块热管理的超耐热嵌入式液体冷却策略。我们在 SiC 衬底中构建了一个密度不均匀的嵌入式微型针鳍 (E-MPF),以安装 SiC 肖特基势垒二极管 (SBD)。验证了包含 E-MPF SiC 和直接键合铜 (DBC) 基板的 SiC 3D 封装功率模块的热稳定性和温度均匀性。结果表明,安装在 E-MPF SiC 基板上的 SiC SBD 可以在 100 mL/min 冷却剂(水)流速下稳定运行高达 320 W 的总功耗,而安装在 DBC 基板上的 SiC SBD 可以运行仅低于 144 W(运行在最高结温 175 ℃ 时终止)。此外,与 DBC 衬底相比,E-MPF SiC 衬底的结至冷却剂热阻可降低 78.89%。此外,所制备的3D堆叠封装有效提高了SiC功率模块的温度均匀性达68.69%。所提出的超耐热 E-MPF 衬底 SiC 功率模块可以稳定地呈现比在 DBC 衬底上维持无沸腾条件所需的电机扭矩提升大一个数量级。

更新日期:2022-11-26
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