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Three-dimensional network of hexagonal boron nitride filled with polydimethylsiloxane with high thermal conductivity and good insulating properties for thermal management applications
Polymer ( IF 4.6 ) Pub Date : 2022-11-04 , DOI: 10.1016/j.polymer.2022.125440
Li Liu, Ying Li, Xianglei Yu, Jinghong Du, Jiamin Zhang, Junpeng Li, Guoyou Gan

Electronic components tend to fail due to heat accumulation during use. As a result, thermally conductive and insulating polymer-matrix composites (PMCs) are in great demand in the electronics packaging industry. This study proposes a new hard-template approach for the construction of a three-dimensional hexagonal boron nitride foam (3D-BN) using PMMA microspheres as sacrificial materials. The 3D-BN is then filled with polydimethylsiloxane (PDMS) to create 3D-BN/PDMS composites with high thermally conductivities and good insulating properties. The results of various characterization analyses and 3D finite element simulation show that the 3D-BN is the fundamental factor in improving the thermal conductivity (TC) of the composites. Compared with nanoscale h-BN (nBN), micron h-BN (mBN) is more organized along the pore walls in 3D-BN, better utilizing the in-plane TC of h-BN while reducing the interface thermal resistance (ITR). The obtained lightweight composite exhibits a high TC of 1.868 Wm−1K−1 and an ultrahigh volume electrical resistivity of 3.66 × 1013 Ω m at 18.33 vol% mBN loading. This research provides a promising strategy for designing and fabricating thermal management PMCs.



中文翻译:

填充有高导热性和良好绝缘性能的聚二甲基硅氧烷的六方氮化硼三维网络,适用于热管理应用

电子元件在使用过程中容易因热量积聚而失效。因此,电子封装行业对导热绝缘聚合物基复合材料 (PMC) 的需求量很大。本研究提出了一种新的硬模板方法,用于使用 PMMA 微球作为牺牲材料构建三维六方氮化硼泡沫 (3D-BN)。然后用聚二甲基硅氧烷 (PDMS) 填充 3D-BN,以形成具有高导热性和良好绝缘性能的 3D-BN/PDMS 复合材料。各种表征分析和3D有限元模拟的结果表明,3D-BN是提高复合材料热导率(TC)的根本因素。与纳米级 h-BN (nBN) 相比,微米级 h-BN (mBN) 在 3D-BN 中沿孔壁更有组织,更好地利用h-BN的面内TC,同时降低界面热阻(ITR)。获得的轻质复合材料具有 1.868 Wm 的高 TC-1 K -1和 3.66 × 10 13 Ω m的超高体积电阻率 在 18.33 vol% mBN 负载下。这项研究为设计和制造热管理 PMC 提供了一种有前景的策略。

更新日期:2022-11-09
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