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Vertically Integrated Electronics: New Opportunities from Emerging Materials and Devices
Nano-Micro Letters ( IF 26.6 ) Pub Date : 2022-10-07 , DOI: 10.1007/s40820-022-00942-1
Seongjae Kim 1 , Juhyung Seo 1 , Junhwan Choi 2, 3, 4 , Hocheon Yoo 1
Affiliation  

Vertical three-dimensional (3D) integration is a highly attractive strategy to integrate a large number of transistor devices per unit area. This approach has emerged to accommodate the higher demand of data processing capability and to circumvent the scaling limitation. A huge number of research efforts have been attempted to demonstrate vertically stacked electronics in the last two decades. In this review, we revisit materials and devices for the vertically integrated electronics with an emphasis on the emerging semiconductor materials that can be processable by bottom-up fabrication methods, which are suitable for future flexible and wearable electronics. The vertically stacked integrated circuits are reviewed based on the semiconductor materials: organic semiconductors, carbon nanotubes, metal oxide semiconductors, and atomically thin two-dimensional materials including transition metal dichalcogenides. The features, device performance, and fabrication methods for 3D integration of the transistor based on each semiconductor are discussed. Moreover, we highlight recent advances that can be important milestones in the vertically integrated electronics including advanced integrated circuits, sensors, and display systems. There are remaining challenges to overcome; however, we believe that the vertical 3D integration based on emerging semiconductor materials and devices can be a promising strategy for future electronics.



中文翻译:

垂直集成电子:新兴材料和器件的新机遇

垂直三维 (3D) 集成是一种极具吸引力的策略,可以在单位面积上集成大量晶体管器件。这种方法的出现是为了适应对数据处理能力的更高需​​求,并规避缩放限制。在过去的二十年里,已经进行了大量的研究工作来展示垂直堆叠的电子产品。在这篇综述中,我们重新审视了垂直集成电子产品的材料和设备,重点介绍了可以通过自下而上的制造方法进行加工的新兴半导体材料,这些材料适用于未来的柔性和可穿戴电子产品。垂直堆叠集成电路按半导体材料分类:有机半导体、碳纳米管、金属氧化物半导体、原子级薄的二维材料,包括过渡金属二硫化物。讨论了基于每种半导体的晶体管 3D 集成的特性、器件性能和制造方法。此外,我们重点介绍了可能成为垂直集成电子产品(包括高级集成电路、传感器和显示系统)的重要里程碑的最新进展。还有一些挑战需要克服;然而,我们相信基于新兴半导体材料和器件的垂直 3D 集成可能是未来电子产品的一个有前途的战略。我们重点介绍了可能成为垂直集成电子产品(包括高级集成电路、传感器和显示系统)的重要里程碑的最新进展。还有一些挑战需要克服;然而,我们相信基于新兴半导体材料和器件的垂直 3D 集成可能是未来电子产品的一个有前途的战略。我们重点介绍了可能成为垂直集成电子产品(包括高级集成电路、传感器和显示系统)的重要里程碑的最新进展。还有一些挑战需要克服;然而,我们相信基于新兴半导体材料和器件的垂直 3D 集成可能是未来电子产品的一个有前途的战略。

更新日期:2022-10-08
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