当前位置: X-MOL 学术J. Electron. Test. › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
A Review of Various Defects in PCB
Journal of Electronic Testing ( IF 0.9 ) Pub Date : 2022-09-23 , DOI: 10.1007/s10836-022-06026-7
V. Udaya Sankar , Gayathri Lakshmi , Y. Siva Sankar

Printed Circuit Boards (PCBs) are the building blocks for all electronic products. Fabrication of a PCB involves various mechanical and chemical processes. As obtaining accuracy in the mechanical and chemical processes is very difficult, various defects/faults are formed during PCBs fabrication. These fabrication defects lead to performance degradation of electronic products. In this review, we describe various defects present in PCBs under the Through hole and SMD categories. To understand the frequency of occurrence and reason for the occurrence of defects in both manual and machine, PCB fabrication data was collected and analysed from April 2017 to July 2020 as a part of industry collaboration.



中文翻译:

PCB中各种缺陷的回顾

印刷电路板 (PCB) 是所有电子产品的组成部分。PCB的制造涉及各种机械和化学过程。由于在机械和化学过程中获得精度非常困难,因此在 PCB 制造过程中会形成各种缺陷/故障。这些制造缺陷导致电子产品的性能下降。在这篇评论中,我们在通孔和 SMD 类别下描述了 PCB 中存在的各种缺陷。为了了解人工和机器缺陷的发生频率和原因,作为行业合作的一部分,收集并分析了 2017 年 4 月至 2020 年 7 月的 PCB 制造数据。

更新日期:2022-09-25
down
wechat
bug