当前位置:
X-MOL 学术
›
IEEE Des. Test
›
论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
Affordable and Comprehensive Testing of 3-D Stacked Die Devices
IEEE Design & Test ( IF 2 ) Pub Date : 2022-07-14 , DOI: 10.1109/mdat.2022.3191016 Jean-Francois Cote , Jeff Fan , Sean Shen , Givargis Danialy , Marcin Lipinski , Michael Garbers , Wu Yang , Martin Keim , Andreas Glowatz , Joe Reynick , Ayush Patel , Joanna Michna
Editor’s notes: The tooling support from EDA vendors is critical for the embedding of various IEEE standards into the volume production of 3-D chips. In this article, scalable Design-for-Test solutions compatible with IEEE standards are discussed from the industrial EDA perspective. —Hailong Jiao, Peking University
更新日期:2022-07-14
IEEE Design & Test ( IF 2 ) Pub Date : 2022-07-14 , DOI: 10.1109/mdat.2022.3191016 Jean-Francois Cote , Jeff Fan , Sean Shen , Givargis Danialy , Marcin Lipinski , Michael Garbers , Wu Yang , Martin Keim , Andreas Glowatz , Joe Reynick , Ayush Patel , Joanna Michna